The present disclosure provides thionated polymers, comprising one or more aromatic groups and at least one S.sub.x group, wherein x is 1-200, wherein the thionated polymer comprises about 50% by weight or less, based on the weight of the thionated polymer, of substituents on the backbone of the thionated polymer that absorb at a wavelength of about 700 to about 6200 nm. Also provided are substrates such as films, glass substrates, and optical devices comprising a thionated polymer and processes for preparing a thionated polymer described herein.

A core/shell polymer material suitable for three-dimensional printing is provided. The core/shell polymer material may include at least one amorphous polymer as a core particle and at least one semicrystalline polymer as a shell material surrounding the core particle.

A core/shell polymer material suitable for three-dimensional printing is provided. The core/shell polymer material may include at least one amorphous polymer as a core particle and at least one semicrystalline polymer as a shell material surrounding the core particle.

A fiber-reinforced plastic substrate is described in which a plurality of resins having different properties are firmly compounded and that includes components [A], [B], and [C]: [A] reinforcing fibers; [B] thermoplastic resin (b); and [C] thermoplastic resin (c),
wherein the component [A] is arranged in one direction, in the fiber-reinforced plastic substrate, a resin area including the component [B] and a resin area including the component [C] are present, the resin area including the component [B] is present on a surface of one side of the fiber-reinforced plastic substrate, and a distance Ra.sub.(bc) between Hansen solubility parameters of the component [B] and the component [C] satisfies formula (1):

Ra.sub.(bc)={4(δDB−δDC).sup.2+(δPB−δPC).sup.2+(δHB−δHC).sup.2}.sup.1/2≥8

wherein Ra.sub.(bc), δDB, δDC, δPB, δPC, δHB and δHC are as defined.

A core/shell polymer material suitable for three-dimensional printing is provided. The core/shell polymer material may include at least one amorphous polymer as a core particle and at least one semicrystalline polymer as a shell material surrounding the core particle.

A method of activating a surface of a plastics substrate formed from: (a) polyaryletherketone such as polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK); (b) a polymer containing a phenyl group directly attached to a carbonyl group, for example polybutadiene terephthalate (PBT) optionally wherein the carbonyl group is part of an amide group, such as polyarylamide (PARA); (c) polyphenylene sulfide (PPS); or (d) polyetherimide (PEI); for subsequent bonding,
the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation: includes radiation with wavelength in the range from about 10 nm to about 1000 nm; the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cm.sup.2 to about 300 J/cm.sup.2.

Hard to bond substrates are then more easily subsequently bonded for example using acrylic, epoxy or anaerobic adhesive.

A fiber-reinforced thermoplastic resin includes a continuous fiber base material made from continuous reinforcing fibers, and a thermoplastic resin applied to the surface thereof. The thermoplastic resin coats the entire surface of the continuous fiber base material in a solidified state, and impregnates the continuous fiber base material while leaving voids therein, with these voids being formed intermittently in the direction in which the fibers are arranged. A laminate uses the fiber-reinforced thermoplastic resin base material.

A polymer composition comprising at least one polyaryletherketone, at least one polyarylene sulfide, and a plurality of reinforcing fibers is provided. The composition has a melt viscosity of about 250 Pa-s or less as determined in accordance with ISO Test No. 11443:2005 at a shear rate of 1,000 seconds.sup.−1 and temperature of about 380° C.

Provided is a prepreg including the following constituents [A] to [C], the prepreg satisfying the following conditions [I] to [III]: [A]: a sizing agent-coated carbon fiber; [B]: an epoxy resin having a specific structure; and [C]: a hardener for [B], [I]: an epoxy resin composition including the constituents [B] and [C] has a nematic-isotropic phase transition temperature in a temperature range of 130° C. to 180° C.; [II] a prepreg after isothermal holding at 100° C. for 30 minutes does not have a high-order structure originated from a diffraction angle of 2θ=1.0° to 6.0° measured by wide angle X-ray diffraction at 100° C.; and [III]: a prepreg after isothermal holding at 180° C. for 2 hours has a high-order structure originated from the diffraction angle of 2θ=1.0° to 6.0° measured by wide angle X-ray diffraction at 180° C.

Disclosed herein are methods and compositions for preparing a surface comprising thermoplastic or thermoset material to receive a polysulfide or polythioether sealant or coating, the method comprising applying to the surface an activating composition consisting of a tetraalkoxide of a Group 4 metal, a complex of an alkoxide of a Group 4 metal, or a combination thereof.