Provided are: an epoxy resin composition having exceptional performance with regard to impregnating reinforcing fibers, enabling optimal control of resin flow during molding, and having exceptional in-plane shear strength; a cured epoxy resin product; and a prepreg. An epoxy resin composition comprising at least the following constituent elements [A], [B], and [C]: [A] an epoxy resin, [B] a polyether sulfone having a weight-average molecular weight of 2000-20000 g/mol, [C] a curing agent

Process for producing polyarylene ether beads from a polyarylene ether solution, comprising the steps of i) dividing the polyarylene ether solution into droplets, ii) transferring the droplets into a precipitation bath to form polyarylene ether beads in the precipitation bath which (A) comprises at least one aprotic solvent (component (1)) and at least one protic solvent (component (2)), (B) has a temperature of 0° C. to T.sub.c, where the critical temperature T.sub.c in [° C.] can be determined by the numerical equation T.sub.c=(77−c)/0.58 in which c is the concentration of component (1) in the precipitation bath in [% by weight] and (C) has component (1) in concentrations of 5% by weight to c.sub.c, where the critical concentration c.sub.c in [% by weight] can be determined by the numerical equation c.sub.c=77−0.58*T in which T is the temperature in the precipitation bath in [° C.], where
the percentages by weight are each based on the sum of the percentages by weight of component (1) and of component (2) in the precipitation bath.

The invention pertains to a polymer composition possessing improved resistance towards degradation and discolouring phenomena induced by UV radiation, said composition comprising at least one aromatic sulfone polymer; at least one organic UV absorber and at least one basic compound selected from the group consisting of (i) basic oxides and hydroxides of divalent metals and (ii) salts of a weak acid, and to methods for its manufacture and to shaped articles obtained therefrom.

A system, methods, and chemical compositions for removing a support structure material from a printed material during 3D printing are described. The printing material may include polyetherimide or polyetherimide alloy. The support structure material may include polysulfone or polyethersulfone. A solvent for dissolving the support structure material may include one or more of N-propyl bromide, 1,2 butylene oxide, and N-methyl-2-pyrrolidone.

A polyarylene ether sulfone contains endgroups of formula (I),

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A molding composition contains the polyarylene ether sulfone; and a fiber, film, or shaped article can be produced using the molding composition.

Polyphenylene sulfide microparticles have a linseed oil absorption amount of 40 to 1,000 mL/100 g and a number average particle diameter of 1 to 200 μm. The porous PPS microparticles have a large specific surface area and therefore promote fusion of particles when molded into various molded bodies by applying thermal energy, thus enabling formation or molding of a coating layer of particles at a lower temperature in a shorter time. The porous PPS microparticles have a porous shape and therefore enable scattering light in multiple directions and suppression of specific reflection of reflected light in a specific direction, thus making it possible to impart shading effect and matte effect when added to a medium.

Process for making a membrane M comprising the following steps: a) preparing a copolymer C, wherein said copolymer C comprises blocks of at least one polyarylene ether A and blocks of polyalkylene oxide PAO, wherein the content of polyethyleneoxide in copolymer C is 30 to 90% by weight and wherein copolymer C is prepared in a solvent L to yield solution S; b) providing a dope solution D comprising at least one polymer P; c) mixing solution S and dope solution D; d) preparing a membrane by bringing the mixture of solution S and dope solution D into contact with at least one coagulating agent.

The present invention relates to a composition for a moisture permeation preventing film for an electronic device, a method for forming a moisture permeation preventing film for an electronic device using the same, and an electronic device. The present invention can provide: a composition for a moisture permeation preventing film for an electronic device, the composition containing 1-10 wt % of an aerogel, 10-50 wt % of a solvent, 0.1-5 wt % of an additive, and the remainder binder; a method for forming a moisture permeation preventing film for an electronic device using the same; and an electronic device.

A polysulfone membrane is modified so that monomers are wafted onto the surface of the membrane. The polysulfone membranes can be grafted by contacting the membrane with a grafting solution and exposing the membrane to electromagnetic radiation, typically within the ultraviolet portion of the spectrum. The monomers that are grafted are typically anionic or cationic. The grafted membranes can be used for filtering impurities, such as positively and negatively charged particles, from a liquid. Anionic membranes provide improved filtration of negatively charged impurities, while cationic membranes provide improved filtration of positively charged impurities.

Described herein are molecular inks, methods for printing the molecular inks on flexible substrates, and methods for forming printed electronic elements, such as resistive heaters, force sensors, motion sensors, and devices that include these elements, such as force responsive conductive heaters. The methods include printing a molecular ink on a flexible substrate that is heated to 30° C. to 90° C. before and/or during the printing process and curing the substrate to produce a conductive pattern thereon. The molecular inks generally include a particle-fee metal-complex composition formulated from at least one metal complex and a solvent, and optionally, a conductive filler material, and/or surfactant.