An anisotropic conductive film containing a compound represented by Chemical Formula 1:

##STR00001## in Chemical Formula 1, R is any one of a halogen element, a hydroxy group, a substituted or unsubstituted imine group, a substituted or unsubstituted silyl group, a substituted or unsubstituted C1 to C10 oxy group, a substituted or unsubstituted carbonyl group, a substituted or unsubstituted C2 to C10 alkenyl group, and a substituted or unsubstituted C2 to C10 alkynyl group.

Provided is a resin molded body including: a resin porous body that contains a carbon fiber nonwoven fabric and has continuous voids; and a skin layer formed of a thermosetting resin composition. In this resin molded body, the continuous voids have a porosity of 50% by volume to 97% by volume, the skin layer has a porosity of 5% by volume or less, and the thermosetting resin composition is embedded at a depth of 50 m to 1,000 m on the resin porous body side of the resin molded body. Also provided is a method of producing a fiber-reinforced resin molded body, the method including, in the order mentioned: the preform forming step of forming a preform using a resin porous body that has continuous voids and a flexural modulus of 10 MPa or more based on the ISO178 method (1993); the sealing step of forming a closed space that encloses the preform with a molding die and/or a film; the injection step of injecting a thermosetting resin composition into the closed space; and the curing step of maintaining a temperature equal to or higher than a curing temperature of the thermosetting resin composition. This method provides a resin molded body that contains a porous structure and is excellent in surface quality and productivity.