Metal oxide having a surface onto which a multitude of individual polymers are grafted, each polymer comprising an addition polymer having a first and a second end, and a first moiety comprising a terminal phosphonate group, which first moiety is bonded to the first end, which phosphonate group attaches to the metal oxide surface in such a way that the multitude of the grafted polymers comprises at least one group of adjacent polymers that have a stretched chain conformation wherein the adjacent stretched chains have a substantially parallel orientation, such that the polymers within said group together form a brush structure. Method of grafting a multitude of individual polymers onto a surface of a metal oxide.

In various aspects, the disclosure relates to polycarbonate compositions exhibiting improved impact strength, both multi axial and notched Izod, as well as thin-walled flame resistance while free or substantially free of bromine or chlorine flame retardant additives. The polycarbonate compositions may comprise non-bonding glass fiber, butyl tosylate, and/or a phosphorous based stabilizer.

In various aspects, the disclosure relates to polycarbonate compositions exhibiting improved impact strength, both multi axial and notched Izod, as well as thin-walled flame resistance while free or substantially free of bromine or chlorine flame retardant additives. The polycarbonate compositions may comprise non-bonding glass fiber, butyl tosylate, and/or a phosphorous based stabilizer.

The present invention relates to a composite material, in particular a switchable functional material, comprising (a) a porous carrier material and a swellable material, a method for its preparation and its use in coatings. The composite material is suitable for the production of water-repellent and water-vapor diffusion-open coatings, as well as the use of the composite material.

A composition includes at least one type of conductive or semiconductive nanostructures, wherein at least one conductive ligand is arranged on the surface of the nanostructures, and at least one solvent, wherein the ligand has at least one group by which functionalization is possible. This makes it possible in simple fashion to obtain functionalizable conductive structures, in particular by inkjet processes.

Provided is a resin composition for electronic/electric equipment component used with an electromagnetic wave at a frequency of 1 GHz or higher, having low loss tangent, and, an electronic/electric equipment component used with an electromagnetic wave at a frequency of 1 GHz or higher. The resin composition for electronic/electric equipment component used with an electromagnetic wave at a frequency of 1 GHz or higher contains a polycarbonate resin, and the polycarbonate resin having a mass ratio of a structural unit represented by formula (1) and a carbonate unit other than the structural unit represented by formula (1) of (33 to 100):(67 to 0), in formula (1), each of R.sup.1 and R.sup.2 independently represents a hydrogen atom or a methyl group, and W.sup.1 represents a single bond or a divalent group.

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A thermally conductive silicone composition contains a silicone polymer and a thermally conductive inorganic filler. The ratio X of the BET specific surface area (m.sup.2/g) to the average particle size (μm) of the thermally conductive inorganic filler is 0.1 or more. The thermally conductive inorganic filler is surface treated with a first surface treatment agent and further surface treated with a second surface treatment agent. The first surface treatment agent contains an organic silane compound represented by R.sup.11SiR.sup.12.sub.x(OR.sup.13).sub.3-x (where R.sup.11 is, e.g., a monovalent aliphatic hydrocarbon group having 1 to 4 carbon atoms or a monovalent aromatic hydrocarbon group having 6 to 30 carbon atoms, R.sup.12 is, e.g., a methyl group, and R.sup.13 is, e.g., a hydrocarbon group having 1 to 4 carbon atoms). The second surface treatment agent contains a silicone polymer that has a kinematic viscosity of 1000 mm.sup.2/s or less and does not have a hydrolyzable group. Thus, the present invention provides a thermally conductive silicone composition that has improved viscoelasticity and heat resistance, and a method for producing the thermally conductive silicone composition.

A thermally conductive silicone composition contains a silicone polymer and a thermally conductive inorganic filler. The ratio X of the BET specific surface area (m.sup.2/g) to the average particle size (μm) of the thermally conductive inorganic filler is 0.1 or more. The thermally conductive inorganic filler is surface treated with a first surface treatment agent and further surface treated with a second surface treatment agent. The first surface treatment agent contains an organic silane compound represented by R.sup.11SiR.sup.12.sub.x(OR.sup.13).sub.3-x (where R.sup.11 is, e.g., a monovalent aliphatic hydrocarbon group having 1 to 4 carbon atoms or a monovalent aromatic hydrocarbon group having 6 to 30 carbon atoms, R.sup.12 is, e.g., a methyl group, and R.sup.13 is, e.g., a hydrocarbon group having 1 to 4 carbon atoms). The second surface treatment agent contains a silicone polymer that has a kinematic viscosity of 1000 mm.sup.2/s or less and does not have a hydrolyzable group. Thus, the present invention provides a thermally conductive silicone composition that has improved viscoelasticity and heat resistance, and a method for producing the thermally conductive silicone composition.

A thermally conductive silicone composition contains a silicone polymer and a thermally conductive inorganic filler. The ratio X of the BET specific surface area (m.sup.2/g) to the average particle size (μm) of the thermally conductive inorganic filler is 0.1 or more. The thermally conductive inorganic filler is surface treated with a first surface treatment agent and further surface treated with a second surface treatment agent. The first surface treatment agent contains an organic silane compound represented by R.sup.11SiR.sup.12.sub.x(OR.sup.13).sub.3-x (where R.sup.11 is, e.g., a monovalent aliphatic hydrocarbon group having 1 to 4 carbon atoms or a monovalent aromatic hydrocarbon group having 6 to 30 carbon atoms, R.sup.12 is, e.g., a methyl group, and R.sup.13 is, e.g., a hydrocarbon group having 1 to 4 carbon atoms). The second surface treatment agent contains a silicone polymer that has a kinematic viscosity of 1000 mm.sup.2/s or less and does not have a hydrolyzable group. Thus, the present invention provides a thermally conductive silicone composition that has improved viscoelasticity and heat resistance, and a method for producing the thermally conductive silicone composition.

A thermally conductive silicone composition contains a silicone polymer and a thermally conductive inorganic filler. The thermally conductive inorganic filler is surface treated with a first surface treatment agent and further surface treated with a second surface treatment agent. The first surface treatment agent contains an organic silane compound represented by R.sup.11SiR.sup.12.sub.x(OR.sup.13).sub.3-x (where R.sup.11 is, e.g., a monovalent aliphatic hydrocarbon group having 1 to 18 carbon atoms, a monovalent aromatic hydrocarbon group having 6 to 30 carbon atoms, or a hydrocarbon group having an alkoxysilyl group, R.sup.12 is, e.g., a methyl group, and R.sup.13 is, e.g., a hydrocarbon group having 1 to 4 carbon atoms). The second surface treatment agent contains a silicone polymer that has a kinematic viscosity of 10 to 1000 mm.sup.2/s and does not have a hydrolyzable group. Thus, the present invention provides a thermally conductive silicone composition that has a low slurry viscosity and achieves high extrudability and high moldability, and a method for producing the thermally conductive silicone composition.