Ligand-functionalized substrates are describe that are useful in selectively binding and removing biological materials from biological samples, and methods for preparing the same.

Provided is a polymer film in which metal oxide particles are localized to a great degree, wherein the polymer film is a hard coat layer that includes a binder including a first polymer component and a second polymer component that are miscible with each other and metal oxide particles that are unevenly distributed with a greater concentration toward at least one of a surface portion and the other surface portion opposite the surface portion, wherein the first polymer component may be hydrophilic, the second polymer component may be hydrophobic relative to the first polymer component, a proportion of the first polymer component may gradually decrease from the surface portion to the other surface portion, and the surface portion may be toward a substrate for forming the polymer film. An optical member, such as a polarization member, and a display device employing the polymer film are also provided.

A carbon fiber bundle for resin reinforcement, wherein there are adhered by 0.1-5.0 mass % to a carbon fiber bundle in which multiple lengths of filament are bundled, a mixture created by mixing an organic polymer (A) having a mass-average molecular weight of 10000 or more and an organic compound (B) the thermal reduction rate specified in claim 1 of which is 5 mass % or more or an organic compound (B) the thermal reduction rate specified in claim 2 of which is 0.8 mass % or more, the amount of the organic polymer (A) adhered being 0.1 mass % or more.

An object of the present invention is to provide a polymer that has excellent heat resistance and dielectric properties and can be dissolved in an organic solvent at a high concentration, a resin composition containing the same, and a molded body thereof. The polymer of the present invention has a repeating unit derived from a polymerizable compound of the following formula (I) (In the formula, X.sup.1 and X.sup.2 each independently represent a C3 to C6 branched alkyl group, a C3 to C6 cyclic alkyl group, a C3 to C6 branched alkoxy group, or a C3 to C6 cyclic alkoxy group, n represents 0 or 1, Z.sup.1 and Z.sup.2 each independently represent a single bond or a C1 to C3 alkylene group, each R independently represents an organic group or a halogeno group, m1 and m2 each independently represent any integer of 0 to 4, and Y represents a polymerizable functional group).

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Zwitterionic double network hydrogels, methods for making zwitterionic double network hydrogels, methods for using zwitterionic double network hydrogels, and articles made from and coated with zwitterionic double network hydrogels.

A resin composition and the use thereof. The resin composition comprises the following components, in percentages by weight: 40-70% of a crosslinkable and curable resin and 30-60% of a filler. The filler is silicon dioxide prepared by means of an organosilicone hydrolysis method; the average particle size D50 of the silicon dioxide is 0.1-3 m; and the particle size ratio D100:D10 of the silicon dioxide is less than or equal to 2.5. By means of the composition, a prepared adhesive film and resin-coated copper foil have a higher elongation rate, a higher peel strength, low CTE, low D.sub.f, better drilling processability and higher electrical strength. A finer line processing capability can be achieved, which can be applied to a printed circuit board material of a multilayer laminate, in particular a printed circuit board material of a multilayer laminate of thin lines.