The present invention is directed to film-forming compositions comprising: a) a non-chlorinated, linear polyolefin polymer comprising 0.5 to 10 percent by weight residues of an ethylenically unsaturated anhydride or acid; b) an aminoplast; and c) a component comprising: i) at least one non-chlorinated hydrocarbon having at least 18 carbon atoms and optionally aromatic groups and/or oxygen heteroatoms; and/or ii) an alkyd resin. The present invention is also drawn to methods of improving fuel resistance of a coated article, comprising: (1) applying the film-forming composition to a substrate to form a coated substrate; (2) optionally subjecting the coated substrate to a temperature for a time sufficient to cure the film-forming composition; (3) applying at least one curable film-forming composition to the coated substrate to form a multi-layer coated substrate; and (4) subjecting the multi-layer coated substrate to a temperature and for a time sufficient to cure all of the film-forming compositions.

A polycarbonate resin composition includes: 50 to 90% by mass of polycarbonate resin (A); 2 to 30% by mass of acrylonitrile-butadiene-styrene copolymer resin (B); 5 to 40% by mass of at least one basic magnesium sulfate (C) selected from fibrous basic magnesium sulfate (C-1) and fan-shaped basic magnesium sulfate (C-2); 0.1 to 8% by mass of at least one (D) selected from a fatty acid metal salt and a fatty acid; and 1 to 20% by mass of elastomer (E).

A resin composition includes: a polyphenylene ether compound; a curing agent reactable with the polyphenylene ether compound; and an inorganic filler including a boron nitride filler, wherein a particle size distribution of the inorganic filler, which is measured by a laser diffraction-based particle size distribution measuring method, has at least two peaks in a particle diameter range of 0.8 to 30.0 μm, the peaks including at least one peak in a particle diameter range of 0.8 to 5.0 μm and at least one peak in a particle diameter range of 5.0 to 30.0 μm.

Disclosed herein is a thermoplastic gel prepared from a composition comprising: a styrene triblock copolymer; a styrene diblock copolymer; an oil extender; and optionally an additive. The composition comprises greater than 21 wt % up to about 35 wt % of a combination of the styrene triblock copolymer and the styrene diblock copolymer. The thermoplastic gel exhibits a very low oil bleed out of less than about 5% after 1500 hours at 60° C. and 120 kPa.

An asphaltic sheet comprising an asphaltic component including an asphalt binder and expandable graphite.

The present invention relates to the use of a hot-melt adhesive for adhesive bonding of at least a first packaging and a second packaging, the hot-melt adhesive comprising: (a) 7-48 parts per weight of a polymer component, the polymer component comprising a styrene block copolymer; (b) 15-52 parts per weight of a tackifying component, wherein the tackifying component comprises thermoplastic adhesive resin, aliphatic hydrocarbon, cycloaliphatic hydrocarbon, aromatic hydrocarbon, the respective hydrocarbon optionally being modified and/or hydrogenated, terpenes, the terpenes optionally being modified or hydrogenated, rosins, the rosins optionally being modified or hydrogenated, or mixtures thereof; (c) 5-25 parts per weight of a plasticizer component, wherein the plasticizer component comprises paraffinic oils, naphthenic oils, polybuten, polybutadien, dibasic esters, polyols or mixtures thereof; and d) 0.02-1.2 parts per weight of a stabilizer component, wherein the stabilizer component is a light stabilizer, preferably as a sterically hindered phenolic antioxidant and/or a sterically hindered amine, most preferably is pentaerythritol tetrakis(3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate).

A resin composition includes an unsaturated C═C double bond-containing polyphenylene ether resin, a polyolefin and silica; in an X-ray diffraction analysis pattern of the silica as measured by reference to JY/T 009-1996, only one diffraction peak exists in a 2θ ranging from 10° to 30°, and the diffraction peak has a full width at half maximum of 5.0° to 7.7°. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and achieves improvements in at least one of the properties including dissipation factor, resin filling property in open area, hole drilling limit value, and precision of hole position Cpk.

A composition is disclosed comprising a sulfonated styrenic block copolymer (SSBC) having an ion exchange capacity (IEC) of at least 0.5 meq/g; and at least one compound which reacts with the SSBC forming a cross-linked SSBC. The compound is selected from: (i) a cross-linking agent, (ii) a metal cation, and (iii) a non-sulfonated polymer. A film prepared from the composition containing the cross-linked SSBC has a toughness in wet state measured after 1 week of 1.2 to 8 MJ/m.sup.3; and a tensile stress in wet state measured after 1 week of 3.2 to 8 MPa, according to ASTM D412. The film can be used as a water 10 purification membrane or an antimicrobial protection layer.

A masterbatch of a liquid additive is provided, the resin composition for the masterbatch comprising (a) a block copolymer or a hydrogenated product thereof, the block copolymer containing a polymer block having a vinyl aromatic compound as a main component and a polymer block having a conjugated diene compound as a main component, and 40 to 100 parts by mass of a polyolefinic resin and 100 to 150 parts by mass of an ethylene.Math.α-olefin copolymer with respect to 100 parts by mass of the (a) component, wherein the kinematic viscosity at 100° C. is 10 to 5,000 mm.sup.2/s; the ethylene molar content is in the range of 30 to 85 mol %; and the molecular weight distribution (Mw/Mn) for the molecular weight measured by gel permeation chromatography (GPC) with reference to polystyrene is not more than 2.5.

A resin composition contains an epoxy compound, a maleimide compound, a phenolic compound, core-shell rubber, and an inorganic filler. The maleimide compound has an N-phenyl maleimide structure. The content of the maleimide compound falls within a range from 10 parts by mass to less than 40 parts by mass with respect to 100 parts by mass in total of the epoxy compound, the maleimide compound, and the phenolic compound.