The objective of the present invention is to provide a prepreg and a fiber reinforced composite material using this prepreg. This prepreg has good handleability, is suitable for producing a reinforced composite material in a short-time and without using an autoclave, and is capable of yielding a fiber reinforced composite material exhibiting excellent impact resistance, wherein the occurrence of voids has been suppressed. To attain the objective, this prepreg comprises a reinforced fiber [A] that is layered and partially impregnated with an epoxy resin composition containing an epoxy resin [B] and a hardener [C], the impregnation rate being 30 to 95%. In this prepreg, a thermoplastic resin [D] insoluble in the epoxy resin [B] is distributed unevenly over a surface on one side of the prepreg, and a portion not impregnated with the epoxy resin composition is localized in the layer of the reinforced fiber [A] on the side where the thermoplastic resin [D] is distributed unevenly. This prepreg has a localization parameter , which defines the degree of the localization to be in the range of 0.10<<0.45.

A thermoplastic resin composition containing a polyamide resin (A), a compatibilizer (B) and a polyolefin resin (C), wherein the compatibilizer (B) is a modified ethylene-based elastomer that is modified with an unsaturated carboxylic acid and that has a density of 850 to 870 kg/m.sup.3, and a content proportion of the polyamide resin (A) is 15 to 30% by mass, a content proportion of the compatibilizer (B) is 15 to 30% by mass, and a compounding proportion of the polyolefin resin (C) is 45 to 65% by mass, based on 100% by mass of a total content of the polyamide resin (A), the compatibilizer (B) and the polyolefin resin (C).

The present invention relates to a polymer composition (C) comprising: a polyphenylene sulfide (PPS), at least 3 wt. % of polyamide 6 (PA6), 25 to 60 wt. % of reinforcing agents, 3 to 8 wt. % of a functionalized, non-aromatic elastomer, wherein the weight ratio PPS/PA6 is at least 4 and wherein wt. % are based on the total weight of the composition. The present invention also relates to articles incorporating the polymer composition and the use of polyamide 6 (PA6) as a heat-aging stabilizer in a polymer composition.

Disclosed is a modifier that is blended with a polyolefin to obtain a molded body methods for using the same and for producing the modifier. The modifier includes a continuous phase (A) containing a second polyolefin resin and a dispersed phase (B) containing a polyamide resin and a modified elastomer and composed of a melt-kneaded product of the polyamide resin and the modified elastomer, the modified elastomer is an elastomer having a reactive group that reacts with the polyamide resin, the elastomer is an olefin-based thermoplastic elastomer having, as a skeleton, a copolymer of ethylene or propylene and an -olefin having 3-8 carbon atoms or a styrene-based thermoplastic elastomer having a styrene skeleton, and when a total of the continuous phase (A) and the dispersed phase (B) is taken as 100% by mass, a content of the dispersed phase (B) is 80% by mass or less.

A problem of heat dissipation in motors, converters, high-luminance LEDs, power devices, power supplies, and the like becomes significant. Provided is a means for capable of providing a product, which has favorable workability, segregation stability, storage stability, and the like, penetrates into a gap in a coil portion, an interface in casing, and the like without any gaps, enhances thermal conductivity/heat dissipation properties of a molded product thus obtained, and is excellent in electrical characteristics, toughness/elastic modulus, thermal resistance, thermal cycle properties, and the like, in the case of using the product for a cast molding resin, a pottingmaterial (sealingmaterial), an adhesive, grease, and the like.

Provided is a filler-loaded high thermal conductive dispersion liquid composition being formed by uniformly dispersing a powder composition, which contains organic polymer particles containing thermoplastic polymer particles, and high thermal conductive filler particles which contain filler particles having a graphite-like structure and is obtained by pulverizing 5 to 70 parts by weight of the organic polymer particles and 30 to 95 parts by weight of the high thermal conductive filler particles with respect to 100 parts by weight of the total amount of these components by using a pulverizing machine, which performs grinding with frictional force or impact force, to cause delamination or cohesive failure while maintaining an average planar particle size of the filler particles having a graphite-like structure, in the powder composition, the vicinity of the high thermal conductive filler particles being covered with the micronized organic polymer particles and the covered particles being uniformly dispersed, using 25 to 250 parts by weight of a liquid reactive dispersing medium and/or a dispersing medium containing a thermoplastic polymer having a deflection temperature under load or a melting point lower than that of the thermoplastic polymer used in the powder composition with respect to 100 parts by weight of the powder composition, and the dispersion liquid composition having conditions that a thermal conductive infinite cluster exhibiting a thermal conductivity of 1 to 35 W/mK is formed and a concentration of the high thermal conductive filler particles is equal to or more than a percolation threshold.

A problem to be solved by the present invention is to provide a prepreg and an integrally molded article, wherein the prepreg exhibits suitable flexibility and adhesiveness, excels in formability on a complicated mold face and adhesion to a mold face, causes no positional shift, and can be efficiently reinforced and stiffened at an intended position. A main object of the present invention is to provide a prepreg including (A) reinforcing fibers, (B) a thermosetting resin, and (C) a thermoplastic resin, wherein the (C) thermoplastic resin exists in at least a part of a face of the prepreg, and wherein the prepreg satisfies the condition [I], and satisfies the condition [II] or the condition [III]: [I]: the (B) thermosetting resin has a peak in the temperature range of more than 100 C. and 180 C. or less on a loss tangent (tan ) curve measured under isokinetic heating by dynamic mechanical analysis (DMA); [II]: on a loss angle curve obtained by measuring the prepreg isothermally by dynamic mechanical analysis (DMA), the loss angle curve has a point representing the maximum value, and has a point which represents a loss angle value 5 or more smaller than the maximum value, and which is on the earlier time side of the point representing the maximum value; and [III]: even if, on the loss angle curve obtained by measuring the prepreg isothermally by dynamic mechanical analysis (DMA), the loss angle curve has a point representing the maximum value, the loss angle curve does not have a point which represents a loss angle value 5 or more smaller than the maximum value, and which is on the earlier time side of the point representing the maximum value, or the loss angle curve does not have a point representing the maximum value, and has a descendingly behaving section in which the loss angle value becomes 5 or more smaller at a slope of 1.4/minute or more.

A method for producing polymeric microparticle compositions using the steps of: 1) melt processing an immiscible polymeric blend comprising an immiscible polymer matrix and a soluble polymer matrix, 2) dissolving the soluble polymer matrix of the immiscible polymeric blend using a solvent to yield a polymeric microparticle composition, and 3) isolating the polymeric microparticle composition.

A polymer-based substrate is proposed, which in particular is electrostatically coatable, wherein the substrate comprises a substrate base body made using a polymeric material and a coating applied to a surface region of the substrate base body, wherein the polymeric material comprises a first polymer, wherein the coating comprises a matrix polymer and an additive which is dispersed in the matrix polymer and reduces the surface resistance of the coating, said additive having a proportion that is selected such that the specific surface resistance of the coating is about 10.sup.10 Ohm or less, and wherein the matrix polymer is selected such that it is compatible with the first polymer.

A fiber-reinforced resin composition includes a polyamide resin and a polyolefin resin, and when one resin between the polyamide resin and the polyolefin resin is set as a first resin, and the other resin is set as a second resin, the composition has a sea-island structure including a continuous phase C consisting of the first resin and a dispersed phase c consisting of the second resin dispersed in the continuous phase C, and in a resin phase separation cross-sectional structure, a total of cross-sectional areas of dispersed phases having a cross-sectional area equal to or smaller than an average cross-sectional area of the reinforcing fiber is 20% or less with respect to a total of cross-sectional areas of all dispersed phases.

The invention is directed to a resin composition containing polycarbonate, reinforced fibers and a compatibilizer having a reactive cyclic group, a resin molded article containing polycarbonate, reinforced fibers and a compatibilizer having a reactive cyclic group, and a method for preparing a resin composition including molten kneading polycarbonate, reinforced fibers and compatibilizer having a reactive cyclic group.