Patent classifications
C08J2463/02
PREPREG AND MANUFACTURING METHOD FOR SAME
The present invention addresses the problem of providing a prepreg that has excellent short-time and low-pressure handling properties, during pasting and layering work. In order to solve the problem, this invention has the following configuration. The prepreg includes reinforcing fibers and an epoxy resin composition, has a fiber content of 90 mass % or less, and satisfies conditions (a) and (b) below. (a) When the average thickness of the prepreg is set as D (D being 3 m or greater), the viscosity at 25 C. of the epoxy resin composition at a site (I) located at a depth of D/4 to 3D/4 from the surface on one side of the prepreg is 50,000 to 300,000 Pa.Math.s inclusive. (b) From among sites (II) located at a depth of up to 0.5 m from each surface on both sides of the prepreg, the viscosity at 25 C. of the epoxy resin composition at least at a site (II) on the one side is 10,000 to 40,000 Pa.Math.s inclusive.
RESIN MOLDED BODY
A resin molded body includes a resin structure, an intermediate layer including an inorganic filler and an organic resin binder and provided on a surface of at least a part of the resin structure, and a thermal sprayed ceramic coating provided on the intermediate layer. The inorganic filler is amorphous in shape and has a central particle diameter of 20 m or more and 100 m or less. The intermediate layer has a thickness of 50 m or more and 250 m or less. The central particle diameter a of the inorganic filler and the thickness b of the intermediate layer satisfy the relationship of b2a, and the inorganic filler is contained in the intermediate layer in an amount of 40% to 65% as a volume ratio.
Metal-clad laminate, circuit board, and multilayer circuit board
A metal-clad laminate that includes a metal foil with low surface roughness and in which the adhesion strength between a liquid crystal polymer film and the metal foil is high, the low transmission loss in a high frequency region is low, and the problems associated with warpage and adhesive leakage are alleviated. The metal-clad laminate includes the liquid crystal polymer film, an adhesive layer, and the metal foil, with the adhesive layer and the metal foil stacked on one surface of the liquid crystal polymer film.
Methods for treating thermoplastic polyurethane covers for golf balls with epoxy compositions
Golf balls having covers made of thermoplastic polyurethane compositions are provided. Multi-piece golf balls can be made. In one embodiment, the outer cover layer is formed from a composition comprising a thermoplastic polyurethane and epoxy compound. Mixtures of multi-functional amines and imines, and multi-functional isocyanates, and epoxy curing agents; and solvent, can be applied to the outer cover. The resulting coating may contain polyurethanes, polyureas, and hybrids, copolymers, and blends thereof. The cover composition and surface coatings can further include catalysts, ultraviolet (UV)-light stabilizers, and other additives. The coating methods have many benefits and the finished balls have good physical properties.
MOLDED ARTICLE AND METHOD FOR PRODUCING MOLDED ARTICLE
A molded article includes a continuous porous body provided with a thin film layer, the continuous porous body having a void that is continuous in a thickness direction of the continuous porous body, the thin film layer including a solid additive and a resin. A permeation rate of water from a surface of the molded article on a side of the thin film layer is 10% or less.
METHOD FOR MANUFACTURING MOLDED ARTICLE AND PREFORM OF MOLDED ARTICLE
Provided is a method for producing a molded article having a thin film layer (B) formed on a surface of a porous body (A). The method includes a process (I) and a process (II) described below in this order:
process (I): forming the thin film layer (B) on a surface of a precursor (a) of the porous body (A) to obtain a preform, and
process (II): expanding and molding the precursor (a) to the porous body (A).
RESIN POWDER, SEALING MATERIAL, ELECTRONIC COMPONENT, AND RESIN POWDER MANUFACTURING METHOD
Resin powder includes aggregates of spherical particles of a resin composition. The resin composition contains: a resin component including a thermosetting resin; and a non-resin component including at least one electrically insulative inorganic particle and/or at least one magnetic particle.
Heat-curable resin composition, prepreg, and method for producing fiber-reinforced composite using each of same
The present invention provides a heat-curable resin composition, which comprises (1) a heat-curable resin mixture comprising a heat-curable resin (a) and thickener particles (b) and exhibiting a viscosity (150 C.) after having been held at a temperature of 150 C. for 30 seconds that is a viscosity (S), and (2) a curing agent, and is characterized in that the heat-curable resin composition exhibits a lowest viscosity (R) at 80-120 C., the lowest viscosity (R) is 0.1-10 Pa.Math.s, and the viscosity (S) and lowest viscosity (R) satisfy the relationship of formula (1):
5<S/R<200formula (1).
IMPROVEMENT OF IMPACT PROPERTIES OF DYNAMICALLY CROSS-LINKED NETWORKS BY USING REACTIVE IMPACT MODIFIERS
Provided are pre-dynamically cross-linked compositions including a networking impact modifier additive. Compositions include a pre-dynamic cross-linked polymer composition including polyester chains joined by a coupler component and one or more networking impact modifier additives. Methods of making the compositions are also described.
Resin supply material, preform, and method of producing fiber-reinforced resin
A resin supply material is used for molding a fiber-reinforced resin and includes a continuous porous material and a resin. The continuous porous material has a bending resistance Grt of 10 mN.Math.cm or more at 23 C., and a bending resistance ratio Gr of 0.7 or less, the bending resistance ratio Gr being expressed by the formula:
Gr=Gmt/Grt Gmt: bending resistance of continuous porous material at 70 C.