A flowable hardenable composition comprising from 10 to 95 percent by volume of shaped composite particles dispersed in a hardenable binder precursor. The shaped composite particles comprise thermal filler particles having an aspect ratio of at least 1.5 retained in a binder matrix. After hardening, a thermally conductive composition is obtained. An electronic heat sink assembly comprises an electronic component, a heat sink, and the thermally conductive composition sandwiched therebetween.

A flowable hardenable composition comprising from 10 to 95 percent by volume of shaped composite particles dispersed in a hardenable binder precursor. The shaped composite particles comprise thermal filler particles having an aspect ratio of at least 1.5 retained in a binder matrix. After hardening, a thermally conductive composition is obtained. An electronic heat sink assembly comprises an electronic component, a heat sink, and the thermally conductive composition sandwiched therebetween.

One of the objects the present invention to provide a cured product of a thermally conductive silicone composition having high thermal conductivity and excellent compressibility. A silicone composition comprising an organo(poly)siloxane and a thermally conductive filler, wherein the organo(poly)siloxane comprises at least one curable organo(poly)siloxane, the thermally conductive filler comprises (B-i) unsintered aluminum nitride having an average particle size of 20 μm or more and 120 μm or less and (B-ii) alumina having an average particle size of 0.1 μm or more and 5 μm or less, the (B-ii) alumina comprises spherical alumina with 25 to 80 mass % of the spherical alumina, based on a total mass of the component (B-ii), a proportion of the component (B-ii) is 25 to 50 mass %, based on a total mass of the components (B-i) and (B-ii), and a proportion of a volume of the thermally conductive filler is 80 to 90 volume %, based on a total volume of the silicone composition.

One of the objects the present invention to provide a cured product of a thermally conductive silicone composition having high thermal conductivity and excellent compressibility. A silicone composition comprising an organo(poly)siloxane and a thermally conductive filler, wherein the organo(poly)siloxane comprises at least one curable organo(poly)siloxane, the thermally conductive filler comprises (B-i) unsintered aluminum nitride having an average particle size of 20 μm or more and 120 μm or less and (B-ii) alumina having an average particle size of 0.1 μm or more and 5 μm or less, the (B-ii) alumina comprises spherical alumina with 25 to 80 mass % of the spherical alumina, based on a total mass of the component (B-ii), a proportion of the component (B-ii) is 25 to 50 mass %, based on a total mass of the components (B-i) and (B-ii), and a proportion of a volume of the thermally conductive filler is 80 to 90 volume %, based on a total volume of the silicone composition.

The present invention aims to provide a urethane resin and a heat dissipation component each having excellent thermal conductivity and excellent flexibility. The present invention relates to a curable composition containing: a polyol (A); a polyisocyanate (B); at least one dispersant (C) for inorganic fillers selected from the group consisting of a phosphate ester (C1), a C12-C24 fatty acid (C2), a sucrose fatty acid ester (C3), a sorbitan fatty acid ester (C4), and a glycerol fatty acid ester (C5); and an inorganic filler (D), the curable composition satisfying the following requirements (1) to (3) that (1) the polyol (A) contains a polyalkylene glycol (A1) having a chemical formula weight or number average molecular weight of 1000 or less in an amount of 50% by weight or more based on the weight of the polyol (A); (2) the inorganic filler (D) is contained in an amount of 70 to 97% by weight based on the weight of the curable composition; and (3) the total weight of the dispersant (C) for inorganic fillers is 1 to 5 parts by weight per 100 parts by weight of the inorganic filler (D), the phosphate ester (C1) being represented by the following formula (1):

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Provided is a thermally conductive composition containing a liquid resin, a thermally conductive powder, and a dispersant, in which the liquid resin has a viscosity of 10 mPa.Math.s or more and 2,000 mPa.Math.s or less at 25° C., the dispersant is an acrylic silicone, and at least one of the liquid resin and the thermally conductive powder contains an alkyl group having 4 or more carbon atoms.

The present invention provides a thermally conductive material having excellent thermal conductivity. Furthermore, the present invention provides a device with a thermally conductive layer that has a thermally conductive layer containing the thermally conductive material and a composition for forming a thermally conductive material that is used for forming the thermally conductive material. The thermally conductive material according to an embodiment of the present invention contains a cured substance of a disk-like compound, which has one or more reactive functional groups selected from the group consisting of a hydroxyl group, a carboxylic acid group, a carboxylic acid anhydride group, an amino group, a cyanate ester group, and a thiol group, and a crosslinking compound which has a group reacting with the reactive functional groups.

A composition is described comprising a cyclic olefin; a ring opening metathesis polymerization catalyst; and at least 40 wt. % of thermally conductive particles. The thermally conductive particles are selected such that the composition after curing has a thermal conductivity of at least 1W/M*K. In one embodiment, the thermally conductive particle comprises a combination of smaller and larger thermally conductive particles. In another embodiment, the thermally conductive particles comprise boron nitride particles. Also described are (e.g. structural) adhesives, methods of bonding and articles.

A composition is described comprising a cyclic olefin; a ring opening metathesis polymerization catalyst; and at least 40 wt. % of thermally conductive particles. The thermally conductive particles are selected such that the composition after curing has a thermal conductivity of at least 1W/M*K. In one embodiment, the thermally conductive particle comprises a combination of smaller and larger thermally conductive particles. In another embodiment, the thermally conductive particles comprise boron nitride particles. Also described are (e.g. structural) adhesives, methods of bonding and articles.

Disclosed herein is a composition comprising a thiol-terminated compound; an oxidant; and a thermally conductive filler package comprising thermally conductive, electrically insulative filler particles. The thermally conductive, electrically insulative filler particles have a thermal conductivity of at least 5 W/m.Math.K (measured according to ASTM D7984) and a volume resistivity of at least 1 Ω.Math.m (measured according to ASTM D257, C611, or B193) and may be present in an amount of at least 50% by volume based on total volume of the filler package. The thermally conductive filler package may be present in an amount of 15% by volume percent to 90% by volume based on total volume of the composition. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a composition disclosed herein.