The two-part composition includes a first part and a second part. The first part includes a vinyl-substituted polysiloxane, a hydrosilylation catalyst, expandable graphite comprising moisture, and first polymeric microspheres having been at least partially coated with inorganic filler. The second part includes a second vinyl-substituted polysiloxane, a hydrosilyl-substituted polysiloxane, and second polymeric microspheres having been at least partially coated with flame-retardant inorganic filler. The two-part composition is useful, for example, for curing into a sealant and making an assembly. The assembly has a first substrate and a second substrate with a cured product of the two-part composition in contact with the first substrate and the second substrate. Methods of making a sealant and an assembly are also described.

The two-part composition includes a first part and a second part. The first part includes a vinyl-substituted polysiloxane, a hydrosilylation catalyst, expandable graphite comprising moisture, and first polymeric microspheres having been at least partially coated with inorganic filler. The second part includes a second vinyl-substituted polysiloxane, a hydrosilyl-substituted polysiloxane, and second polymeric microspheres having been at least partially coated with flame-retardant inorganic filler. The two-part composition is useful, for example, for curing into a sealant and making an assembly. The assembly has a first substrate and a second substrate with a cured product of the two-part composition in contact with the first substrate and the second substrate. Methods of making a sealant and an assembly are also described.

Primer for producing a partable adhesive bond, the primer being based on a pressure-sensitive adhesive which comprises a chemical or physical blowing agent.

Primer for producing a partable adhesive bond, the primer being based on a pressure-sensitive adhesive which comprises a chemical or physical blowing agent.

Described herein are sealant compositions with low shrinking volume. The sealant compositions include a glass filler. The sealant compositions are useful in a variety of building and construction applications, as well as interior or exterior trim work applications.

Described herein are sealant compositions with low shrinking volume. The sealant compositions include a glass filler. The sealant compositions are useful in a variety of building and construction applications, as well as interior or exterior trim work applications.

The multilevel antimicrobial polymeric colloids as functional additives for latex coating are latex-based coatings with multilevel antimicrobial polymeric colloidal particles incorporated therein to provide antimicrobial properties. Each multilevel antimicrobial polymeric colloidal particle includes a polymer scaffold and at least one antimicrobial polymer carried on the polymer scaffold, such that the polymer scaffold and the at least one antimicrobial polymer form a hollow colloidal particle. As a non-limiting example, the polymer scaffold may be polyvinyl alcohol (PVA). As a further non-limiting example, the at least one antimicrobial polymer may be a combination of polyethyleneimine (PEI) and polyhexamethylene biguanide (PHMB). Each multilevel antimicrobial polymeric colloidal particle may also contain an antimicrobial core within the hollow colloidal particle.

To provide an epoxy resin composition capable of forming a polished surface with high flatness when polished after curing, and a method for producing an electronic component mounting structure having a polished surface with high flatness, the polished surface obtained by polishing the surface of an encapsulation body. Disclosed are an epoxy resin composition, an electronic component mounting structure including the epoxy resin composition, and a method for producing the electronic component mounting structure, wherein: the epoxy resin composition includes a fused silica possibly containing hollow particles, and a curing agent; on a polished surface obtained by polishing a cured product of the epoxy resin composition, the number of pores having a diameter of more than 5 μm observed within a 25-mm.sup.2 area is one or less, the pores derived from cross sections of the hollow particles; and the polished surface is coated with a coating material.

To provide an epoxy resin composition capable of forming a polished surface with high flatness when polished after curing, and a method for producing an electronic component mounting structure having a polished surface with high flatness, the polished surface obtained by polishing the surface of an encapsulation body. Disclosed are an epoxy resin composition, an electronic component mounting structure including the epoxy resin composition, and a method for producing the electronic component mounting structure, wherein: the epoxy resin composition includes a fused silica possibly containing hollow particles, and a curing agent; on a polished surface obtained by polishing a cured product of the epoxy resin composition, the number of pores having a diameter of more than 5 μm observed within a 25-mm.sup.2 area is one or less, the pores derived from cross sections of the hollow particles; and the polished surface is coated with a coating material.

In certain embodiments, the disclosed sealant comprises a one-component, closed-cell, semi-foam, sealant using gas-filled, flexible, organic microspheres to create a product that is elastic and compressible under pressure without protruding in an outward direction when compressed, thereby allowing the applied sealant to compress in an enclosed, maximum-filled channel unlike typical mastic sealants (while retaining the ability to rebound). This allows the sealant to function as a gasket, and, once fully cured, to have properties including vibration damping, insulating, and condensation resistance. The sealant can be formulated as an air barrier or a vapor barrier and at various degrees of moisture resistance. It may be applied by different packaging variations including aerosol can (bag in can or bag on valve), airless sprayer, cartridge tubes, foil tubes, squeeze tubes, and buckets to be applied using a brush, trowel, spatula, etc. The disclosed sealant can also be formulated to be smoke-resistant and flame-resistant.