Provided in the present invention are a resin composition and a pre-preg and a laminate using the composition. The resin composition comprises: (A) a prepolymer of a polyolefin resin and a bifunctional maleimide or a multifunctional maleimide; and, (B) vinyl thermosetting polyphenylene ether, where with the weight of the prepolymer of the polyolefin resin and the bifunctional maleimide or the multifunctional maleimide being 100 parts by weight, the weight of the vinyl thermosetting polyphenylene ether is 200 to 1000 parts by weight. The present invention, by employing the prepolymer of the polyolefin resin and the bifunctional maleimide or the multifunctional maleimide, solves the problem of incompatibility of the bifunctional maleimide or the multifunctional maleimide with the polyolefin resin and vinyl thermosetting polyphenylene ether. An aqueous glue solution so mixed is uniform and consistent, the pre-preg has a uniform expression, and a substrate resin area is free of a phase-separation problem.

The present invention relates to a method for preparing a benzoxazine-containing resin composition and a prepreg and a laminate made therefrom. The method for preparing a benzoxazine-containing resin composition is adding an acidic filler to a benzoxazine-containing resin composition. By adding an acidic filler to the benzoxazine-containing resin composition, the present invention promotes greatly the polymerization reaction of benzoxazine and epoxy resin, reduces the curing temperature required for polymerization of benzoxazine and epoxy resin. The laminate prepared from the benzoxazine-containing resin composition, to which an acidic filler is added, has high anti-stripping stability, high glass transition temperature, low water absorption, high heat resistance, high bending strength and good processability, and can achieve low coefficient of thermal expansion.

The present invention relates to a halogen-free epoxy resin composition, a prepreg and a laminate containing the same. The halogen-free epoxy resin composition comprises 60 parts by weight of epoxy resin, from 15 to 28 parts by weight of benzoxazine resin, and from 10 to 20 parts by weight of styrene-maleic anhydride. The present invention discloses using from 15 to 28 parts by weight of benzoxazine resin and from 10 to 20 parts by weight of styrene-maleic anhydride to cure 60 parts by weight of epoxy resin, to ensure the Df stability of prepregs at different curing temperature conditions while maintaining low dielectric constant and low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards.

Provided is a germ-repellent polymer structure including a base plastic selected from polypropylene homopolymer, polypropylene impact copolymer, or acrylonitrile butadiene styrene; and a hydration layer, the hydration layer including one or more hydrophilic additives formed on the base plastic optionally in the presence of an intermediate plastic that is compatible to both the base plastic and hydrophilic additives for stabilizing the hydration layer on some base plastics. In some embodiment, the introduction of hydration layer to the base plastic through the intermediate plastic imparts germ repellency by introducing sufficient hydroxyl groups onto the surface of the base plastic in order to trap water molecules into a polymer matrix of the base plastic. The change in mechanical strength of the base plastic before and after the introduction of the hydration layer is less than 20% of an original mechanical strength, where the original mechanical strength corresponds to a strength of the base plastic before formation of the hydration layer.

A thermosetting resin composition and a prepreg and a laminated board prepared therefrom. The thermosetting resin composition contains the following components in parts by weight: 50-150 parts of a cyanate; 30-100 parts of an epoxy resin; 5-70 parts of styrene-maleic anhydride; 20-100 parts of a polyphenyl ether; 30-100 parts of a halogen-free flame retardant; 0.05-5 parts of a curing accelerator; and 50-200 parts of a filler. The prepreg and laminated board prepared from the thermosetting resin composition have comprehensive performances such as a low dielectric constant, a low dielectric loss, an excellent flame retardance, heat resistance and moisture resistance, etc., and are suitable for use in a halogen-free high-frequency multilayer circuit board.

A halogen-free resin composition and a prepreg and a laminate prepared therefrom. The halogen-free resin composition comprises the following ingredients in parts by weight: 50-100 parts of an epoxy resin, 20-70 parts of benzoxazine, 5-40 parts of polyphenyl ether, 5-30 parts of styrene-maleic anhydride, 5-40 parts of a halogen-free flame retardant, 0.2-5 parts of a curing accelerator, and 20-100 parts of a filler. The prepreg and the laminate, which are manufactured from the halogen-free resin composition, have the comprehensive properties of low dielectric constant, low dielectric loss, excellent heat resistance, adhesive property and wet resistance and the like, and are suitable for being applied to halogen-free high-frequency multilayer circuit boards.

The present invention relates to a polymer composition comprising: (a) 54.0-79.0 wt % of a (meth)acrylic polymer; (b) 20.0-45.0 wt % of a copolymer comprising polymeric units according to formula (I) and polymeric units according to formula (II) and (c) 1.0-10.0 wt % of a copolymer comprising polymeric units according to formula (I) and polymeric units according to formula (III), wherein n=0 or 1; with regard to the total weight of the polymer composition. Such polymer composition provides a desired high heat resistance and good scratch resistance.

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A halogen-free resin composition and a prepreg and a laminate prepared therefrom. The halogen-free resin composition comprises the following ingredients in parts by weight: 50-100 parts of an epoxy resin, 20-70 parts of benzoxazine, 5-40 parts of polyphenyl ether, 5-30 parts of styrene-maleic anhydride, 5-40 parts of a halogen-free flame retardant, 0.2-5 parts of a curing accelerator, and 20-100 parts of a filler. The prepreg and the laminate, which are manufactured from the halogen-free resin composition, have the comprehensive properties of low dielectric constant, low dielectric loss, excellent heat resistance, adhesive property and wet resistance and the like, and are suitable for being applied to halogen-free high-frequency multilayer circuit boards.

This invention relates to flame-retardant modified maleic anhydride resins. This resin copolymer consists of styrene, maleic anhydride and, along with a halogen-free epoxy resin, interacts with a hydroxyl group to become a flame-retardant maleic anhydride copolymer that can be applied to copper clad laminate and prepreg. This composition comprises: (A) one or more epoxy resin mixtures; (B) modified styrene-maleic anhydride curing agent copolymer; (C) additives; (D) inorganic fillers. When the aggregate amount of components (A), (B) and (C) equals 100%, component (A), epoxy resin mixture, is 60%-80% in total weight, component (B), modified styrene-maleic anhydride curing agent copolymer, equals 10%-40% in total weight. This invention uses the copolymer of Styrene and Maleic anhydride to generate a flame-retardant hydroxyl group, and with the phosphorus additive, the above components eventually interact to form a flame-retardant modified maleic anhydride copolymer curing agent.

Specific bismaleimide compounds are made, and curable compositions are made that include at least one of these bismaleimides and at least one specific polyimide. A process is developed for the manufacture of these curable compositions, and crosslinked polymers are obtainable by this process. A process is developed for the manufacture of a composite material by curing a mixture of a fibrous or particulate reinforcement and the curable composition or the crosslinked polymer as well as the obtained composite material.