Patent classifications
C08K7/22
POLYURETHANE FOAM AND METHODS OF FORMING THE SAME
A polyurethane foam may include an isocyanate polymer component and a polyol component. The polyol component may include a polyol having a molecular weight of at least about 500 kg/mol and not greater than about 6000 kg/mol. The polyurethane foam may have an elongation of at least about 500%. The polyurethane foam may further have a density of at least about 250 g/L and a tensile strength of not greater than about 1000 kPa.
Adhesive film, optical member including same, and optical display device including same
Provided are an adhesive film, an optical member including the same, and an optical display device including the same, the adhesive film being formed from a monomer mixture comprising an alkyl group-containing acrylate and a hydroxyl group-containing acrylate, wherein the adhesive film has a modulus of 80 kPa or less at −20° C., and the adhesive film has a value of 40% to 140% in equation 1 at 25° C.
Adhesive film, optical member including same, and optical display device including same
Provided are an adhesive film, an optical member including the same, and an optical display device including the same, the adhesive film being formed from a monomer mixture comprising an alkyl group-containing acrylate and a hydroxyl group-containing acrylate, wherein the adhesive film has a modulus of 80 kPa or less at −20° C., and the adhesive film has a value of 40% to 140% in equation 1 at 25° C.
METHOD FOR PREPARING SUPER ABSORBENT POLYMER
The present disclosure relates to a method for preparing a super absorbent polymer. More specifically, it relates to a method for preparing a super absorbent polymer capable of preparing a super absorbent polymer in which the residual monomer content and the extractable content are simultaneously reduced by adding a reducing agent capable of a redox reaction with a thermal polymerization initiator before drying the hydrogel polymer.
METHOD FOR PREPARING SUPER ABSORBENT POLYMER
The present disclosure relates to a method for preparing a super absorbent polymer. More specifically, it relates to a method for preparing a super absorbent polymer capable of preparing a super absorbent polymer in which the residual monomer content and the extractable content are simultaneously reduced by adding a reducing agent capable of a redox reaction with a thermal polymerization initiator before drying the hydrogel polymer.
FILLER, PREPARATION METHOD THEREOF, RESIN COMPOSITION COMPRISING THE FILLER AND ARTICLE MADE THEREFROM
A filler includes a first precursor and a second precursor; the first precursor is a hollow filler with a surface covered by a first silane coupling agent; the second precursor is a non-hollow filler with a surface covered by a second silane coupling agent; the first precursor and the second precursor are connected by a covalent bond formed by a chemical reaction between the first silane coupling agent and the second silane coupling agent. Also included are a preparation method of the filler and a resin composition containing the filler. A prepreg, a resin film, a laminate, or a printed circuit board made from the resin composition has excellent thermal resistance after moisture absorption, low Df variation rate under moisture and heat, low water absorption rate, high copper foil peeling strength, the prepreg having a smooth appearance and even color, and absence of branch-like pattern on laminate.
FILLER, PREPARATION METHOD THEREOF, RESIN COMPOSITION COMPRISING THE FILLER AND ARTICLE MADE THEREFROM
A filler includes a first precursor and a second precursor; the first precursor is a hollow filler with a surface covered by a first silane coupling agent; the second precursor is a non-hollow filler with a surface covered by a second silane coupling agent; the first precursor and the second precursor are connected by a covalent bond formed by a chemical reaction between the first silane coupling agent and the second silane coupling agent. Also included are a preparation method of the filler and a resin composition containing the filler. A prepreg, a resin film, a laminate, or a printed circuit board made from the resin composition has excellent thermal resistance after moisture absorption, low Df variation rate under moisture and heat, low water absorption rate, high copper foil peeling strength, the prepreg having a smooth appearance and even color, and absence of branch-like pattern on laminate.
Adhesive for insulative articles
An adhesive composition that improves structural integrity and insulative properties when applied to a cellulosic substrate is provided. The adhesive composition includes a plurality of microspheres and an emulsion-based polymer that has (i) an elastic modulus greater than 0.5 MPa in the range temperature range of 70° C. to 110° C.; (ii) an absolute log(E)/T slope of less than 0.05 in the range temperature range of 70° C. to 110° C.; and (iii) a tan d value less than 0.6 at 90° C.
Adhesive for insulative articles
An adhesive composition that improves structural integrity and insulative properties when applied to a cellulosic substrate is provided. The adhesive composition includes a plurality of microspheres and an emulsion-based polymer that has (i) an elastic modulus greater than 0.5 MPa in the range temperature range of 70° C. to 110° C.; (ii) an absolute log(E)/T slope of less than 0.05 in the range temperature range of 70° C. to 110° C.; and (iii) a tan d value less than 0.6 at 90° C.
Rubber composition for tire and studless tire
A rubber composition for a tire according to an embodiment of the present technology includes: 100 parts by mass of a diene rubber and from 1 to 30 parts by mass of a thermally expandable microcapsule composite body, and the thermally expandable microcapsule composite body contains one or more thermally expandable microcapsules and an acrylonitrile butadiene copolymer and/or a crosslinked body thereof covering the one or more thermally expandable microcapsules.