Patent classifications
C08J2381/04
PRIMER-EQUIPPED THERMOPLASTIC RESIN MEMBER, AND RESIN-RESIN CONJUGATE
A primer-attached thermoplastic resin material having a thermoplastic resin material and one or plural primer layers laminated on the thermoplastic resin material, wherein at least one layer of the primer layers is an in-situ polymerizable composition layer of an in-situ polymerizable composition polymerized on the thermoplastic resin material.
Sintered Polymeric Particles For Porous Structures
Disclosed are porous elements that include sintered polymeric particles. The polymeric particles can be formed of a thermoplastic composition that includes a polyarylene sulfide. The polymeric particles sintered to form the porous elements have a very narrow size distribution. The porous elements can maintain their functionality and morphology even when utilized in high temperature applications.
POLYARYLENE SULFIDE RESIN COMPOSITION, MOLDED BODY OF SAME, METHOD FOR PRODUCING POLYARYLENE SULFIDE RESIN COMPOSITION, AND METHOD FOR PRODUCING MOLDED BODY
Provided are a polyarylene sulfide resin composition which is a raw material for a molded body having excellent thermal shock properties and for a molded body having excellent mechanical strength at a weld portion and excellent flexural toughness in the TD direction, a molded body of the polyarylene sulfide resin composition, a method for producing the polyarylene sulfide resin composition, and a method for producing the molded body. More specifically, provided are a polyarylene sulfide resin composition containing a polyarylene sulfide resin (A), an olefin polymer (B), zeolite (C), glass fibers (D1), and glass flakes (D2), wherein the glass flakes (D2) have a weight average particle diameter in the range of 100 μm or less, a molded body, and a method for producing the same.
Methods and compositions for curing a surface of an uncured polysulfide rubber
Disclosed are compositions comprising a liquid carrier, a polysulfide rubber curing agent, a metal cation, and an ionic liquid. Also disclosed are methods for curing a surface of an uncured polysulfide rubber. These methods involve applying the disclosed compositions to the surface of the uncured polysulfide rubber.
Poly(phenylene sulfide) resin composition, production method therefor, and molded article
A polyphenylene sulfide resin composition includes (A) 100 parts by weight of an acid-treated polyphenylene sulfide resin, (B) 10 to 100 parts by weight of a glass fiber, and (C) 0.1 to 10 parts by weight of an amino group-containing alkoxysilane compound, wherein the polyphenylene sulfide resin composition has an exothermic peak temperature (Tmc) of 195° C. to 225° C., the exothermic peak temperature being observed during a crystallization caused when the polyphenylene sulfide resin composition is melted by heating to 340° C. and then cooled at a rate of 20° C./minute, using a differential scanning calorimeter.
Polyphenylene sulfide resin composition, method of producing same, and molded article
A polyphenylene sulfide resin composition includes a polyphenylene sulfide resin (A); an aromatic vinyl compound block copolymer (B) containing at least one functional group selected from the group consisting of a carboxyl group, an acid anhydride group, a hydroxyl group, an amino group, an epoxy group and an isocyanate group; and an alkoxysilane compound (C) containing at least one functional group selected from the group consisting of an epoxy group, an amino group and an isocyanate group; wherein a phase structure of the polyphenylene sulfide resin composition is a sea-island structure in which the polyphenylene sulfide resin (A) forms a sea phase, and the aromatic vinyl compound block copolymer (B) forms an island phase dispersed in a number average dispersed particle size of 1,000 nm or less.
RESIN MOLDING MATERIAL, METHOD FOR PRODUCING SAME, AND METHOD FOR PRODUCING RESIN MEMBER OR THE LIKE
Provided are a resin molding material, a method for producing same, and a method for producing resin member or the like, said resin molding material being a resin molding material which is capable of reducing a loss of ultraviolet absorber, resulting in less contamination in facilities, minimizing the impact of harmful lights by efficiently absorbing harmful lights in the wavelength region of 380 to 400 nm (to 420 nm), and suppressing the absorption of lights having a wavelength of not shorter than 400 nm (420 nm) which is a primary cause of early-stage yellowing to thereby produce a member having a superior appearance since the ultraviolet absorber is less prone to be sublimed during hot-melt compounding (first/second processing) that requires a high-temperature processing, or during other heat processing. The resin molding material is used in heat processing and comprises a resin and a 2-phenylbenzotriazole derivative that contains a thioether-containing group.
CLICK CHEMISTRY FOR SEALANTS AND ADHESIVES
The invention described herein generally pertains to a composition that includes a silyl-terminated polymer having silyl groups linked to a polymer backbone via triazole. The silyl-terminated polymer is a reaction product of a functionalized polymer backbone and a functionalized silane. The polymer backbone includes a first functional group, which may be one of an azide or an alkyne. The functionalized silane includes a second functional group may also be one of an azide or an alkyne, but is also different from the first functional group. The functionalized polymer backbone is reacted with the functionalized silane in the presence of a metal catalyst.
ACTIVATING SURFACES FOR SUBSEQUENT BONDING
A method of activating a surface of a plastics substrate formed from: (a) polyaryletherketone such as polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK); (b) a polymer containing a phenyl group directly attached to a carbonyl group, for example polybutadiene terephthalate (PBT) optionally wherein the carbonyl group is part of an amide group, such as polyarylamide (PARA); (c) polyphenylene sulfide (PPS); or (d) polyetherimide (PEI); for subsequent bonding,
the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation: includes radiation with wavelength in the range from about 10 nm to about 1000 nm; the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cm.sup.2 to about 300 J/cm.sup.2.
Hard to bond substrates are then more easily subsequently bonded for example using acrylic, epoxy or anaerobic adhesive.
Click chemistry for sealants and adhesives
The invention described herein generally pertains to a composition that includes a silyl-terminated polymer having silyl groups linked to a polymer backbone via triazole. The silyl-terminated polymer is a reaction product of a functionalized polymer backbone and a functionalized silane. The polymer backbone includes a first functional group, which may be one of an azide or an alkyne. The functionalized silane includes a second functional group may also be one of an azide or an alkyne, but is also different from the first functional group. The functionalized polymer backbone is reacted with the functionalized silane in the presence of a metal catalyst.