A method for indirect additive manufacturing of an object, the method comprising: (i) separately feeding a powder from which said object is to be manufactured and either a difunctional curable monomer according to Formula (I) or an adhesive polymer binder into an additive manufacturing device; (ii) dispensing selectively positioned droplets of said difunctional curable monomer or adhesive polymer binder, from a printhead of said additive manufacturing device, into a bed of said powder to bind particles of said powder with said difunctional curable monomer or adhesive polymer binder to produce a curable preform having a shape of the object to be manufactured; and, in the case of the difunctional curable monomer, (iii) curing said curable preform to form a crosslinked object.

Degradable downhole tools, tool components, and balls are formed from a processed polyvinyl alcohol (PVA) compound that is degradable in a high-salinity environment. The PVA compound exhibits strength and elasticity properties that are comparable to existing degradable downhole polymers and further exhibits degradability properties that are superior to existing degradable downhole polymers, particularly in high-salinity fluids. For different components, the PVA compound may include a reinforcing material such as fiberglass. The PVA compound also includes a loading of degradable metal, such as a degradable magnesium alloy, rendering the material degradable at high salinity. Usage of tools, tool components, and balls formed from the disclosed materials eliminates the requirement that such equipment be drilled out after use as the PVA compound quickly degrades in high-salinity downhole fluids.

Degradable downhole tools, tool components, and balls are formed from a processed polyvinyl alcohol (PVA) compound that is degradable in a high-salinity environment. The PVA compound exhibits strength and elasticity properties that are comparable to existing degradable downhole polymers and further exhibits degradability properties that are superior to existing degradable downhole polymers, particularly in high-salinity fluids. For different components, the PVA compound may include a reinforcing material such as fiberglass. The PVA compound also includes a loading of degradable metal, such as a degradable magnesium alloy, rendering the material degradable at high salinity. Usage of tools, tool components, and balls formed from the disclosed materials eliminates the requirement that such equipment be drilled out after use as the PVA compound quickly degrades in high-salinity downhole fluids.

Disclosed is an oxidatively drying alkyd resin composition and a method for preparing said composition. Said composition is obtained by admixing an aqueous silica sol into a substantially 100% alkyd resin being in a liquid state either at ambient temperature or at an elevated temperature. Said silica sol is added in an amount of 0.1-10% by weight calculated as 100% silica on 100% alkyd resin. The use of a said composition is in a further aspect disclosed.

Provided is a resin composition containing polymethallyl alcohol (A) having a repeating structural unit represented by the following formula (1) in an amount of greater than or equal to 30 mol %, and a metal ion (B), a content of the metal ion (B) being greater than or equal to 0.05 μmol per 1 g of the polymethallyl alcohol (A); a method of producing the resin composition; and a molding containing the resin composition.

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Provided is a resin composition containing polymethallyl alcohol (A) having a repeating structural unit represented by the following formula (1) in an amount of greater than or equal to 30 mol %, and a metal ion (B), a content of the metal ion (B) being greater than or equal to 0.05 μmol per 1 g of the polymethallyl alcohol (A); a method of producing the resin composition; and a molding containing the resin composition.

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Provided is a resin composition containing polymethallyl alcohol (A) having a repeating structural unit represented by the following formula (1) in an amount of greater than or equal to 30 mol %, and a metal ion (B), a content of the metal ion (B) being greater than or equal to 0.05 μmol per 1 g of the polymethallyl alcohol (A); a method of producing the resin composition; and a molding containing the resin composition.

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A composition exhibits excellent heat resistance and mounting reliability when bonding a semiconductor power element to a metal lead frame, which is also free of lead and thereby places little burden on the environment. An electrically conductive composition contains at least a sulfide compound represented by R—S—R′ (wherein R is an organic group containing at least carbon; R′ is an organic group that is the same as or different from R; and R and R′ may be bonded to each other to form a so-called cyclic sulfide) and metal particles containing at least Cu, Sn or Ni as its essential component. Further, a conductive paste and a conductive bonding film each are produced using the electrically conductive composition. A dicing die bonding film is obtained by bonding the conductive bonding film with an adhesive tape.

A composition exhibits excellent heat resistance and mounting reliability when bonding a semiconductor power element to a metal lead frame, which is also free of lead and thereby places little burden on the environment. An electrically conductive composition contains at least a sulfide compound represented by R—S—R′ (wherein R is an organic group containing at least carbon; R′ is an organic group that is the same as or different from R; and R and R′ may be bonded to each other to form a so-called cyclic sulfide) and metal particles containing at least Cu, Sn or Ni as its essential component. Further, a conductive paste and a conductive bonding film each are produced using the electrically conductive composition. A dicing die bonding film is obtained by bonding the conductive bonding film with an adhesive tape.

This disclosure relates to materials prepared using a laser-direct structuring (LDS) method. The LDS materials of the present disclosure comprise polymeric film or polymeric sheet structures containing a LDS additive and which can undergo laser-direct structuring and chemical plating to form conductive paths on their surface. The present disclosure finds use, for example, in the automotive, electronics, RFID, communications, and medical device industries.