Provided is a barrier film comprising a base layer, and an inorganic layer including Si, N, and O, and including a first region and a second region, which have different elemental contents (atomic %) of Si, N, and O from each other as measured by XPS, wherein the film has a water vapor transmission rate of 5.0?10.sup.?4 g/m.sup.2.Math.day or less as measured under conditions of a temperature of 38? C. and 100% relative humidity after being stored at 85? C. and 85% relative humidity conditions for 250 hours, or wherein the inorganic layer has a compactness expressed through an etching rate of 0.17 nm/s in the thickness direction for an Ar ion etching condition to etch Ta.sub.2O.sub.5 at a rate of 0.09 nm/s. The barrier film has excellent barrier properties and optical properties and can be used for electronic products that are sensitive to moisture and the like.

Multilayer constructions are provided, for instance including a barrier layer, a sealing layer, and a polymer layer. The barrier layer has a major surface on which the sealing layer is disposed, and the sealing layer includes crosslinked silsesquioxane. The polymer layer includes a crosslinked polymer, and is disposed adjacent to a major surface of the barrier layer opposite from the sealing layer. The multilayer construction may further include additional layers, such as a substrate. Devices are also provided including the multilayer constructions.

Provided are: a composition for a window film, containing a silicone resin comprising chemical formula 1 below, a cross-linking agent, and an initiator; a window film formed therefrom; and a flexible display device comprising the same. (R1SiO.sub.3/2).sub.x(SiO.sub.3/2-Q-SiO.sub.3/2).sub.y(R.sub.2SiO.sub.3/2).sub.z (In chemical formula 1, R1 and R2 are each independently a cycloaliphatic epoxy group, a cycloaliphatic epoxy group-containing functional group, a glycidyl group, or a glycidyl group-containing functional group; Q is R3 or -A1-T-A2-; R3 is a substituted or unsubstituted C1 to C10 alkylene group, or a substituted or unsubstituted C6 to C30 arylene group; A1 and A2 are each independently a single bond, or a substituted or unsubstituted C1 to C5 alkylene group; T is a mono- or polyalkylene oxide group, or an imide group-containing functional group; and 0<x<1, 0<y<1, 0?z<1, and x+y+z=1.

Provided are: a composition for a window film, containing a siloxane resin including chemical formula 1, a cross-linking agent, and an initiator; a flexible window film formed therefrom; and a flexible display device including the same.

A composition includes a polymer base resin, a fiber filler including a sizing agent component, and an additive. The sizing agent component includes a sizing agent and a reactive aid. The composition exhibits a notched Izod impact strength of 140 to 190 J/m, and an unnotched impact strength of 500 to 1200 J/m when tested in accordance with ASTM D256.

The present invention relates to a gas barrier film and a manufacturing method therefor, the gas barrier film comprising: a base; and a barrier layer formed on one surface of the base, wherein the barrier layer has a nitrogen (N) atomic percent of about 1% to about 6%. The gas barrier film, according to the present invention, has an excellent gas barrier property, scratch resistant property, flexibility, transparency and crack prevention effect, and the method for manufacturing the same can be performed by non-vacuum wet coating, and thus a manufacturing time is short, and process performance is excellent.

A method is provided for producing a modified polysilazane-cured coating that densifies a coating made of a polysilazane compound in a short period of time. This method provides a coating having a sufficiently low water vapor transmission rate in a short period of time. Additionally, this method provides a modified polysilazane-cured coating. To cure the coating containing polysilazane, it is irradiated with vacuum ultraviolet (VUV) light at an intensity within a specific range. The method includes a step of applying a base material containing the polysilazane compound represented by formula (1) to form a coating and irradiating the coating with Xe excimer light to modify the polysilazane compound and form a cured coating of the modified polysilazane compound. The illuminance of the Xe excimer light in the curing step is set to a range of 280 to 450 mW/cm.sup.2.

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