The present invention relates to a thermal conductive layer that includes at least one filler, has a thermal diffusivity of 5.0×10.sup.−7 m.sup.2s.sup.−1 or more, and has a volume resistivity of 1.0×10.sup.11 Ω.Math.cm or more. Further, the present invention relates to a photosensitive layer to which the thermal conductive layer is applied, a photosensitive composition, a manufacturing method for a thermal conductive layer, and a laminate and a semiconductor device.

The present invention relates to a thermal conductive layer that includes at least one filler, has a thermal diffusivity of 5.0×10.sup.−7 m.sup.2s.sup.−1 or more, and has a volume resistivity of 1.0×10.sup.11 Ω.Math.cm or more. Further, the present invention relates to a photosensitive layer to which the thermal conductive layer is applied, a photosensitive composition, a manufacturing method for a thermal conductive layer, and a laminate and a semiconductor device.

Compositions including a poly(arylene ether), and compaction rollers for an automated fiber placement machine incorporating the composition are provided. The poly(arylene ether) may be a reaction product of at least one disubstituted benzophenone and at least one polyol. The at least one polyol may include at least one fluorinated diol. The composition may have a thermal conductivity of from about 0.2 to about 50 Watts per meter Kelvin (Wm.sup.−1K.sup.−1).

Compositions including a poly(arylene ether), and compaction rollers for an automated fiber placement machine incorporating the composition are provided. The poly(arylene ether) may be a reaction product of at least one disubstituted benzophenone and at least one polyol. The at least one polyol may include at least one fluorinated diol. The composition may have a thermal conductivity of from about 0.2 to about 50 Watts per meter Kelvin (Wm.sup.−1K.sup.−1).

Polymer magnet composites including NdFeB in a polycarbonate (PC) binder matrix are processed using processes including batch mixing and twin screw extrusion. One method includes adding PC to a compartment of a batch mixer and mixing the PC while the compartment is at a temperature greater than a flow temperature of the PC, to form a mixed PC material. The method also includes adding a NdFeB magnetic material to the compartment with the mixed PC material in four batches while the compartment is at the temperature greater than the flow temperature of the PC to form a mixed PC and NdFeB magnetic material, wherein each batch is mixed in the compartment for 1 to 3 minutes before the next batch is added. In addition, a total mixing time is 6 to 12 minutes, and the compartment includes an inert atmosphere. Other embodiments are described and claimed.

Polymer magnet composites including NdFeB in a polycarbonate (PC) binder matrix are processed using processes including batch mixing and twin screw extrusion. One method includes adding PC to a compartment of a batch mixer and mixing the PC while the compartment is at a temperature greater than a flow temperature of the PC, to form a mixed PC material. The method also includes adding a NdFeB magnetic material to the compartment with the mixed PC material in four batches while the compartment is at the temperature greater than the flow temperature of the PC to form a mixed PC and NdFeB magnetic material, wherein each batch is mixed in the compartment for 1 to 3 minutes before the next batch is added. In addition, a total mixing time is 6 to 12 minutes, and the compartment includes an inert atmosphere. Other embodiments are described and claimed.

Disclosed is a composition comprising a molecule comprising an electrophilic functional group, optionally a second molecule comprising a nucleophilic functional group, and a thermally conductive filler package. The filler package may comprise thermally conductive, electrically insulative filler particles that may have a thermal conductivity of at least 5 W/m.Math.K (measured according to ASTM D7984) and a volume resistivity of at least 10 Ω.Math.m (measured according to ASTM D257, C611, or B193) and that may be present in an amount of at least 50% by volume based on total volume of the filler package. The thermally conductive filler package may be present in an amount of at least 10% by volume percent based on total volume of the composition. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a compositions disclosed herein.

Disclosed is a composition comprising a molecule comprising an electrophilic functional group, optionally a second molecule comprising a nucleophilic functional group, and a thermally conductive filler package. The filler package may comprise thermally conductive, electrically insulative filler particles that may have a thermal conductivity of at least 5 W/m.Math.K (measured according to ASTM D7984) and a volume resistivity of at least 10 Ω.Math.m (measured according to ASTM D257, C611, or B193) and that may be present in an amount of at least 50% by volume based on total volume of the filler package. The thermally conductive filler package may be present in an amount of at least 10% by volume percent based on total volume of the composition. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a compositions disclosed herein.

The present disclosure is directed to systems and methods for providing a dielectric layer on a semiconductor substrate capable of supporting very high density interconnects (i.e., ≥100 IO/mm). The dielectric layer includes a maleimide polymer in which a thiol-terminated functional group crosslinks with an epoxy resin. The resultant dielectric material provides a dielectric constant of less than 3 and a dissipation factor of less than 0.001. Additionally, the thiol functional group forms coordination complexes with noble metals present in the conductive structures, thus by controlling the stoichiometry of epoxy to polyimide, the thiol-polyimide may beneficially provide an adhesion enhancer between the dielectric and noble metal conductive structures.

The present disclosure is directed to systems and methods for providing a dielectric layer on a semiconductor substrate capable of supporting very high density interconnects (i.e., ≥100 IO/mm). The dielectric layer includes a maleimide polymer in which a thiol-terminated functional group crosslinks with an epoxy resin. The resultant dielectric material provides a dielectric constant of less than 3 and a dissipation factor of less than 0.001. Additionally, the thiol functional group forms coordination complexes with noble metals present in the conductive structures, thus by controlling the stoichiometry of epoxy to polyimide, the thiol-polyimide may beneficially provide an adhesion enhancer between the dielectric and noble metal conductive structures.