Provided is an organic-inorganic composite resin composition for coating the surface of a zinc-plated steel sheet, comprising 5-25 wt % of a polymer resin, 4-20 wt % of a silane compound, 3-10 wt % of a curing agent and 0.1-2 wt % of ferrocene compound on the basis of the total weight of the composition.

Described herein are thermoplastic molding materials including components:

A) 10 to 98.5 wt % of a thermoplastic polyamide,
B) 1 to 20 wt % of red phosphorus,
C) 0.5 to 15 wt % of an aluminum salt of phosphonic acid,
D) 0 to 55 wt % of a fibrous or particulate filler or mixtures thereof,
E) 0 to 30 wt % of further additives,
wherein the weight percentages of the components A) to E) sum to 100%.

Described herein are thermoplastic molding materials including components:

A) 10 to 98.5 wt % of a thermoplastic polyamide,
B) 1 to 20 wt % of red phosphorus,
C) 0.5 to 15 wt % of an aluminum salt of phosphonic acid,
D) 0 to 55 wt % of a fibrous or particulate filler or mixtures thereof,
E) 0 to 30 wt % of further additives,
wherein the weight percentages of the components A) to E) sum to 100%.

A composition and method to form a composite core material for use as a panel, molded product, sheet, or reinforcing material. The composition generally includes a microsphere discontinuous portion disposed in a continuous encapsulating portion, such as an encapsulating resin. Final products made with the composition may also comprise a mesh assembly on one or both sides of a sheet or panel, and may comprise a scored panel or sheet such that a plurality of reinforcing blocks or sections are formed which allow the cured product to conform to, and reinforce, irregular shapes and surfaces.

Provided is a thermosetting resin composition capable of forming a resin layer having sufficiently low relative dielectric constant and dissipation factor, and high flexibility and toughness in a relatively short period of time, a cured material thereof, a prepreg, a laminate, a metal clad laminate, and a printed circuit board. This is accomplished by a thermosetting resin composition including a (A) polymerizable polyphenylene ether compound of General Formula (1), an (B) elastomer, and a (C) tetrafluoroethylene-based polymer particle, wherein a content of (C) is from 1 parts by mass to 30 parts by mass, with respect to 100 parts by mass of the composition.

Provided is a thermosetting resin composition capable of forming a resin layer having sufficiently low relative dielectric constant and dissipation factor, and high flexibility and toughness in a relatively short period of time, a cured material thereof, a prepreg, a laminate, a metal clad laminate, and a printed circuit board. This is accomplished by a thermosetting resin composition including a (A) polymerizable polyphenylene ether compound of General Formula (1), an (B) elastomer, and a (C) tetrafluoroethylene-based polymer particle, wherein a content of (C) is from 1 parts by mass to 30 parts by mass, with respect to 100 parts by mass of the composition.

An electrically conductive adhesive film includes an adhesive layer having opposing first and second major surfaces spaced apart a distance T in a thickness direction of the adhesive layer, where T≥20 microns, and a plurality of electrically conductive particles dispersed in the adhesive layer between the first and second major surfaces. For at least 90% of the electrically conductive particles in the plurality of electrically conductive particles, the electrically conductive particles have a particle diameter D50 greater thank T/4 and a maximum size of the electrically conductive particles is less than T.

An electrically conductive adhesive film includes an adhesive layer having opposing first and second major surfaces spaced apart a distance T in a thickness direction of the adhesive layer, where T≥20 microns, and a plurality of electrically conductive particles dispersed in the adhesive layer between the first and second major surfaces. For at least 90% of the electrically conductive particles in the plurality of electrically conductive particles, the electrically conductive particles have a particle diameter D50 greater thank T/4 and a maximum size of the electrically conductive particles is less than T.

Methods for forming and incorporating microparticles containing one or more active agents into adhesives are described. The methods involve spray drying a liquid of the one or more active agents and obtaining the active agent in a particulate form. The dry powder is then blended or otherwise incorporated with the adhesive of interest. Also described are various medical products utilizing the adhesive and one or more active agents in microparticle form, and related methods of use.

To provide a water sealing adhesive film for decoration that can reduce or prevent the infiltration of water into an interface between an adhesive layer and an adherend even in an environment where the adhesive film can be contacted with water. A water sealing adhesive film for decoration according to an embodiment of the present disclosure includes: a substrate; and an adhesive layer having a structured surface and being disposed on the substrate, the adhesive layer containing a tacky binder having a crosslinked structure derived from a crosslinking agent, and a water absorbing resin.