A method for preparing a compact of resin compound comprising the following steps (a) to (c): (a) a preparation step of mounting a sheet-shaped or block-shaped compact of resin compound including a resin composition, which contains a filler having magnetic anisotropy and is solidified by curing or by being advanced to a B-stage, on a transportation unit which is movable in the horizontal direction, and covering at least a top surface of the compact of resin compound with a cover material; (b) a step of applying a magnetic field to the compact of resin compound obtained in the step (a) with a bulk superconductor magnet having a central magnetic flux density of 1 T or more; and (c) a step of moving the compact of resin compound in the horizontal direction and scanning it while applying vibrations to the compact of resin compound mounted on a region of a central part of the bulk superconductor magnet under application of a magnetic field.

An ink set including an inkjet ink, and a treatment liquid used in combination with the inkjet ink, wherein the inkjet ink includes a pigment, a water-soluble organic solvent, a surfactant and water, the treatment liquid includes a coagulant, an organic solvent and water, the coagulant includes calcium nitrate in an amount of 21.5 to 41.7% by mass relative to the total mass of the treatment liquid, an amount of organic solvent having a boiling point at one atmosphere of 240° C. or higher in the treatment liquid is not more than 8% by mass, a pH of the treatment liquid is within a range from 3.5 to 10.5, and a viscosity of the treatment liquid at 25° C. is within a range from 5.5 to 18.5 mPa.Math.s.

An ink set including an inkjet ink, and a treatment liquid used in combination with the inkjet ink, wherein the inkjet ink includes a pigment, a water-soluble organic solvent, a surfactant and water, the treatment liquid includes a coagulant, an organic solvent and water, the coagulant includes calcium nitrate in an amount of 21.5 to 41.7% by mass relative to the total mass of the treatment liquid, an amount of organic solvent having a boiling point at one atmosphere of 240° C. or higher in the treatment liquid is not more than 8% by mass, a pH of the treatment liquid is within a range from 3.5 to 10.5, and a viscosity of the treatment liquid at 25° C. is within a range from 5.5 to 18.5 mPa.Math.s.

A curing composition for an epoxy resin compound useful for the chemical fastening of construction elements, an epoxy resin compound, and a multi-component epoxy resin system are provided. A method for the chemical fastening of construction elements in boreholes and a method of using a salt (S) as an accelerator in an epoxy resin compound for chemical fastening, the epoxy resin compound including a Mannich base and an amine which is reactive to epoxy groups.

A curing composition for an epoxy resin compound useful for the chemical fastening of construction elements, an epoxy resin compound, and a multi-component epoxy resin system are provided. A method for the chemical fastening of construction elements in boreholes and a method of using a salt (S) as an accelerator in an epoxy resin compound for chemical fastening, the epoxy resin compound including a Mannich base and an amine which is reactive to epoxy groups.

A problem to be solved by the present invention is that there is no method for forming a dense structure on a porous structure at low cost. In addition, another object is to provide a high quality and inexpensive structure of a brittle material and a laminate thereof as an intermediate layer for facilitating formation of a dense structure on a porous structure. A structure is provided having a brittle particle assembly having a plurality of brittle particles, wherein the brittle particle assemblies are arranged adjacently to each other, and the brittle particles having a brittle material region in the periphery are crosslinked (connected) by the brittle material region to bond the brittle particles to each other, and thereby form a brittle material crosslinked structure region preventing the mobility of the brittle particles.

A problem to be solved by the present invention is that there is no method for forming a dense structure on a porous structure at low cost. In addition, another object is to provide a high quality and inexpensive structure of a brittle material and a laminate thereof as an intermediate layer for facilitating formation of a dense structure on a porous structure. A structure is provided having a brittle particle assembly having a plurality of brittle particles, wherein the brittle particle assemblies are arranged adjacently to each other, and the brittle particles having a brittle material region in the periphery are crosslinked (connected) by the brittle material region to bond the brittle particles to each other, and thereby form a brittle material crosslinked structure region preventing the mobility of the brittle particles.

The present invention relates to a curable resin composition, etc., having excellent in applicability and workability. Specifically, the present invention relates to a resin composition, etc., including: one or more base polymers selected from the group consisting of (A) a polymer having two or more alkenyl groups and (B) a polyorganosiloxane having a hydroxyl group bound to a silicon atom; (C) a silica powder surface-treated with an alkyl silane; and (D) a compound including one or more elements selected from the group consisting of boron, phosphorus, sulfur, and nitrogen.

The present invention relates to a curable resin composition, etc., having excellent in applicability and workability. Specifically, the present invention relates to a resin composition, etc., including: one or more base polymers selected from the group consisting of (A) a polymer having two or more alkenyl groups and (B) a polyorganosiloxane having a hydroxyl group bound to a silicon atom; (C) a silica powder surface-treated with an alkyl silane; and (D) a compound including one or more elements selected from the group consisting of boron, phosphorus, sulfur, and nitrogen.

An article incorporates an enhanced dielectric breakdown strength and enhanced energy storage density composite material comprising a polymer matrix and hybrid filler particles comprising graphene oxide (GO) and a thermally conductive ceramic material having a thermal conductivity of at least 2 W/(m#K). The hybrid filler particles are distributed within the polymer matrix in a weight percentage less than about 15 weight percent.