There is an expandable vinyl aromatic polymer composition with improved mechanical and insulating properties that includes: a) 60% to 96% by weight of a vinyl aromatic polymer (a); b) 3% to 10% by weight of an expansion agent (b); and c) 1% to 30% by weight of a vinyl aromatic copolymer (c) containing from 1% to 10% by weight of a rubbery component as a dispersed phase,
with the condition that the sum of (a), (b) and (c) is 100% by weight together with the process for its preparation and corresponding use and manufactured goods obtainable from that composition.

The present disclosure relates to a thermosetting resin composition for a semiconductor package including a modified phenylene ether oligomer or a modified poly(phenylene ether) having ethylenically unsaturated groups at both ends thereof; a thermosetting resin; a predetermined elastic (co)polymer; and an inorganic filler, and a prepreg and a metal clad laminate including the same.

The present invention provides a cushion partially or entirely composed of a foam, the foam composed of a polymer composition that includes a homopolymer or a copolymer including a constituent unit derived from farnesene.

A composite material comprising at least one polymer matrix. The polymer matrix comprises at least one inorganic load composed of a biphasic material that comprises at least one mesoporous substrate at least partially coated with carbon nanotubes. The composite material is remarkable in that the mesoporous substrate is composed of diatoms.

A sulfur-crosslinked rubber mixture for vehicle tires including carbon nanotubes (CNT), to a vehicle tire comprising the sulfur-crosslinked rubber mixture and to a process for producing the sulfur-crosslinked rubber mixture comprising CNT. The sulfur-crosslinked rubber mixture according to the invention is characterized in that the CNT are predispersed in at least one polyisoprene. The vehicle tire according to the invention preferably comprises the sulfur-crosslinked rubber mixture in the tread and/or a sidewall and/or a conductivity track.

Crumb rubber obtained from recycled tires is subjected to an interlinked substitution process. The process utilizes a reactive component that interferes with sulfur bonds. The resulting treated rubber exhibits properties similar to those of the virgin composite rubber structure prior to being granulated, and is suitable for use in fabricating new tires, engineered rubber articles, and asphalt rubber for use in waterproofing and paving applications.

The invention relates to a process for recycling used rubber product, such as tires and/or other rubber products, containing the step of treating the rubber grind obtained by grinding the used rubber products, in the presence of a weak base and butadiene/styrene copolymer as well one or more additives to a shear stress of at least 15 to 25 MPa. The invention relates furthermore to re-vulcanizable re-rubber blend obtained by the process according to the invention and also to the tires and other rubber products obtained by vulcanizing thereof.

A complex structure material includes a foam made of thermosetting resin and coverings made of thermoplastic resin. The foam includes a matrix and pores. At least some of the pores communicate with each other. The foam has a continuous porous structure formed by the matrix and the pores. The coverings cover inner walls of the pores in the foam.

Thermosetting resin composition, prepreg and metal foil clad laminate made therefrom. The thermosetting resin composition comprises (A): a solvent-soluble multifunctional vinyl aromatic copolymer, wherein same is a multifunctional vinyl aromatic copolymer having structural units from monomers comprising a divinyl aromatic compound (a) and ethyl vinyl aromatic compound (b); and (B), wherein same is selected from olefin resins having a number-average molecular weight of 500-10,000 and containing 10%-50% by weight of a styrene structure, and the molecules thereof contain a 1,2-addition butadiene structure. The prepreg and copper foil clad laminate made from the thermosetting resin composition of the present invention have a good toughness, and maintain a high glass transition temperature, a low water absorption, excellent dielectric properties and damp heat resistance thereof, and are suitable for use in the field of high frequency and high speed printed circuit boards, and are also suitable for processing multilayer printed circuit boards.

The present invention relates to a resin composition including a binder resin and an organic-inorganic composite filler, a prepreg including the same, a laminated plate including the same, and a resin-coated metal foil including the same.