Graphene fibers made from a graphene film formed into an elongated fiber-like shape and composite materials made from the graphene fibers. The elongated fiber-like shape may be the graphene film in a rolled spiral orientation or the graphene film in a twisted formation. The graphene film has benzoxazine groups formed on at least an outer surface of the graphene film and epoxide groups formed on at least one edge of the graphene film. Methods of increasing strength of a composite material include combining a resin matrix with a plurality of the graphene fibers to form a prepreg material and curing the prepreg material to form the composite material.

The invention provides a polymerizable composition and a hydrogel obtained or obtainable from the polymerizable composition. The polymerizable composition comprises cucurbituril and a first monomer having a guest for the cucurbituril, wherein the total monomer concentration, C.sub.mon, within the polymerizable composition is at least 0.5 M. The composition may be an aqueous composition.

The present invention aims to provide a polymer having excellent alkali resistance and anion conductivity, a method of producing the polymer, an electrolyte material containing the polymer, and an anion exchange membrane containing the polymer. The present invention relates to a phosphazene bond-containing polymer containing a phosphorus atom constituting a phosphazene bond, the phosphorus atom including a phosphorus atom to which a nitrogen-containing group is bonded, and a nitrogen atom constituting the phosphazene bond, the nitrogen atom including a nitrogen atom to which a hydrocarbon group is bonded.

The thermosetting resin composition, a prepreg containing same, a metal foil-clad laminate and a printed circuit board; the resin composition comprises the following components: a combination of a bismaleimide resin and a benzoxazine resin or a prepolymer of a bismaleimide resin and a benzoxazine resin, an epoxy resin and an active ester. A metal foil-clad laminate prepared by using the resin composition provided by the present invention has a high glass transition temperature, a low thermal expansion coefficient, a high high-temperature modulus, a high peel strength, a low dielectric constant, a low dielectric loss factor, as well as good heat resistance and good processability.

According to one aspect, a glass-free pre-impregnated material includes a polybenzimidazole (PBI) sheet and a partially cured resin encapsulating the PBI sheet. According to another aspect, a process of forming a glass-free pre-impregnated material includes encapsulating a PBI sheet within a resin and partially curing the resin to form the glass-free pre-impregnated material. According to yet another aspect, a printed circuit board comprises a glass-free dielectric layer that includes a PBI sheet encapsulated within a cured resin.

Compositions and methods for a melt processable semicrystalline poly(aryl ether ketone) incorporating phthalazinone and 4,4-biphenol as comonomer units are described herein. The polymers are resistant to and insoluble in common organic solvents and liquids as well as in aggressive organic solvents such as chloroform and chlorinated liquids. The polymers are melt processable via techniques such as extrusion, injection molding, and compression molding. The semicrystalline poly(aryl ether ketone) containing phthalazinone comonomer units have properties which make them suitable for manufacturing high temperature resistant molded systems and other articles.

A structured organic film (SOF) is disclosed. The structured organic film also includes a plurality of segments, a plurality of linkers, and a plurality of ionic capping segments, where at least one or more of the ionic capping segments may include a piperidinium group. Implementations of the structured organic film (SOF) may include where the piperidinium group is a bicyclic piperidinium group. The piperidinium group can be an n-cyclic quaternary ammonium. A total concentration of ionic segments in the SOF is from about 0.1 to about 5.0 molar equivalents based on a total concentration of segments in the SOF. The piperidinium group can be 3-methanol-6-azoniaspiro[5.5]undecane (MeASU). The structured organic film (SOF) has an ion exchange capacity (IEC) of from about 0.25 meq/g to about 5.00 meq/g. An ion-exchange membrane may include the structured organic film (SOF).

In an embodiment, a polymeric material includes a plurality of hemiaminal units bonded together by a first linkage and a second linkage, wherein the first linkage is thermally stable and resistant to bases and the second linkage is thermally degradable and degradable by a base. In another embodiment, a method of forming nanoporous materials includes forming a polymer network with a chemically removable portion. The chemically removable portion may be polycarbonate polymer that is removable on application of heat or exposure to a base, or a polyhexahydrotriazine (PHT) or polyhemiaminal (PHA) polymer that is removable on exposure to an acid. Removing any portion of the polymer results in formation of nanoscopic pores as polymer chains are decomposed, leaving pores in the polymer matrix.

A thermosetting resin composition and a prepreg and a laminated board prepared therefrom. The thermosetting resin composition contains the following components in parts by weight: 50-150 parts of a cyanate; 30-100 parts of an epoxy resin; 5-70 parts of styrene-maleic anhydride; 20-100 parts of a polyphenyl ether; 30-100 parts of a halogen-free flame retardant; 0.05-5 parts of a curing accelerator; and 50-200 parts of a filler. The prepreg and laminated board prepared from the thermosetting resin composition have comprehensive performances such as a low dielectric constant, a low dielectric loss, an excellent flame retardance, heat resistance and moisture resistance, etc., and are suitable for use in a halogen-free high-frequency multilayer circuit board.

Certain embodiments are directed to cyanate resin blends comprising, for example, a mixture of a cyanate monomer and a cyanate oligomer. The resin blends are effective to provide a dielectric constant of less than 2.7, a glass transition temperature of at least 150 C. and a moisture absorption of less than 1.5%. Radomes using the resin are also described.