Provided is a resin composition, comprising epoxy resin, oxydianiline type benzoxazine resin, styrene-maleic anhydride resin and tetra-phenol resin. The resin composition may be baked for producing products such as prepregs, resin films, resin-coated coppers, laminates and printed circuit boards, which satisfy one or more or all of desirable properties such as higher dimensional stability after a reflow process, better thermal resistance after horizontal black oxide process, low dielectric constant, low dissipation factor, high thermal resistance and flame retardancy.

Disclosed are fluorinated vinyl polymer resin compositions, and prepregs and laminate materials containing the same. The fluorinated vinyl polymer resin composition includes a fluorine-substituted vinyl polymer resin and a functional polymer, where the fluorine-substituted vinyl polymer resin has the chemical structure:

##STR00001## where the maximum particle size is less than about 100 microns, at least one of the substituents R.sub.1, R.sub.2, R.sub.3, and R.sub.4 includes a fluorine atom, and where n is greater than about 100. The fluorinated vinyl polymer resin composition can be incorporated in prepreg and laminate materials.

A process of preparing polybenzoxazines using an alkylammonium salt of an acid having a pKa in acetonitrile of 9 or more as catalyst is described.

The technology discloses a halogen-free resin composition and a prepreg and a laminate used for a printed circuit. The resin composition comprises: alkyl phenol epoxy resin; benzoxazine resin, alkyl phenol novolac curing agent, and phosphorus-containing flame retardant. The alkyl phenol epoxy resin has many alkyl branched chains in its molecular structure, making the composition have excellent dielectric properties, a higher glass transition temperature, low water absorption, and good heat resistance. Mixing benzoxazine resin into the composition can further reduce dielectric constant, dielectric loss value and water absorption of the cured product. With an alkyl phenol novolac curing agent, the molecular structure will have many alkyls, excellent dielectric properties and low water absorption. A prepreg and a laminate used for printed circuit prepared using the resin composition have low dielectric constants, dielectric loss factors, and water absorption, high dimensional stability, high thermal resistance and good flame retardancy, processability and chemical resistance.

An ion exchange-functionalized polymer molecule includes a repeating unit having a benzimidazole unit as at least part of a main chain, a side chain, or both. The ion exchange-functionalized polymer molecule also includes an ion exchange group linked to the repeating unit. The ion exchange group may be a tetravalent boron group or a metal fluoride, and the metal fluoride may be a multivalent metal atom.

Disclosed is a resin composition, comprising the following components: (A) 100 parts by weight of an epoxy resin; (B) 10 to 60 parts by weight of a diamino diphenyl ether type benzoxazine resin having a softening point of 40 C. to 140 C.; (C) 10 to 40 parts by weight of a co-hardener; and (D) 10 to 40 parts by weight of a flame retardant which comprises (d1) a high melting point flame retardant with a melting point of greater than 260 C. or (d2) a metal phosphinate flame retardant, wherein the metal is selected from Group IIIA elements. Also disclosed is an article of manufacture obtained from the resin composition and a use thereof. Accordingly, the demands of high frequency application can be met, and a balance of low thermal expansion, high thermal resistance and low warpage in the system can be struck.

A resin composition containing a cyclic epoxy-modified silicone compound (A) represented by formula (1), a cyanic acid ester compound (B) and/or a phenol resin (C) and an inorganic filler (D): ##STR00001##
wherein R.sub.a each independently represent an organic group having an epoxy group; R.sub.b each independently represent a substituted or unsubstituted monovalent hydrocarbon group; x represents an integer of 0 to 2; and y represents an integer of 1 to 6; and the siloxane unit marked with x and the siloxane unit marked with y are arranged mutually at random.

An object is to provide a transfer film that can impart sufficient durability performance to a transfer object surface and can also have excellent peeling stability without causing any transfer failures such as tailing and burr. A transfer film including at least a substrate, a release layer provided on the substrate, an intermediate layer provided on the release layer, and a protective layer provided on the intermediate layer, in which the intermediate layer includes a wax component and a rubber component, and the protective layer includes an active light curing resin.

The present invention relates to an epoxy resin composition, comprising the following components: (A) an epoxy resin containing oxazolidinone structure having the structure of the formula (1), (B) an active ester curing agent, and (C) a curing accelerator. The epoxy composition, prepreg, laminate and printed circuit board prepared from such epoxy composition have the following features of low coefficient of thermal expansion, low dielectric loss factor Df less than or equal to 0.0084, low water absorption and excellent moisture and heat resistance.

According to the present invention, a resin composition for a solar-cell encapsulating material includes an ethylene-olefin copolymer of which an MFR measured based on ASTM D1238 under conditions of 190 C. and a load of 2.16 kg is equal to or less than 10 g/10 minutes, a silane coupling agent, and a hindered amine-based photostabilizer. pH of the hindered amine-based photostabilizer, which is measured by using the following measuring method is equal to or less than 9.0. In the measuring method, the pH is measured by using a potential difference measuring device and by using a solution which contains 10 g of acetone, 1 g of water, and 0.01 g of the hindered amine-based photostabilizer, as a sample.