A conductive resin composition including 100 parts by weight of a base resin (A), which includes a polyester, a polyarylene ether, and an aromatic elastomer; 3 to 12 parts by weight of two or more polyfunctional reaction agents (B); 0.1 to 3 parts by weight of carbon nanotubes (C); 0.1 to 5 parts by weight of carbon nanoplates (D); and 1 to 10 parts by weight of glass powder (E), a method of preparing the conductive resin composition, and a molded article including the conductive resin composition. The conductive resin composition has excellent moisture stability and heat resistance in addition to excellent appearance, rigidity, and conductivity; can minimize the influence of moisture and heat when exposed to external environments; and thus, can be used in exterior parts to replace metal parts used in automobiles.

A thermoplastic resin composition and a molded article formed of the same. The thermoplastic resin composition includes: about 100 parts by weight of a polycarbonate resin; about 5 to about 20 parts by weight of a rubber modified aromatic vinyl copolymer resin; about 0.5 to about 3 parts by weight of a maleic anhydride-grafted rubber polymer; about 50 to about 100 parts by weight of glass fibers; about 10 to about 30 parts by weight of barium sulfate; and about 5 to about 20 parts by weight of a phosphorus flame retardant. The thermoplastic resin composition can have high specific gravity and good properties in terms of impact resistance, weather resistance, flame retardancy, fluidity, and the like.

A one-component thermosetting epoxy resin composition includes at least one epoxy resin A having on average more than one epoxide group per molecule, at least one latent hardener B for epoxy resins, at least one impact modifier D, at least one physical or chemical blowing agent E and fibrous anhydrous magnesium oxysulfate MOS. Thermally expandable epoxy resin compositions have improved adhesion, especially on metal substrates.

A foamed polymeric insulation product comprises a polymeric foam formed from a foamable polymer composition comprising: a) a thermoplastic matrix polymer composition, and b) a blowing agent composition. A barrier coating is formed on at least one of the first major surface and the second major surface, the barrier coating being formed from a barrier coating composition comprising a dispersion of at least one polymer comprising at least one polymer selected from polyvinylidene dichloride (PVDC), polyvinylidene fluoride (PVDF), polyvinyl chloride (PVC), polyvinyl alcohol, ethylene vinyl alcohol, polyurethane, styrene butadiene (SBR), and combinations or copolymers thereof; and a viscosity modifier.

The present disclosure relates to a thermosetting resin composition for a semiconductor package including a modified phenylene ether oligomer or a modified poly(phenylene ether) having ethylenically unsaturated groups at both ends thereof; a thermosetting resin; a predetermined elastic (co)polymer; and an inorganic filler, and a prepreg and a metal clad laminate including the same.

Provided is a thin film-shaped fiber-reinforced resin that can sufficiently increase the impact resistance of a coated resin molded body while suppressing the reduction in bending elastic modulus of the resin molded body. The thin film-shaped fiber-reinforced resin includes a plurality of reinforcing fibers that are arranged in a single direction alignment, and a matrix resin with which the reinforcing fibers are impregnated. The matrix resin includes a thermoplastic plastic and a thermoplastic elastomer. The content of the thermoplastic elastomer with respect to the total of the thermoplastic plastic mass and the thermoplastic elastomer mass is 5-40 mass %.

A resin composition includes 20 parts by weight to 45 parts by weight of a phosphorus-containing bismaleimide and 100 parts by weight of a thermosetting resin, wherein the phosphorus-containing bismaleimide has a structure of Formula (I); the thermosetting resin is selected from a vinyl-containing polyphenylene ether resin, a maleimide resin, a polyolefin resin, a prepolymer of maleimide resin, and a combination thereof. The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including flame retardancy, outgassing properties, arc resistance, copper foil peeling strength, X-axis coefficient of thermal expansion, glass transition temperature and water absorption rate.

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A polymer composition may include a polymer produced from ethylene, one or more branched vinyl ester monomers, optionally vinyl acetate (VA), and a thermoplastic polyurethane (TPU). A method of preparing a polymer composition may include blending a thermoplastic polyurethane (TPU) and an ethylene based polymer produced from ethylene, one or more branched vinyl ester monomers, and optionally vinyl acetate (VA); and to form a blended mixture; and extruding the blended mixture to form the polymer composition

A resin composition and uses of the same are provided. The resin composition includes the following components: (A) a cross-linking agent of the following formula (I):

##STR00001## (B) a polyphenylene ether resin, wherein the terminal ends of the polyphenylene ether resin are independently modified by a substituent with a carbon-carbon double bond; and (C) a catalyst, wherein, X in formula (I) is a C.sub.1 to C.sub.10 straight or branched alkylene, and the weight ratio of the polyphenylene ether resin (B) to the cross-linking agent (A) ranges from 0.5 to 5.

A rubber composition manufacturing method comprises an operation in which at least rubber, silica, and silane coupling agent are kneaded in an internal kneader at not less than a temperature lower limit for a coupling reaction between the silica and the silane coupling agent to proceed. For at least a portion of time during which that operation is being carried out, a compressed gas is delivered to the kneading chamber while the ram is in a nonpressing state.