Patent classifications
C08J2481/02
FIBER-REINFORCED RESIN BASE MATERIAL
A fiber reinforced resin base material is formed by impregnating a continuous reinforcing fiber(s) or a reinforcing fiber material having a discontinuous fiber(s) dispersed therein with a resin composition which exhibits a single glass-transition temperature before and after being heated at 400° C. for one hour, wherein the resin composition is composed of (A) a thermoplastic resin having a glass-transition temperature of 100° C. or more and (B) a thermoplastic resin having a glass-transition temperature of less than 100° C.
The fiber reinforced resin base material has excellent impregnation properties and thermal stability, having fewer voids, and having surface quality and high heat resistance.
MOLDED ARTICLE AND PRODUCTION METHOD THEREFOR
A molded product having both small specific gravity and high stiffness and also suffering few sink marks is described along with a method for the production thereof, where the molded product includes a porous body (A) integrated with an injection molded body (B), the porous body (A) having an apparent density of 0.05 to 0.8 g/cm.sup.3, the average thickness (tA) of the porous body (A) and the average thickness (tB) of the injection molded body (B) satisfying the relation tA3tB, and the injection molded body (B) covering at least one face of the porous body (A).
Methods And Compositions For Adhering Polysulfides Or Polythioethers to Thermoplastic Or Thermoset Materials
Disclosed herein are methods and compositions for preparing a surface comprising thermoplastic or thermoset material to receive a polysulfide or polythioether sealant or coating, the method comprising applying to the surface an activating composition consisting of a tetraalkoxide of a Group 4 metal, a complex of an alkoxide of a Group 4 metal, or a combination thereof.
THERMALLY CONDUCTIVE ELECTRICAL INSULATION MATERIAL
A thermally conductive, electrical insulating nonwoven material is described that comprises 20 wt. %-50 wt. % organic components, wherein the organic components comprise wherein the organic components comprise organic drawn fibers, organic bi-component binder fibers, and a polymer latex binder comprising at least one of an acrylic latex, an acrylic copolymer latex, a nitrile latex, and a styrene latex; and 50 wt. %-80 wt. % inorganic components wherein the inorganic components comprise a blend of thermally conductive fillers and clay. The organic bi-component binder fibers have a polymeric core and a sheath layer surrounding the polymeric core wherein the sheath layer has a lower melting point than the core.
Prepreg sheet
The prepreg sheet, which is an intermediate of molded articles, has a nonwoven fabric having carbon fibers and thermoplastic resin fibers, wherein the prepreg sheet has a thickness expansion rate of 250% or less after being heated for 90 seconds at a temperature of the melting point of the thermoplastic resin fiber to the melting point+100 C.
Process for preparing free-standing films of conductive polymers
The present invention relates to a process for the preparation of films of conductive polymers, by the technique so-called roll-to-roll, which allows to obtain freestanding films having advantageous features such as toughness, flexibility, ability to adhere to different substrates, a submicron thickness and a very high ratio surface area/thickness; the present films are suitable for use in several technological applications, in particular for the development of biosensors, and in the production of flexible electronic components with large surface, suitable for wearable devices and also intended for contacting skin.
HIGHLY FILLER-FILLED HIGHLY THERMALLY-CONDUCTIVE THIN SHEET HAVING SUPERIOR ELECTRICAL CHARACTERISTICS, CONTINUOUS MANUFACTURING METHOD AND CONTINUOUS MANUFACTURING DEVICE FOR SAME, AND MOLDED PRODUCT OBTAINED USING THIN SHEET
A high filler-loaded thermally conductive thin sheet is obtained by uniformly dispersing a mixture containing organic polymer particles and highly thermally conductive filler particles using a pulverizer or a mixer to obtain a powder composition, conveying the powder composition at a constant thickness between two belts of a double belt press device, and continuously heating and pressurizing the powder composition at a temperature higher than or equal to a deflection temperature under load, melting point, or a glass transition temperature of the organic polymer and at a specific pressure and then cooling and solidifying the powder composition in the double belt press device.
Methods and compositions for adhering polysulfides or polythioethers to thermoplastic or thermoset materials
Disclosed herein are methods and compositions for preparing a surface comprising thermoplastic or thermoset material to receive a polysulfide or polythioether sealant or coating, the method comprising applying to the surface an activating composition consisting of a tetraalkoxide of a Group 4 metal, a complex of an alkoxide of a Group 4 metal, or a combination thereof.
PREPREG SHEET
The prepreg sheet, which is an intermediate of molded articles, has a nonwoven fabric having carbon fibers and thermoplastic resin fibers, wherein the prepreg sheet has a thickness expansion rate of 250% or less after being heated for 90 seconds at a temperature of the melting point of the thermoplastic resin fiber to the melting point+100 C.
MULTILAYER BARRIER STACK
Multilayer barrier films and methods of making the films are provided. The films include a smooth layer and a barrier layer directly disposed on the smooth layer. In some cases, the smooth layer includes a thiol-ene material as a polymeric matrix material. In some cases, the films have a sandwich structure of barrier layer/smooth layer/substrate/smooth layer/barrier layer.