Patent classifications
C08K3/01
Bisphenol polymer precursor replacements
Use of biologically-derived polyphenols for the preparation of epoxy resins is described. Examples of biologically-derived polyphenols include resveratrol, genistein, daidzein, and polyphenols synthesized from tyrosine. Because the epoxy resins are prepared from biologically-derived materials, they provide epoxy resins that will degrade into biologically harmless materials. The epoxy resins can be used to provide coating compositions.
BLOW MOLDING COMPOSITION AND PROCESS
This invention provides a blow molding composition comprising a high molecular weight, chromium catalyzed ethylene copolymer (also referred to as a polyethylene resin) and a nucleating agent. The composition enables a more efficient blow molding process by reducing the number of malformed/rejected parts that are produced when the process is operated at high rates. In a preferred embodiment, the malformed parts may be reground and added to “virgin” composition for the production of prime parts.
BLOW MOLDING COMPOSITION AND PROCESS
This invention provides a blow molding composition comprising a high molecular weight, chromium catalyzed ethylene copolymer (also referred to as a polyethylene resin) and a nucleating agent. The composition enables a more efficient blow molding process by reducing the number of malformed/rejected parts that are produced when the process is operated at high rates. In a preferred embodiment, the malformed parts may be reground and added to “virgin” composition for the production of prime parts.
Heat-storage composition
A heat storage composition (20) of the present invention includes a matrix resin (21) and heat storage inorganic particles (22). The heat storage inorganic particles (22) are composed of a material that undergoes an electronic phase transition and has a latent heat of 1 J/cc or more for the electronic phase transition. The amount of the heat storage inorganic particles is 10 to 2000 parts by weight with respect to 100 parts by weight of the matrix resin. The heat conductivity of the heat storage composition is 0.3 W/m.Math.K or more. The heat storage composition may further include heat conductive particles (23, 24). The heat storage inorganic particles are preferably metal oxide particles containing vanadium as the main metal component. The heat storage composition has high heat storage properties and high heat conduction properties, and is used as a heat storage silicone material provided between a heat generating component and a case. Since heat from the heat generating component is temporarily stored in the heat storage composition so that the heat conduction is delayed, the heat is diffused during the delay to eliminate partial heating, thereby resulting in uniform heat dissipation.
Heat-storage composition
A heat storage composition (20) of the present invention includes a matrix resin (21) and heat storage inorganic particles (22). The heat storage inorganic particles (22) are composed of a material that undergoes an electronic phase transition and has a latent heat of 1 J/cc or more for the electronic phase transition. The amount of the heat storage inorganic particles is 10 to 2000 parts by weight with respect to 100 parts by weight of the matrix resin. The heat conductivity of the heat storage composition is 0.3 W/m.Math.K or more. The heat storage composition may further include heat conductive particles (23, 24). The heat storage inorganic particles are preferably metal oxide particles containing vanadium as the main metal component. The heat storage composition has high heat storage properties and high heat conduction properties, and is used as a heat storage silicone material provided between a heat generating component and a case. Since heat from the heat generating component is temporarily stored in the heat storage composition so that the heat conduction is delayed, the heat is diffused during the delay to eliminate partial heating, thereby resulting in uniform heat dissipation.
Fluoropolymer composition for components of light emitting apparatuses
The invention pertains to a fluoropolymer composition comprising certain tetrafluoroethylene/perfluoromethyvinylether copolymers having well-defined TFE/MVE monomer composition and possessing low molecular weight and a white pigment, to the use of this latter for manufacturing shaped articles, and to shaped articles therefrom, including components of light emitting apparatuses, e.g. LED assemblies.
ONE-SIDE-PROTECTED POLARIZING FILM, PRESSURE-SENSITIVE-ADHESIVE-LAYER-ATTACHED POLARIZING FILM, IMAGE DISPLAY DEVICE, AND METHOD FOR CONTINUOUSLY PRODUCING SAME
A one-side-protected polarizing film having a transparent protective film on only one surface of a polarizer, wherein: the polarizer contains a polyvinyl alcohol-based resin, has a thickness of 10 μm or less, and is designed to have a single-body transmittance T and a polarization degree P representing optical properties satisfying the condition of the following formula: P>−(10.sup.0.929T−42.4−1)×100 (provided that T<42.3) or P≧99.9 (provided that T≧42.3); and the other surface of the polarizer has a transparent layer thereon satisfying formula 1 (F≧3) and formula 2 (C≧e.sup.−0.7F), given that the thickness thereof is F (μm) and the compressive elastic modulus thereof at 80° C. is C (GPa). Even when the polarizer has prescribed optical properties and the thickness is 10 μm or less, this one-side-protected polarizing film is capable of suppressing through cracks and nano-slits.
THERMALLY CONDUCTIVE SILICONE COMPOSITION AND THERMALLY CONDUCTIVE SILICONE MATERIAL
A thermally conductive silicone composition contains a silicone component and a polyhedral filler.
RESIN COMPOSITION, OPTICAL SEMICONDUCTOR ELEMENT, AND OPTICAL SEMICONDUCTOR DEVICE
The present invention relates to a resin composition containing a transparent resin and a light absorber, wherein a cured product of the resin composition has an absorption maximum wavelength in a wavelength range of 550 to 720 nm.
RESIN COMPOSITION, OPTICAL SEMICONDUCTOR ELEMENT, AND OPTICAL SEMICONDUCTOR DEVICE
The present invention relates to a resin composition containing a transparent resin and a light absorber, wherein a cured product of the resin composition has an absorption maximum wavelength in a wavelength range of 550 to 720 nm.