Pre-impregnated composite material (prepreg) that can be cured/molded to form aerospace composite parts. The prepreg includes carbon reinforcing fibers and an uncured resin matrix. The resin matrix includes an epoxy resin component, polyethersulfone as a toughening agent, a thermoplastic particle component, a nanoparticle component and a curing agent.

A method of removing metal ions is provided, which includes contacting a metal removal composition with a solution containing metal ions for removing the metal ions from the solution, wherein the metal removal composition includes a polymer with a chemical structure of: ##STR00001##
wherein Q is a quinoline-based group, n=90˜450, o=10˜50, and p=0˜20. The metal removal composition has a type of fiber or film. In addition, the metal removal composition has a porosity of 60% to 90%.

An object of the present invention is to provide a composition capable of forming a thermally conductive sheet having excellent peel strength. In addition, another object of the present invention is to provide a thermally conductive sheet formed of the composition and a device with a thermally conductive sheet.

The composition of the present invention contains a disk-like compound, a high-molecular-weight compound which is at least one selected from the group consisting of a thermoplastic resin and rubber, and inorganic particles.

Provided is a composite prepreg including a region (A) containing a thermosetting resin (a) and a reinforcing fiber and a region (B) containing a thermosetting resin (b) and a reinforcing fiber, the composite prepreg satisfying conditions (i) and (ii) or satisfying conditions (ii) and (iii):

(i) The thermosetting resin (b) is a resin having a gel time Tb longer than a gel time Ta of the thermosetting resin (a), and in at least a part of a temperature range of 40° C. or more and 180° C. or less, satisfy Ta/Tb 0.8;

(ii) A ratio of the region (A) on a surface of the composite prepreg is 20 to 80%; and

(iii) The thermosetting resin (b) is a resin having a higher heat generation starting temperature Eb than a heat generation starting temperature Ea of the thermosetting resin (a), and in a differential scanning calorimetry chart obtained by measuring at 5° C./min with 40° C. as a starting temperature, satisfy Eb−Ea≥30.

Pre-impregnated composite material (prepreg) that can be cured/molded to form aerospace composite parts. The prepreg includes carbon reinforcing fibers and an uncured resin matrix. The resin matrix includes an epoxy component that is a combination of a hydrocarbon epoxy novolac resin and a trifunctional epoxy resin and optionally a tetrafunctional epoxy resin. The resin matrix includes polyethersulfone as a toughening agent and a thermoplastic particle component.

Pre-impregnated composite material (prepreg) that can be cured/molded to form aerospace composite parts. The prepreg includes carbon reinforcing fibers and an uncured resin matrix. The resin matrix includes an epoxy component that is a combination of a hydrocarbon epoxy novolac resin and a trifunctional epoxy resin and a tetrafunctional epoxy resin. The resin matrix includes polyethersulfone as a toughening agent and a thermoplastic particle component that includes a mixture of polyamide particles and polyimide particles.

Adhesive compositions are described that significantly improve the adhesion of polymer overmold compositions to metal substrates in polymer-metal junctions. The adhesive compositions include one or more poly(aryl ether) polymers, where each of the poly(aryl ether) polymers is, independently, a poly(aryl ether sulfone) polymer or a poly(aryl ether ketone) polymer. The overmold composition includes at least one poly(aryl ether ketone) polymer. Polymer-Metal junctions can be formed by, for example, dip-coating, spin-coating, extruding, or injection molding the adhesive composition and/or the overmold composition onto the metal substrate. Desirable applications settings for the polymer-metal junctions described include, but are not limited to electrical wiring.

A epoxy resin composition includes a given epoxy resin [A], an aromatic amine compound [B], an organic acid hydrazide compound [C] having a structural formula represented by general formula (I) or (II) (X is a structure selected from among monocyclic and polycyclic aromatic ring structures, polycyclic aromatic ring structures, and aromatic heterocyclic structures and optionally has, as a substituent, any of C.sub.4 or lower alkyl groups, a hydroxy group, and an amino group), and a thermoplastic resin [D], wherein the amount of the constituent element [C] is 1-25 parts by mass per 100 parts by mass of the constituent element [A], the epoxy resin composition, after having been held at 80° C. for 2 hours, having a viscosity which is up to 2.0 times the initial viscosity at 80° C.

##STR00001##

A novel material for producing auxetic foams is disclosed. The material comprises a multiphase, multicomponent polymer foam with a filler polymer having a carefully selected glass transition temperature. Novel methods for producing auxetic foams from the material are also disclosed that consistently, reliably and quickly produce auxetic polyurethane foam at about room temperature (25° C.). This technology overcomes challenging issues in the large-scale production of auxetic PU foams, such as unfavorable heat-transmission problem and harmful organic solvents.

Provided are: an epoxy resin composition having exceptional performance with regard to impregnating reinforcing fibers, enabling optimal control of resin flow during molding, and having exceptional in-plane shear strength; a cured epoxy resin product; and a prepreg. An epoxy resin composition comprising at least the following constituent elements [A], [B], and [C]: [A] an epoxy resin, [B] a polyether sulfone having a weight-average molecular weight of 2000-20000 g/mol, [C] a curing agent