The present application relates to electro-polarizable particle, a preparation method thereof and an electro-polarizable allochroic optical film, belonging to the technical field of electro-polarizable allochroic optical film devices. The present application discloses electro-polarizable particle, whose raw materials include a metal iodide, a carboxylic acid nitrogenous organic molecule, iodine and a cellulose suspending agent; the electro-polarizable particle have a rod-shaped structure, a length of 100-2000 nm, and a width of 10-200 nm. The present application further discloses a preparation method for electro-polarizable particle, and also discloses an electro-polarizable allochroic optical film containing the electro-polarizable particle.

The present application relates to electro-polarizable particle, a preparation method thereof and an electro-polarizable allochroic optical film, belonging to the technical field of electro-polarizable allochroic optical film devices. The present application discloses electro-polarizable particle, whose raw materials include a metal iodide, a carboxylic acid nitrogenous organic molecule, iodine and a cellulose suspending agent; the electro-polarizable particle have a rod-shaped structure, a length of 100-2000 nm, and a width of 10-200 nm. The present application further discloses a preparation method for electro-polarizable particle, and also discloses an electro-polarizable allochroic optical film containing the electro-polarizable particle.

The present invention concerns an electroless gold plating bath comprising a) gold ions; b) sulfite ions; c) iodide ions; d) at least one phosphonate compound according to formula (1) ##STR00001## wherein each X is independently an alkanediyl group; R.sup.1, R.sup.2, R.sup.3 and each R.sup.4 are independently alkanediyl groups; M is independently hydrogen, a metal atom or a cation forming radical; each n is a rational number and selected in accordance with the valency of the respective M; and b is an integer ranging from 1 to 10.
The invention further is directed to the use of the bath and a method for depositing a gold layer on a surface of a substrate. The bath is particularly suitable in the manufacture of printed circuit boards, IC substrates, semiconducting devices, interposers made of glass and the like.

The present invention concerns an electroless gold plating bath comprising a) gold ions; b) sulfite ions; c) iodide ions; d) at least one phosphonate compound according to formula (1) ##STR00001## wherein each X is independently an alkanediyl group; R.sup.1, R.sup.2, R.sup.3 and each R.sup.4 are independently alkanediyl groups; M is independently hydrogen, a metal atom or a cation forming radical; each n is a rational number and selected in accordance with the valency of the respective M; and b is an integer ranging from 1 to 10.
The invention further is directed to the use of the bath and a method for depositing a gold layer on a surface of a substrate. The bath is particularly suitable in the manufacture of printed circuit boards, IC substrates, semiconducting devices, interposers made of glass and the like.

Disclosed herein is a polymeric film, the film comprising a polymeric matrix material, a plurality of perovskite nanocrystals and/or aggregates of perovskite nanocrystals dispersed throughout the polymeric matrix material. There is also disclosed a perovskite polymer resin composition, a perovskite-polymer resin composition, a perovskite ink and a method of forming a luminescent film using any one of the compositions or ink. Preferably, the perovskite material is a lead halide perovskite containing a cation selected from Cs, an alkylammonium ion, or a formamidinium ion. The polymeric matrix is preferably formed from monomers comprising a vinyl or an acrylate group.

Disclosed herein is a polymeric film, the film comprising a polymeric matrix material, a plurality of perovskite nanocrystals and/or aggregates of perovskite nanocrystals dispersed throughout the polymeric matrix material. There is also disclosed a perovskite polymer resin composition, a perovskite-polymer resin composition, a perovskite ink and a method of forming a luminescent film using any one of the compositions or ink. Preferably, the perovskite material is a lead halide perovskite containing a cation selected from Cs, an alkylammonium ion, or a formamidinium ion. The polymeric matrix is preferably formed from monomers comprising a vinyl or an acrylate group.

Materials from the group consisting of a) one or more hybrid materials containing an organic polymer from the group of the polyamides, polyimides and epoxy resins and an inorganic oligo- or polymer from the group of the oligo- and polysiloxanes and heterocondensates of Si with Ti, Zr and/or Al, wherein the organic and the inorganic component are covalently bound to one another, in combination with one or more inorganic sols based on silyl alkoxylates and/or titanium alkoxylates, wherein hybrid material and inorganic sol are crosslinked, b) one or more hybrid materials containing an organic polymer from the group of the polyamides, polyimides and epoxy resins and an inorganic oligo- or polymer from the group of the oligo- and polysiloxanes and heterocondensates of Si with Ti, Zr and/or Al, wherein the organic and the inorganic component are covalently bound to one another, c) one or more inorganic sols based on silyl alkoxylates and/or titanium alkoxylates and d) one or more polyamides, polyimides and/or epoxy resins mixed with oxidic and/or non-oxidic metal and/or metalloid particles, preferably from the group of the oxides, nitrides, carbides and mixtures thereof,
are suitable as adhesive for the bonding of metals, plastics, concrete and/or ceramics.

Materials from the group consisting of a) one or more hybrid materials containing an organic polymer from the group of the polyamides, polyimides and epoxy resins and an inorganic oligo- or polymer from the group of the oligo- and polysiloxanes and heterocondensates of Si with Ti, Zr and/or Al, wherein the organic and the inorganic component are covalently bound to one another, in combination with one or more inorganic sols based on silyl alkoxylates and/or titanium alkoxylates, wherein hybrid material and inorganic sol are crosslinked, b) one or more hybrid materials containing an organic polymer from the group of the polyamides, polyimides and epoxy resins and an inorganic oligo- or polymer from the group of the oligo- and polysiloxanes and heterocondensates of Si with Ti, Zr and/or Al, wherein the organic and the inorganic component are covalently bound to one another, c) one or more inorganic sols based on silyl alkoxylates and/or titanium alkoxylates and d) one or more polyamides, polyimides and/or epoxy resins mixed with oxidic and/or non-oxidic metal and/or metalloid particles, preferably from the group of the oxides, nitrides, carbides and mixtures thereof,
are suitable as adhesive for the bonding of metals, plastics, concrete and/or ceramics.

A method of preparing an aqueous dispersion of an ethylene-carboxylic acid copolymer according to exemplary embodiments of the present invention includes: mixing 30% by weight or more of an ethylene-(meth)acrylic acid copolymer, a basic compound, and water to form a mixed solution; and adding an inorganic salt compound to the mixed solution. Therefore, the aqueous dispersion of the ethylene-carboxylic acid copolymer may be effectively dispersed.

A method of preparing an aqueous dispersion of an ethylene-carboxylic acid copolymer according to exemplary embodiments of the present invention includes: mixing 30% by weight or more of an ethylene-(meth)acrylic acid copolymer, a basic compound, and water to form a mixed solution; and adding an inorganic salt compound to the mixed solution. Therefore, the aqueous dispersion of the ethylene-carboxylic acid copolymer may be effectively dispersed.