Provided is a barrier film, comprising: a base layer; and an inorganic layer including Si, N, and O, wherein the inorganic layer has a thickness of 600 nm or less, and the film has a water vapor transmission rate of 0.5?10.sup.?3 g/m.sup.2.Math.day as measured under conditions of a temperature of 38? C. and 100% relative humidity. The barrier film has excellent barrier properties and optical properties and can be used for electronic products sensitive to moisture.

[Problem] To provide a composition for forming a coating layer having excellent gas barrier performance and a method of forming the coating layer. [Means for Solution] A composition for forming a coating film comprising a specific silicon compound which reacts with a polysilazane by exposure, a polysilazane and an organic solvent, and a method for forming a coating layer comprising coating the composition on a substrate and exposing.

A silicon-containing resin composition with which it is possible to form a silica-based coating film in which generation of cracks is minimized, a method for forming a silica-based coating film using the silicon-containing resin composition, and a crack-free silica-based coating film formed using the silicon-containing resin composition. The silicon-containing resin composition includes a silicon-containing resin and a solvent, in which one or more of siloxane resins and polysilanes is used as the silicon-containing resin, and the solvent contains a cycloalkyl acetate having a specific structure.

A hybrid material for light emitting diodes, comprising a) an organopolysilazane material, comprising repeating units of formulae (I) and (II)
[SiR.sup.1R.sup.2NR.sup.3].sub.x(I)
[SiHR.sup.4NR.sup.5].sub.y(II)
wherein the symbols and indices have the following meanings: R.sup.1 is C.sub.2-C.sub.6-alkenyl or C.sub.4-C.sub.6-alkadienyl; R.sup.2 is H or an organic group; R.sup.3 is H or an organic group; R.sup.4 is H or an organic group; R.sup.5 is H or an organic group; x is 0.001 to 0.2; and y is 2x to (1x), with the proviso that x+y1 and that y can be 0 if R.sup.2 is H, and b) inorganic nanoparticles having a mean diameter in the range of from 1 to 30 nm, which are surface modified with a capping agent comprising a C.sub.1-C.sub.18-alkyl and/or C.sub.1-C.sub.18-alkenyl group,
is useful as encapsulation material for LEDs.

Described is a doping technique that forms a stable amorphous silicon film and a stable polycrystalline silicon film at a low temperature and simultaneously that imparts conductivity in an atmospheric pressure environment. A method for producing a compound containing a bond between different elements belonging to Group 4 to Group 15 of the periodic table, the method including: applying, at a low frequency and atmospheric pressure, high voltage to an inside of an electric discharge tube obtained by attaching high-voltage electrodes to a metal tube or an insulator tube or between flat plate electrodes while passing an introduction gas, so as to convert molecules present in the electric discharge tube or between the flat plate electrodes into a plasma; and applying the plasma to substances to be irradiated, the substances to be irradiated being two or more elementary substances or compounds.

The invention relates to the use of specific organopolysilazanes as an encapsulation material for light emitting diodes (LED). The organopolysilazane polymers act as insulating filling materials and are stable over temperature and over exposure to ambient UV radiation. The encapsulating material has good thermal stability against discoloration to yellow by aging even at high temperatures which is a key factor for the long lifetime of an LED encapsulant and the LED performance.

Polymer-derived ceramic composites are described herein. The composites are formed using hexagonal boron nitride nanosheet-functionalized silicon-based ceramic precursor polymers. The composites a matrix of a polymer-derived ceramic and hexagonal boron nitride nanosheets embedded therein. Silicon-derived ceramic precursors such as polysilazane and/or polysiloxane are used to create improved SiCN and/or SiOC ceramic composites.

Provided is an antifouling sheet having an interlayer (X) containing a (poly)silazane compound and having an antifouling layer (Y) layered on the surface of the interlayer (X), wherein the layer (Y) is formed of an antifouling layer-forming composition containing a specific tetrafunctional silane compound (A) and a specific trifunctional silane compound (B), the content of the component (B) in the antifouling layer-forming composition is 8 to 90 mol % relative to 100 mol % of the component (A). The antifouling sheet is provided with an antifouling layer having good surface state and curability, has a large slip acceleration for water droplets, thereby having excellent water repellency that makes water droplets slip off instantly, and has excellent interlayer adhesiveness.

The present invention is a gas barrier laminate comprising a base unit that comprises a base and a modification-promoting layer, and a gas barrier layer that is formed on a side of the modification-promoting layer with respect to the base unit, the modification-promoting layer having a modulus of elasticity at 23 C. of less than 30 GPa, the base unit having a water vapor transmission rate at a temperature of 40 C. and a relative humidity of 90% of 1.0 g/(m.sup.2.Math.day) or less, and the gas barrier layer being a layer formed by applying a modification treatment to a surface of a layer that comprises a polysilazane-based compound and is formed on the side of the modification-promoting layer with respect to the base unit, and a method for producing the gas barrier laminat, and an electronic device member comprising the gas barrier laminate, and an electronic device comprising the electronic device member.

Disclosed herein are methods of curing silicon carbide precursor polymer fibers, such as polysilazanes, using moisture and free radical generators, such as peroxides. Also disclosed are methods of forming, curing, and using silicon carbide precursor polymers that contain alkenyl groups and free radical generators, such as peroxides.