A method of activating a surface of a plastics substrate formed from: (a) polyaryletherketone such as polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK); (b) a polymer containing a phenyl group directly attached to a carbonyl group, optionally wherein the carbonyl group is part of an amide group, such as polyarylamide (PARA); (c) polyphenylene sulfide (PPS); or (d) polyetherimide (PEI); for subsequent bonding, the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation: includes radiation with wavelength in the range from about 10 nm to about 1000 nm; the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cm.sup.2 to about 300 J/cm.sup.2.

Hard to bond substrates are then more easily subsequently bonded for example using acrylic, epoxy or anaerobic adhesive.

Disclosed are a novel polymer compound containing multiple hydroxyl groups, a method for producing the same, and a complex having a crosslinked structure of the polymer compound. The polymer compound includes a repeating unit represented by a following Chemical Formula 1:

##STR00001## where in the Chemical Formula 1, n denotes an integer of 10 to 10,000.

A cyanate ester resin composition contains: a cyanate ester resin; a curing agent or a curing accelerator; silica microparticles; and core-shell rubber particles; in which the resin composition includes from 1 to 5 parts by mass of the silica microparticles and from 2 to 10 parts by mass of the core-shell rubber particles based on 100 parts by mass of the cyanate ester resin, and a mass ratio of the silica microparticles to the core-shell rubber particles is from 1/1 to 1/5.

Thermal protective materials suitable for use in a spacecraft include a substrate, such as carbon fibers or carbon felt, and cyanate ester resin or phthalonitrile resin, and cross-linkers. These thermal protective materials have a density of about 0.2 to about 0.35 g/cm.sup.3. Methods of making the thermal protective materials include mixing a cyanate ester resin or a phthalonitrile resin and a cross-linker to result in a resin solution, infusing the resin solution into a substrate, and curing the resin to result in the thermal protective material.

The present invention provides a resin composition containing an alkenyl-substituted nadimide and a perinone-based colorant, wherein the content of the perinone-based colorant is 0.8 parts by mass or less based on 100 parts by mass in total of resin-constituting components in the resin composition.

Disclosed is a resin composition, which comprises 30 parts by weight to 90 parts by weight of a maleimide resin and 15 parts by weight to 60 parts by weight of a benzoxazine resin. The resin composition may be fabricated into various articles, such as prepregs, prepregs with copper foil, resin films, resin films with copper foil, laminates or printed circuit boards, which possess at least one, more or all of the following properties: high peel strength, high thermal resistance after moisture absorption, high glass transition temperature, low thermal expansion, high thermal resistance, low dielectric constant, low dissipation factor and so on.

The present invention relates to a halogen-free flame-retardant resin composition, based on the weight parts of organic solids, comprising (A) from 1 to 10 parts by weight of bismaleimide resin, (B) from 30 to 60 parts by weight of benzoxazine resin, (C) from 10 to 40 parts by weight of polyepoxy compound, (D) from 5 to 25 parts by weight of phosphorous-containing flame retardant, and (E) from 1 to 25 parts by weight of curing agent, which is amine curing agent and/or phenolic resin curing agent. The present invention further provides prepregs, laminates, laminates for printed circuits prepared from said resin composition.

A method for producing molecular assemblies of an amphiphilic block polymer includes applying a polymer solution in a layered shape on a planar base member, the polymer solution including an amphiphilic block polymer and a solvent, the amphiphilic block polymer having a hydrophilic block chain including 20 or more sarcosine units and a hydrophobic block chain including 10 or more lactic acid units, forming a polymer film on the planar base member by removing the solvent from a coated layer of the polymer solution, and obtaining molecular assemblies by bringing the polymer film into contact with a water-based liquid. The planar base member is a flexible long film.

An ion exchange polymer is provided. The ion exchange polymer is a reaction product of a reaction between a crosslinker monomer and a cationic monomer. The crosslinker monomer is a reaction product of a reaction between a first crosslinking monomer and a second crosslinking monomer. Further, the cationic monomer comprises a quaternary ammonium group. A method for making an ion exchange polymer is also provided. The method comprises a step of preparing a curable solution and a step of curing the curable solution. The step of preparing the curable solution comprises mixing a pair of crosslinking monomers, a cationic monomer that comprises a quaternary ammonium group and an acid. A membrane is also provided. The membrane comprises the ion exchange polymer made by the method provided.

A curable composition includes specific amounts of a ketone, a curable component, and particulate poly(phenylene ether) having a mean particle size of 3 to 12 micrometers and a particle size relative standard deviation of 20 to 60 percent. The composition has a low viscosity that facilitates wetting of reinforcing structures, and composites formed from the composition and a reinforcing structure cure to form a dielectric material with a low dielectric constant and loss tangent.