A resin composition including an inorganic filler (B) having an aluminosilicate (A) having a silicon atom content of from 9 to 23% by mass, an aluminum atom content of from 21 to 43% by mass, and an average particle diameter (D50) of from 0.5 to 10 μm; and any one or more thermosetting compounds selected from the group consisting of an epoxy resin (C), a cyanate compound (D), a maleimide compound (E), a phenolic resin (F), an acrylic resin (G), a polyamide resin (H), a polyamideimide resin (I), and a thermosetting polyimide resin (J), wherein a content of the inorganic filler (B) is from 250 to 800 parts by mass based on 100 parts by mass of resin solid content.

A thermoplastic resin composition including 100 parts by weight of a base resin including 50-95% by weight of a polyarylene ether resin (a-1) and 5-50% by weight of a polystyrene resin (a-2); 8.5-16 parts by weight of two or more types of organophosphorus flame retardants (b) having different phosphorus contents; 0.5-3 parts by weight of organoclay (c); 0.5-3.5 parts by weight of pulverized mica (d); 1-4 parts by weight of an alkaline earth metal sulfate (e); and 1-5 parts by weight of a polyfunctional reactant (f), a method of preparing the thermoplastic resin composition, and a molded article including the thermoplastic resin composition. The thermoplastic resin composition has excellent mechanical properties, such as impact strength and tensile strength, heat resistance, electrical insulation, and flame retardancy.

A method for producing an electronic device includes a first step of pasting a support to an organic substrate having a thickness of 1000 μm or less, with a temporary fixing material interposed therebetween, to obtain a laminated body; a second step of heating the temporary fixing material of the laminated body; a third step of mounting a semiconductor chip on the organic substrate of the laminated body that has been subjected to the second step; a fourth step of sealing the semiconductor chip mounted on the organic substrate with a sealing material; and a fifth step of peeling the support and the temporary fixing material from the organic substrate of the laminated body that has been subjected to the fourth step.

A self-adhesive prepreg comprising a fibre reinforcement layer having a first side and a second side, wherein the first side of the fibre reinforcement layer has been pre-impregnated with a self-adhesive resin composition. The self-adhesive may be used as a structural reinforcement and is especially adapted for direct bonding to oily steel or galvanized steel in the automotive, aerospace and other sheet metal fabrication industries.

Provided are a polyarylene sulfide resin composition which can provide a composite molded article; a molded article produced from the polyarylene sulfide resin composition; and methods respectively for producing the polyarylene sulfide resin composition and the molded article thereof. More specifically provided are a composite molded article obtained by bonding a molded article which is produced by molding a polyarylene sulfide resin composition and is subjected to an annealing treatment to a cured product produced from a curable resin composition containing an epoxy resin, wherein the polyarylene sulfide resin composition contains, as essential components, an epoxy resin and an olefin wax containing a carboxyl group and a carboxylic acid anhydride group and having an acid value of 65 to 150 [mgKOH/g]; a polyarylene sulfide resin composition for providing the composite molded article; a molded article; and methods respectively for producing the aforementioned products.

Provided are a printed circuit board in which warps are effectively suppressed, and a semiconductor package having a semiconductor device mounted on said printed circuit board, even though circuit patterns of different amounts of metal are formed on both sides of one cured product of a prepreg. Specifically, said printed circuit board is a printed circuit board which comprises a cured product of a prepreg comprising a fiber base material and a resin composition, in which circuit patterns of different amounts of metal are formed on both sides of one cured product of the prepreg, in which said prepreg has layers on the front and back of said fiber base material, wherein said layers comprise resin compositions having different heat curing shrinkage rates, in which among these layers, the layer made of the resin composition having a smaller heat curing shrinkage rate is present on the side on which the circuit pattern with a smaller amount of metal is formed.

A prepreg having at least one layer of fibres and a curable thermosetting resin system at least partly impregnating the at least one layer of fibres, wherein the curable thermosetting resin system includes a curable thermosetting resin including at least two epoxide groups, a curing agent that includes at least one amine group, and an accelerator that includes an azole group; wherein the curable thermosetting resin, the curing agent and the accelerator are provided in respective concentrations in the prepreg to provide that, after curing the thermosetting resin at a cure temperature of at least 140° C. for a period of from 1 to 6 minutes, (i) the cured thermosetting resin has a glass transition temperature Tg which is greater than the cure temperature and is within the range of from 150° C. to 180° C. and (ii) the cured thermosetting resin is at least 90% cured.

The prepreg includes a first resin layer and a second resin layer disposed on both surfaces of the first resin layer. The first resin layer is a half-cured product of a first resin composition that includes a glass cloth impregnated with the first resin composition and contains no hexagonal boron nitride. The second resin layer is a half-cured product of a second resin composition containing hexagonal boron nitride. The glass cloth has a warp and weft weave density of 54 pieces/25 mm or more. The hexagonal boron nitride has an average particle size ranging from 10 μm to 30 μm. The hexagonal boron nitride is contained in an amount ranging from 20 parts by mass to 40 parts by mass relative to 100 parts by mass of a residual component other than the hexagonal boron nitride in the second resin composition.

Provided is a resin composition including: a polyacetal; conductive carbon black; graphite; and a specific polyacetal decomposition inhibitor, wherein the conductive carbon black has a dibutyl phthalate oil absorption of 180 ml/100 g or less, wherein the content of the polyacetal in the resin composition is 60 mass % or more, and wherein the content of the conductive carbon black in the resin composition is 16 mass % or more and 20 mass % or less.

This invention relates to a resin composition. The resin composition comprises a first polyfunctional epoxy component (i) comprising an epoxy resin based on a alkylol alkane triglycidyl ether monomer, and a second component, (ii) comprising an epoxy resin. The composition further comprise a third component, (iii) comprising a hydrazide based curative in combination with either (a) a urone based curative or (b) an imidazole based curative or both.