A dynamically vulcanized alloy contains at least one isobutylene-containing elastomer, at least one thermoplastic resin, and an anhydride functionalized oligomer grafted to the thermoplastic resin. In the alloy, the elastomer is present as a dispersed phase of small vulcanized or partially vulcanized particles in a continuous phase of the thermoplastic resin and the alloy is substantially absent of any sulfonamides.

Disclosed are an optical film, including: a transparent film, and a coating layer on at least one surface of the transparent film, in which the coating layer is formed using a composition including a polymer resin, a dihydrazide-based crosslinking agent, and water-dispersible fine particles, and a polarizing plate including the same.

A rubber composition used for a weather strip glass run channel of a vehicle includes a base polymer, a reinforcing agent, a moisture absorbent, a vulcanizing and curing agent, a vulcanization accelerator, and a vulcanization activator. The base polymer contains an ethylene propylene diene (EPDM) terpolymer in 80 to 90% by weight based on a weight of the base polymer and a silicone-acrylic ester graft copolymer in 10 to 20% by weight based on the weight of the base polymer.

The present invention provides compositions for use in making biodegradable biodegradable composite, and biodegradable composite comprising polybutylene adipate terephthalate (PBAT)-component; hemp powder; and optionally one or more compatibilizers and/or PBAT grafted with one or more compatibilizers selected from maleic anhydride, glycidyl methacrylate, pyromellitic anhydride, acrylic acid, polyacrylic acid, methylene diphenyl diisocyanate, poly(glycidyl methacrylate, copolymer(s) of glycidyl methacrylate and/or copolymers of acrylic acid. The invention also relates to methods of preparing the composites.

A copolymer, a method of manufacturing a copolymer, an encapsulant for optoelectronic devices, and an optoelectronic device are provided. The encapsulant exhibiting excellent adhesion to front substrates and back sheets included in various optoelectronic devices can be provided. Also, the encapsulant capable of maintaining excellent workability and economic feasibility upon manufacture of the device without causing a negative influence on working environments and parts such as optoelectronic elements or wiring electrodes encapsulated in the optoelectronic device can be provided.

Provided are: a resin composition with which it is possible to form a cured film having excellent weather resistance and wear resistance; and a resin molding having said cured film. An active energy beam-curable resin composition containing a radical polymerizable compound and a photopolymerization initiator (d), wherein said radical polymerizable compound contains 57-90 mass % of (a) caprolactone-modified mono- or poly-penta erythritol poly (meth)acrylate represented by formula (1) and 10-43 mass % of (b) urethane (meth)acrylate synthesized from a polycarbonate polyol having a branched alkyl structure and an average molecular weight falling within the range of 500-1000, a diisocyanate having an alicyclic structure, and a mono (meth)acrylate containing a hydroxyl group. In formula (1), each X independently represents a caprolactone-modified (meth)acryloyl group, a (meth)acryloyloxy group, or a OH group.

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Provided are adhesives containing a phenoxy resin grafted with methyl methacrylate (MMA) and/or methacrylic acid (MAA), and including a uretdione or a silane. The adhesive compositions are completely or substantially absent free isocyanate. The grafted phenoxy resin forms crosslinking which allows the adhesive to chemisorb to a metal surface, diffuse and entangle in a urethane elastomer and/or provide crossbridging and/or crosslinking across an interface of the adhesive and a cast urethane. Methods of adhering a castable urethane to a substrate, using the provided adhesives, are also provided.

A toughened polyamide composition including a blend of: (A) at least one polyamide; (B) at least one impact modifier; and (C) at least one organic amine; a process for producing the toughened polyamide composition; and articles made from the toughened polyamide compositions.

Provided are a resin composition having low dielectric constants and low dielectric loss tangents before moisture absorption (initial state) and after moisture absorption with high metal foil peel strength; and a cured product, a prepreg, a metal foil-clad laminate, a resin sheet, and a printed wiring board in which the resin composition is used. The resin composition contains a compound (A) represented by Formula (M1) and a polymer (B) having a structural unit represented by Formula (V). ##STR00001##

Provided are adhesives containing a phenoxy resin grafted with methyl methacrylate (MMA) and/or methacrylic acid (MAA), and including a uretdione or a silane. The adhesive compositions are completely or substantially absent free isocyanate. The grafted phenoxy resin forms crosslinking which allows the adhesive to chemisorb to a metal surface, diffuse and entangle in a urethane elastomer and/or provide crossbridging and/or crosslinking across an interface of the adhesive and a cast urethane. Methods of adhering a castable urethane to a substrate, using the provided adhesives, are also provided.