C08K7/16

SEATING SYSTEM HAVING PRESSURE COMPENSATING FLUID WITH THERMAL CONDUCTION PROPERTIES
20170290723 · 2017-10-12 · ·

A seating system, particularly suited for personal mobility vehicles, such as wheelchairs, includes a seat cushion having pressure relieving properties and enhanced thermal conduction properties. The seat cushion includes a thixotropic fluid contained within a flexible envelope. The thixotropic fluid includes nanoparticles that enhance the thermal conduction properties of the seat cushion to increase heat transfer from a seated user to provide a reduced temperature sensory effect.

SEATING SYSTEM HAVING PRESSURE COMPENSATING FLUID WITH THERMAL CONDUCTION PROPERTIES
20170290723 · 2017-10-12 · ·

A seating system, particularly suited for personal mobility vehicles, such as wheelchairs, includes a seat cushion having pressure relieving properties and enhanced thermal conduction properties. The seat cushion includes a thixotropic fluid contained within a flexible envelope. The thixotropic fluid includes nanoparticles that enhance the thermal conduction properties of the seat cushion to increase heat transfer from a seated user to provide a reduced temperature sensory effect.

AQUEOUS DISPERSION OF (METH)ACRYLIC POLYMER AND POLYSILSESQUIOXANE NANO PARTICLES
20220049024 · 2022-02-17 ·

An aqueous dispersion containing (meth)acrylate polymer particles and substituted silsesquioxane-based particles dispersed in an aqueous carrier, wherein: (a) the substituted silsesquioxane-based particles have an volume-average size of 5 nanometers or more and at the same time less than 500 nanometers as determined by dynamic light scattering; and (b) the substituted silsesquioxane-based particles are substituted only with one or more than one moiety selected from a group consisting of alkyl, aryl, hydroxyl, trace amounts of alkoxy and combinations thereof and contain 50 mole-percent or less hydroxyl substitution in the form silanol functionalities relative to moles of substituted silsesquioxane-based particle as determined by infrared spectroscopy.

AQUEOUS DISPERSION OF (METH)ACRYLIC POLYMER AND POLYSILSESQUIOXANE NANO PARTICLES
20220049024 · 2022-02-17 ·

An aqueous dispersion containing (meth)acrylate polymer particles and substituted silsesquioxane-based particles dispersed in an aqueous carrier, wherein: (a) the substituted silsesquioxane-based particles have an volume-average size of 5 nanometers or more and at the same time less than 500 nanometers as determined by dynamic light scattering; and (b) the substituted silsesquioxane-based particles are substituted only with one or more than one moiety selected from a group consisting of alkyl, aryl, hydroxyl, trace amounts of alkoxy and combinations thereof and contain 50 mole-percent or less hydroxyl substitution in the form silanol functionalities relative to moles of substituted silsesquioxane-based particle as determined by infrared spectroscopy.

FORMULATIONS WITH HIGH GLASS TRANSITION TEMPERATURES, FOR LAMINATES

The present invention relates to curable resin compositions, to methods for producing cured compositions using said curable resin compositions, and to items, in particular molded parts, produced by means of such methods.

FORMULATIONS WITH HIGH GLASS TRANSITION TEMPERATURES, FOR LAMINATES

The present invention relates to curable resin compositions, to methods for producing cured compositions using said curable resin compositions, and to items, in particular molded parts, produced by means of such methods.

ADHESIVE FILM, COMPOSITE FILM, ALL-SOLID-STATE BATTERY AND METHOD FOR PRODUCING COMPOSITE FILM
20220267646 · 2022-08-25 ·

A composite film 10 according to the present invention is provided with: a resin film 1 which is formed of a cured product of a photocurable adhesive composition; and solid particles 3 which are affixed, in the form of a single layer, to the resin film 1, while having edges thereof exposed from one and the other main surfaces of the resin film 1. The resin film 1 is formed by irradiating an adhesive layer 1a in a semi-cured state with light 13, said adhesive layer 1a being formed of the adhesive composition.

ADHESIVE FILM, COMPOSITE FILM, ALL-SOLID-STATE BATTERY AND METHOD FOR PRODUCING COMPOSITE FILM
20220267646 · 2022-08-25 ·

A composite film 10 according to the present invention is provided with: a resin film 1 which is formed of a cured product of a photocurable adhesive composition; and solid particles 3 which are affixed, in the form of a single layer, to the resin film 1, while having edges thereof exposed from one and the other main surfaces of the resin film 1. The resin film 1 is formed by irradiating an adhesive layer 1a in a semi-cured state with light 13, said adhesive layer 1a being formed of the adhesive composition.

Composite material, curable composition, and method for producing curable composition

Provided is a composite material which comprises a resin matrix and inorganic particles dispersed therein, wherein the inorganic particles comprise: one or more groups (G-PID) of spherical particles uniform in particle diameter which comprise aggregates of inorganic spherical particles having a specific average primary-particle diameter, have a narrow particle-size-distribution width, and have a lower refractive index than the resin matrix; and a group (G-SFP) of ultrafine particles. The inorganic spherical particles which constitute all the groups of spherical particles uniform in particle diameter contained in the resin matrix have an arrangement structure which is a short-range order structure satisfying a specific requirement. Also provided are a curable composition giving the composite material and a method for producing the curable composition.

INSULATING COATING COMPOSITION

The present invention relates to an insulating coating composition, a substrate coated with such insulating coating composition and a method for protecting a substrate by using the insulating coating composition. The insulating coating composition comprises at least a) chemically toughened epoxy resin component, wherein the ratio of chemically toughened segments, which are elastomeric segments and bonded via chemical reaction on the epoxy resin, is in a range of 20-49 wt %, based on the total weight of said chemically modified epoxy resin component; b) a curing agent; c) reinforcing fibers; and d) low-density fillers with a density ranging from 0.05-0.7 g/cm.sup.3, preferably 0.08-0.5 g/cm.sup.3, more preferably 0.1-0.4 g/cm.sup.3.