Polyhemiaminal (PHA) and polyhexahydrotriazine (PHT) materials are modified by 1,4 conjugate addition chemical reactions to produce a variety of molecular architectures comprising pendant groups and bridging segments. The materials are formed by a method that includes heating a mixture comprising solvent(s), paraformaldehyde, aromatic amine groups, aliphatic amine Michael donors, and Michael acceptors, such as acrylates. The reaction mixtures may be used to prepare polymer pre-impregnated materials and composites containing PHT matrix resin.

This invention provides preparations, compositions, products, and applications of photo-crosslinked hydrogels. Component A—a photosensitive polymer derivative, component B—the photoinitiator, and auxiliary component C—other biocompatible polymer derivative each are respectively dissolved in a biocompatible medium to obtain solution A, solution B, and solution C. The solution A, the solution B, and the optional solution C are mixed homogenously to obtain a hydrogel precursor solution. The hydrogel precursor solution is subject to irradiation of the UV light for photocoupled crosslinking to form a photo-crosslinked hydrogel. The photo-crosslinked hydrogel exhibit rapid speed of photo-curing, strong tissue adhesion, excellent mechanical properties, good biocompatibility, and excellent clinical operability. In addition, this invention also provides a kit for making the photo-crosslinked hydrogel, and applications thereof in tissue engineering, regenerative medicine, 3D printing, and as a carrier of cell, protein, or drug.

A material with significant protection properties from galactic cosmic radiation and solar energetic particles. Hydrogen-rich benzoxazines which are particularly effective for shielding against such radiation. Benzoxazine resin meets the processing requirements for use with ultra-high molecular weight polyethylene fiber as a hydrogen-rich reinforcement: cure of the resin at 120° C. This highly reactive benzoxazine resin also exhibits low viscosity and adequate shelf life.

The current disclosure teaches one to achieve PBI membranes with high ionic conductivity and low mechanical creep for the first time. This is in contrast to previous teachings of PBI membrane fabrication methods, which yield PBIs with either high ionic conductivity and high mechanical creep or low ionic conductivity and low mechanical creep. The membranes produced according to the disclosed process provide doped membranes for applications in fuel cells and electrolysis devices such as electrochemical separation devices.

Provided is a resin composition that is capable of producing a cured product having excellent environmental suitability, high strength, and excellent flame retardancy, and that is suitably usable as a matrix resin for fiber-reinforced plastics. A resin composition contains (A) an epoxy resin, (B) a cyanate resin, (C) an aromatic amine curing agent that is liquid at 25° C., and (D) a phosphorus-containing compound represented by formula (1). Preferably, in formula (1), R.sup.1 and R.sup.2 each independently represent an alkyl group or an aryl group, and X and Y are an oxygen atom.

Various aspects disclosed relate to hybrid nanoparticles embedded in non-magnetic microparticles. These materials can be used to directionally orient and impart an ordered structure to a variety of materials.

A manufacturing method of a continuous transparent polyimide film for a display includes the following steps providing a roll-to-roll polyimide film; providing a polyimide precursor, which is coated on the polyimide film; and baking the polyimide precursor at a baking temperature that is at least 20° C. higher than a glass transition temperature of the transparent polyimide film, such that the transparent polyimide film has an optical transmittance of greater than 85%, a chromaticity (b*) of less than 2, and a standard deviation of three axial refractive indices of the transparent polyimide film is less than 0.0012. Thus, the transparent polyimide film with reduced light leakage can be obtained.

According to one aspect, a glass-free pre-impregnated material includes a polybenzimidazole (PBI) sheet and a partially cured resin encapsulating the PBI sheet. According to another aspect, a process of forming a glass-free pre-impregnated material includes encapsulating a PBI sheet within a resin and partially curing the resin to form the glass-free pre-impregnated material. According to yet another aspect, a printed circuit board comprises a glass-free dielectric layer that includes a PBI sheet encapsulated within a cured resin.

An object is to provide a fiber-reinforced resin that can be welded to another member via a thermoplastic resin and that is less likely to be damaged even when welded at a high temperature, wherein the fiber-reinforced resin includes a reinforcing fiber and has a cured epoxy resin region and a thermoplastic resin region disposed at the surface wherein aromatic rings account for 50% or more and 90% or less of the cured epoxy resin present in the cured epoxy resin region.

A thermal-curable resin composition is provided. The thermal-curable resin composition comprises: (A) a thermal-curable resin component, which comprises: (a1) bismaleimide resin; (a2) cyanate ester resin; and (a3) epoxy resin, wherein the cyanate ester resin (a2) and the epoxy resin (a3) are respectively in an amount ranging from 50 parts by weight to 150 parts by weight and from 24 parts by weight to 51 parts by weight per 100 parts by weight of the bismaleimide resin (a1); and (B) a filler, wherein the filler (B) is in an amount ranging from 40 parts by weight to 55 parts by weight per 100 parts by weight of the dry weight of the resin composition; and wherein the resin composition has a dynamic viscosity of not higher than 800 Pa.Math.s after being brought into a semi-cured state (B-stage), and the resin composition has a dissipation factor (Df) of not higher than 0.006 at 10 GHz after being cured completely.