The invention relates to fluoropolymer composites having a fluoropolymer matrix containing a functionalized fluoropolymer composition, and reinforced with fibers. The fibers can be chopped fibers, long fibers, or a mixture thereof, and the fluoropolymer matrix preferably is based on polyvinylidene fluoride. Any type of fibers, sized or unsized may be used with the functionalized fluoropolymer matrix composition to form the fluoropolymer composite.

The invention relates to fluoropolymer composites having a fluoropolymer matrix containing a functionalized fluoropolymer composition, and reinforced with fibers. The fibers can be chopped fibers, long fibers, or a mixture thereof, and the fluoropolymer matrix preferably is based on polyvinylidene fluoride. Any type of fibers, sized or unsized may be used with the functionalized fluoropolymer matrix composition to form the fluoropolymer composite.

The presently claimed invention relates to aramid pulp comprising a plurality of fibrils having a coating of polyalkyleneimine disposed thereon. The presently claimed invention further relates to a method of coating the aramid pulp with polyalkyleneimine. The presently claimed invention also relates to a rubber composition comprising the coated aramid pulp and rubber as well as to a method for preparing the rubber composition.

The presently claimed invention relates to aramid pulp comprising a plurality of fibrils having a coating of polyalkyleneimine disposed thereon. The presently claimed invention further relates to a method of coating the aramid pulp with polyalkyleneimine. The presently claimed invention also relates to a rubber composition comprising the coated aramid pulp and rubber as well as to a method for preparing the rubber composition.

a fluororubber composition includes (a) a peroxide-crosslinkable fluorine-containing elastomer; (b) a spherical particle of a silica/cured melamine resin composite; (c) carbon black; (d) an organic peroxide as a crosslinking agent; and (e) a co-crosslinking agent.

This thermally conductive addition curing silicone composition contains: a heated mixture of an organopolysiloxane having at least two alkenyl groups bonded to silicon atoms in one molecule, an organohydrogen polysiloxane having at least three hydrogen atoms bonded to silicon atoms in one molecule, and aluminum oxide particles having an Na.sup.+ ion level of 50 ppm or less when an aluminum oxide powder is heat extracted by pure water for 24 hours at 60° C. and the resultant water layer is measured by ion chromatography, the aluminum oxide particles having been surface-treated by the organohydrogen polysiloxane; an organohydrogen polysiloxane having two or more hydrogen atoms bonded to silicon atoms in one molecule; and a platinum group metal catalyst. Said composition can be applied to the inside of a module including electrical/electronic components and a circuit board on which these compounded are mounted, and can exhibit exceptional post-curing stress relaxation properties and thermal conductivity.

This thermally conductive addition curing silicone composition contains: a heated mixture of an organopolysiloxane having at least two alkenyl groups bonded to silicon atoms in one molecule, an organohydrogen polysiloxane having at least three hydrogen atoms bonded to silicon atoms in one molecule, and aluminum oxide particles having an Na.sup.+ ion level of 50 ppm or less when an aluminum oxide powder is heat extracted by pure water for 24 hours at 60° C. and the resultant water layer is measured by ion chromatography, the aluminum oxide particles having been surface-treated by the organohydrogen polysiloxane; an organohydrogen polysiloxane having two or more hydrogen atoms bonded to silicon atoms in one molecule; and a platinum group metal catalyst. Said composition can be applied to the inside of a module including electrical/electronic components and a circuit board on which these compounded are mounted, and can exhibit exceptional post-curing stress relaxation properties and thermal conductivity.

A film including: an organic polymeric substrate having a first major surface and a second major surface; an optional acrylic hardcoat layer disposed on the first major surface of the substrate; a siliceous primer layer disposed on the organic polymeric substrate or on the optional acrylic hardcoat layer, wherein the siliceous primer layer includes composite particles including an organic polymer portion and a siliceous portion; and a superhydrophilic surface layer disposed on the siliceous primer layer, wherein the superhydrophilic surface layer includes hydrophilic-functional groups.

A film including: an organic polymeric substrate having a first major surface and a second major surface; an optional acrylic hardcoat layer disposed on the first major surface of the substrate; a siliceous primer layer disposed on the organic polymeric substrate or on the optional acrylic hardcoat layer, wherein the siliceous primer layer includes composite particles including an organic polymer portion and a siliceous portion; and a superhydrophilic surface layer disposed on the siliceous primer layer, wherein the superhydrophilic surface layer includes hydrophilic-functional groups.

Provided is a thermally conductive silicone composition that can be turned into a lightweight cured product superior in thermal conductivity, and is easily processable due to its low viscosity. The composition contains: (A) an organopolysiloxane having at least two alkenyl groups per each molecule; (B) an organohydrogenpolysiloxane having, per each molecule, at least two hydrogen atoms directly bonded to silicon atoms; (C) a thermally conductive filler containing magnesium oxide (20 to 40% by mass), aluminum oxide (40 to 60% by mass) and aluminum hydroxide (10 to 30% by mass); (D) a dimethylpolysiloxane with one end of the molecular chain thereof being blocked by a trialkoxy group; (E) a platinum group metal-based curing catalyst; and (F) an addition reaction control agent.