The present disclosure relates to a manufacturing process of a silicone glove, the silicon glove is divided into a liner, a glove blank and a silicon layer from the inside to the outside, and liquid silicon is sprayed on a surface of the glove blank for once; when spraying the liquid silicon, the glove blank also rotates around its axis while horizontally moving on an assembly line; during spraying, a liquid silicon outflow channel at least includes a finger gap spraying port and a tiger mouth spraying port that are arranged fixedly; an arranging length of the finger gap spraying port is greater than or equal to a length of a finger area of the glove blank; an arranging length of the tiger mouth spraying port is greater than or equal to a length of a tiger mouth area of the glove blank.

An embodiment of the inventive concept provides a method of manufacturing a polymer film, the method including: preparing a first copolymer containing a first functional group; preparing a second copolymer containing a second functional group; preparing a first compound containing a third functional group; and performing a cross-linking reaction by mixing the first copolymer, the second copolymer, and the first compound, wherein the cross-linking reaction includes a reaction of the first functional group and the second functional group and a reaction of the second functional group and the third functional group, the first compound includes a polar group and any one group selected from among a vinyl group, an aryl group, and an acrylate group, and the third functional group has reactivity with respect to the second functional group, but does not have reactivity with respect to the first functional group.

A composite material according to the present invention includes a solid portion including inorganic particles and a resin. The composite material has a porous structure including a plurality of voids surrounded by the solid portion. The composite material satisfies (i) and/or (ii). (i) P.sub.2 is 500 or more. (ii) The composite material has a heat conductivity of 0.5 W/(m.Math.K) or more and a thickness of 0.5 mm to 2.5 mm, the void have an average diameter of 50 μm to 1500 μm, and P.sub.3 is 70% to 90%. P.sub.2=the heat conductivity [W/(m.Math.K)] of the composite material×P.sub.3×100/an amount [volume %] of the inorganic particles P.sub.3 [%]=(F.sub.0−F.sub.1)×100/F.sub.0

A composite material according to the present invention includes a solid portion including inorganic particles and a resin. The composite material has a porous structure including a plurality of voids surrounded by the solid portion. The composite material has a heat conductivity of 0.5 W/(m.Math.K) or more and a spring constant of 100 N/m to 70,000 N/m. The heat conductivity is a value measured for one test specimen in a symmetric configuration according to an American Society for Testing and Materials (ASTM) standard D5470-01.

Disclosed are embodiments of polymer compositions and systems that contain antimicrobial and wavelength-shifting metal nanoparticles. The polymer compositions containing metal nanoparticles protect exposed materials from UV radiation. The polymer compositions containing metal nanoparticles down convert incoming UV light to light that may have a longer wavelength. Unexpectedly, by selecting at least two differently configured nanoparticle components (e.g., different in size, shape, or both), each with specific particle size distribution, it is possible to effectively protect an area from damage resulting from exposure to UV radiation. In addition, spherical silver nanoparticles do not cause bacteria to become resistant as do convention silver nanoparticles made by chemical synthesis.

A method of forming an polymer composites is disclosed herein that includes infiltrating CNT sponges with a polymer or metal to form a composite. The method uses a relatively easy, scalable, and low-cost synthesis process that makes the composites attractive as TIM. CNTs in the sponge structure are covalently bonded, resulting in a low Young's modulus while at the same time maintaining a good thermal conductivity. This strategy makes it possible to obtain both high deformability and high thermal conductivity, which are difficult to have simultaneously due to their adverse correlation.

A bioelectrode includes a conductive rubber electrode and a silver coating layer provided on the conductive rubber electrode and containing a silicone rubber and silver particles. The silver coating layer contains a modified silicone and contains ions for ion conduction among the silver particles.

A bioelectrode includes a conductive rubber electrode and a silver coating layer provided on the conductive rubber electrode and containing a silicone rubber and silver particles. The silver coating layer further contains a modified silicone.

A thermally conductive resin composition capable of maintaining high thermal conductivity and a thermally conductive sheet using the same. A thermally conductive resin composition contains: an addition reaction type silicone resin; a hindered phenol-based antioxidant; a thiol-based antioxidant; a dispersant having a hydrophilic functional group and a silicone chain; and a thermally conductive filler, wherein the thermally conductive resin composition contains 65 to 90% by volume of the thermally conductive filler.

An insulating filler composed of a mixed powder in which a hydrophobic fumed oxide powder having an average primary particle size D.sub.1, which is smaller than an average primary particle size D.sub.2, is adhered to the surface of a magnesium oxide powder and/or a nitride-based inorganic powder having the average primary particle size D.sub.2, wherein: the ratio D.sub.1/D.sub.2 of the average primary particle size D.sub.1 to the average primary particle size D.sub.2 is 6×10.sup.−5 to 3×10.sup.−3; the volume resistivity of the mixed powder is 1×10.sup.11 Ω.Math.m or more; and the content ratio of the hydrophobic fumed oxide powder in the mixed powder is 5-30 mass %. Also provided is an insulating material in which the above-mentioned insulating filler is contained in a resin molded body.