A prepreg 10 comprises: a reinforcing fiber layer 3 including reinforcing fibers 1 and a resin composition 2 with which the space between fibers of the reinforcing fibers 1 is impregnated and which contains (A) a benzoxazine resin, (B) an epoxy resin, and (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule; and a surface layer 6a or 6b provided on at least one surface of the reinforcing fiber layer 3 and containing (A) a benzoxazine resin, (B) an epoxy resin, (C) a curing agent having 2 or more phenolic hydroxy groups in a molecule, and (D) polyamide resin particles 4 having an average particle size of 5 to 50 μm, wherein the polyamide resin particles 4 include a particle made of a polyamide 11.

A triple shape memory polymeric foam that is open cell in nature and features a two phase, crosslinked SMP with a glass transition temperature of one phase at a temperature lower than a melting transition of the second phase. The resulting soft material features high fidelity, repeatable triple shape behavior, and is useful for complex deployment using a combination of foam compression and bending.

Provided is a resin composition that has a low viscosity before curing, and is capable of being turned into a cured product having superior dielectric properties (low relative permittivity and low dielectric tangent), a low elastic modulus and also an excellent heat resistance. The resin composition is a heat-curable citraconimide resin composition containing:

(A) a citraconimide compound having a saturated or unsaturated divalent hydrocarbon group(s) having 6 to 100 carbon atoms;

(B) an epoxy resin having at least two epoxy groups in one molecule; and

(C) a reaction promoter,

wherein a mass ratio between the components (A) and (B) is (A):(B)=99:1 to 1:99.

Curable compositions are provided which comprise: a) 30-80 wt % of a room temperature liquid epoxy resin; b) 0.5-10 wt % of an epoxy curative; c) 5-40 wt % of a thermoplastic resin; and d) 0.5-10 wt % of a physical blowing agent. In some embodiments, the curable compositions may be fire retardant. In some embodiments, the curable compositions may be used in the form of films, and more particularly as core splice film adhesives.

Methods for preparing pre-dynamic cross-linked polymer compositions are described. Methods of preparing dynamic cross-linked polymer compositions using pre-dynamic cross-linked polymer compositions are also described.

A fiber reinforced thermoplastic resin molding material includes a thermoplastic resin; a resin impregnated reinforcing fiber filament obtained by impregnating reinforcing fibers with a resin having a melt viscosity at 200° C. lower than a melt viscosity of the thermoplastic resin; and a reinforcing fiber modifier having a melt viscosity at 200° C. lower than the melt viscosity of the thermoplastic resin and a difference in solubility parameter value from the thermoplastic resin equal to or larger than 1.0, the molding material including 50 to 98.9 parts by weight of the thermoplastic resin; 1 to 40 parts by weight of the reinforcing fiber; 0.1 to 10 parts by weight of the reinforcing fiber modifier; and 0.2 to 12 parts by weight of the resin relative to total 100 parts by weight of the thermoplastic resin, the reinforcing fiber, and the reinforcing fiber modifier.

The present teachings provide a method and composition related to two component epoxy phosphate ester based foam materials. The present teachings provide a method comprising: providing a two component system, the two component system including an A side and a B side, the A side including epoxy and the B side including phosphate ester and phosphoric acid; mixing the A side and the B side to form a resulting reaction product; wherein the resulting reaction product of the A side and the B side cures at a temperature of less than 50° C. The present teachings provide a composition comprising: a) a first component including epoxy; b) a second component including phosphate ester and phosphoric acid; and wherein a resulting reaction product of the first component and second component cures at a temperature of less than 50° C.

Resin compositions including at least two different inert fillers that are useful for preparing prepregs and laminates that are used in manufacturing printed circuit boards.

A resin composition for a fiber-reinforced composite material that makes it possible to improve productivity by suppressing deformation at the time of removal from a mold, in particular, in the PCM method, while achieving both rapid curing and storage stability. The resin composition for a fiber-reinforced composite material includes an epoxy resin (A) including a phenol novolac epoxy resin and a bisphenol A epoxy resin; a phenoxy resin (B); dicyandiamide (C); an imidazole-based curing aid (D); and a phenol-based curing accelerator (E) as essential components, wherein the phenol novolac epoxy resin of the epoxy resin (A) constitutes 40 parts by mass to 75 parts by mass, the bisphenol A epoxy resin constitutes 10 parts by mass to 35 parts by mass, and the phenoxy resin (B) constitutes 5 parts by mass to 15 parts by mass in the total of 100 parts by mass of the components (A) to (E).

A resin composition for fiber-reinforced plastic having a good balance between stability and curability and capable of producing fiber-reinforced plastic with improved strength. The composition contains an epoxy resin, an acid anhydride, and a catalyst that is liquid at 25° C. The catalyst is at least one member selected from the group consisting of a compound composed of an acid and a base and a compound composed of a quaternary onium cation and an anion.