Disclosed are a copolymer, porous membranes made from the copolymer, and a method of treating fluids using the porous membranes to remove metal ions, for example, from fluids originating in the microelectronics industry, wherein the copolymer includes polymerized monomeric units I and II, wherein monomeric unit I is of the formula A-XCH.sub.2B, wherein A is Rf(CH.sub.2)n, Rf is a perfluoro alkyl group of the formula CF.sub.3(CF.sub.2).sub.x, wherein x is 3-12, n is 1-6, X is O or S, and B is vinylphenyl, the monomeric unit II is haloalkyl styrene, and optionally wherein the halo group of haloalkyl is replaced with an optional substituent, for example, ethylenediamine tetra acetic acid, iminodiacetic acid, or iminodisuccinic acid.

The present invention relates to a halogen-free resin composition and a prepreg and a laminated board prepared therefrom. The halogen-free resin composition contains the following components in parts by weight: 50-100 parts of an epoxy resin; 20-70 parts of benzoxazine; 5-40 parts of a polyphenyl ether; 5-40 parts of allyl benzene-maleic anhydride; 10-60 parts of a halogen-free flame retardant; 0.2-5 parts of a curing accelerator, and 20-100 parts of a filler. The prepreg and laminated board prepared from the halogen-free resin composition have comprehensive performances such as a low dielectric constant, a low dielectric loss, an excellent flame retardance, heat resistance, cohesiveness and moisture resistance, etc., and are suitable for use in a halogen-free high multilayer circuit board.

A method of making an ion exchange foam is described. The method includes forming an aqueous phase by suspending an ion exchange resin in an aqueous solvent. An organic phase is formed by mixing at least a divinylbenzene, a monomer, and a surfactant. The formed aqueous phase is mixed with the formed organic phase to form an emulsion. The emulsion is polymerized to form the ion exchange foam. The ion exchange foam can be used with a plurality of sample vials in an autosampler.

A method of making an ion exchange foam is described. The method includes forming an aqueous phase by suspending an ion exchange resin in an aqueous solvent. An organic phase is formed by mixing at least a divinylbenzene, a monomer, and a surfactant. The formed aqueous phase is mixed with the formed organic phase to form an emulsion. The emulsion is polymerized to form the ion exchange foam. The ion exchange foam can be used with a plurality of sample vials in an autosampler.

To provide hollow particles from which a hydrophobic solvent included therein can be removed at low temperature. Hollow particles which comprise a shell containing a resin and a hollow portion surrounded by the shell, wherein a volume average particle diameter Dv is 1.0 m or more and 30.0 m or less; wherein the hollow particles have only one hollow portion in an interior thereof; and wherein a ratio (SA(m)/SA(t)) of a measured BET specific surface area SA(m) of the hollow particles to a theoretical BET specific surface area SA(t) calculated from an apparent density D.sub.1 of the hollow particles and the volume average particle diameter Dv, is 3.0 or more.

To provide hollow particles in which the dielectric dissipation factor is decreased, and the performance stability in high-humidity environment is improved. Hollow particles comprising a shell, which contains a resin, and a hollow portion surrounded by the shell, wherein the hollow particles have a void ratio of 50% or more; wherein the shell contains a polymer as the resin, and a content of a crosslinkable monomer unit is 60% by mass or more in 100% by mass of all monomer units of the polymer; and wherein an aqueous dispersion of the hollow particles, which is obtained by dispersing the hollow particles with a volume of 0.35 cm.sup.3 in 100 mL of deionized water, has a pH of 6.5 or more and 7.5 or less and a conductivity of 50 S/cm or less.

The invention relates to a curable and preferably polymer composition that is useful as a sealant, an adhesive (e.g., structural adhesive), a reinforcement, a dampener, a sound absorber or any combination thereof. The composition preferably comprises one or more ethylene polymers, tackifier, curing agent, and rheology modifier. The invention also relates to extrusion of the composition onto an article surface, e.g. through a robotically mounted extrusion die, and subsequent activation for curing by an external stimulus.