C08K13/02

REDUCED GRAPHENE OXIDE NITRILE RUBBER AND METHOD FOR PREPARING TOOTH-SCAR-FREE TOOTH BLOCK

Disclosed is a reduced graphene oxide nitrile rubber, comprising the following components in parts by weight: 100-140 parts of nitrile rubber, 30-90 parts of a reduced graphene oxide nitrile rubber masterbatch, 1.8-2.52 parts of a vulcanizing agent, 1.2-1.68 parts of a vulcanization accelerator, 5-7 parts of a vulcanization activator, 17-23.8 parts of a plasticizer, 2-2.8 parts of antioxidant, 59-86.6 parts of a filler, 0.1-0.14 parts of a curing agent, and 2-2.8 parts of dichlorophenol. The reduced graphene oxide nitrile rubber has excellent mechanical properties, a wide applicable temperature range, and strong stability in use, which excellently addresses the poor mechanical properties of the nitrile rubber in the prior art due to high temperature in use and the interfacial compatibility issue between the filler and the rubber.

REDUCED GRAPHENE OXIDE NITRILE RUBBER AND METHOD FOR PREPARING TOOTH-SCAR-FREE TOOTH BLOCK

Disclosed is a reduced graphene oxide nitrile rubber, comprising the following components in parts by weight: 100-140 parts of nitrile rubber, 30-90 parts of a reduced graphene oxide nitrile rubber masterbatch, 1.8-2.52 parts of a vulcanizing agent, 1.2-1.68 parts of a vulcanization accelerator, 5-7 parts of a vulcanization activator, 17-23.8 parts of a plasticizer, 2-2.8 parts of antioxidant, 59-86.6 parts of a filler, 0.1-0.14 parts of a curing agent, and 2-2.8 parts of dichlorophenol. The reduced graphene oxide nitrile rubber has excellent mechanical properties, a wide applicable temperature range, and strong stability in use, which excellently addresses the poor mechanical properties of the nitrile rubber in the prior art due to high temperature in use and the interfacial compatibility issue between the filler and the rubber.

INFUSIBLE WATERBORNE PIGMENTED RESIN COMPOSITIONS AND METHODS OF PREPARING AND USING THE SAME

Described herein are compositions useful for infusing color into nonwoven polyester containing product and methods to do so. Such compositions and methods comprise use of a color infusion composition comprising an antimigrant polymer; pigment; ammonium polyphosphate; and an anionic surfactant comprising phosphate. In certain embodiments, thermoplastic polymer having a glass transition temperature (Tg) of 93.0° C. or less is used to enhance color infusion.

INFUSIBLE WATERBORNE PIGMENTED RESIN COMPOSITIONS AND METHODS OF PREPARING AND USING THE SAME

Described herein are compositions useful for infusing color into nonwoven polyester containing product and methods to do so. Such compositions and methods comprise use of a color infusion composition comprising an antimigrant polymer; pigment; ammonium polyphosphate; and an anionic surfactant comprising phosphate. In certain embodiments, thermoplastic polymer having a glass transition temperature (Tg) of 93.0° C. or less is used to enhance color infusion.

Dielectric for high density substrate interconnects

The present disclosure is directed to systems and methods for providing a dielectric layer on a semiconductor substrate capable of supporting very high density interconnects (i.e., ≥100 IO/mm). The dielectric layer includes a maleimide polymer in which a thiol-terminated functional group crosslinks with an epoxy resin. The resultant dielectric material provides a dielectric constant of less than 3 and a dissipation factor of less than 0.001. Additionally, the thiol functional group forms coordination complexes with noble metals present in the conductive structures, thus by controlling the stoichiometry of epoxy to polyimide, the thiol-polyimide may beneficially provide an adhesion enhancer between the dielectric and noble metal conductive structures.

Dielectric for high density substrate interconnects

The present disclosure is directed to systems and methods for providing a dielectric layer on a semiconductor substrate capable of supporting very high density interconnects (i.e., ≥100 IO/mm). The dielectric layer includes a maleimide polymer in which a thiol-terminated functional group crosslinks with an epoxy resin. The resultant dielectric material provides a dielectric constant of less than 3 and a dissipation factor of less than 0.001. Additionally, the thiol functional group forms coordination complexes with noble metals present in the conductive structures, thus by controlling the stoichiometry of epoxy to polyimide, the thiol-polyimide may beneficially provide an adhesion enhancer between the dielectric and noble metal conductive structures.

Protective coating composition for substrates in contact with molten metal

A coating composition and a method of making a coating composition is provided. The coating composition includes: a) a binder system comprising a mixture of a caramelized carbohydrate component, an inorganic colloidal binder, and an adjuvant; and b) a protective agent. The coating composition is useful for protecting articles from corrosion and/or erosion caused by contact with molten metal.

Protective coating composition for substrates in contact with molten metal

A coating composition and a method of making a coating composition is provided. The coating composition includes: a) a binder system comprising a mixture of a caramelized carbohydrate component, an inorganic colloidal binder, and an adjuvant; and b) a protective agent. The coating composition is useful for protecting articles from corrosion and/or erosion caused by contact with molten metal.

Thermally conductive resin composition and thermally conductive sheet using the same
11692118 · 2023-07-04 · ·

A thermally conductive resin composition capable of maintaining high thermal conductivity and a thermally conductive sheet using the same, a thermally conductive resin composition contains an addition reaction type silicone resin, a thermally conductive filler, an alkoxysilane compound, and a carbodiimide compound in which a subcomponent is in an inactive state with respect to an alkoxysilane compound, and contains 55 to 85% by volume of the thermally conductive filler. A thermally conductive resin composition contains an addition reaction type silicone resin, an alkoxysilane compound, a thermally conductive filler, and a carbodiimide compound in which a subcomponent is in an inactive state with respect to the alkoxysilane compound, and exhibits thermal conductivity of 5 W/m*K or more after curing.

Thermally conductive resin composition and thermally conductive sheet using the same
11692118 · 2023-07-04 · ·

A thermally conductive resin composition capable of maintaining high thermal conductivity and a thermally conductive sheet using the same, a thermally conductive resin composition contains an addition reaction type silicone resin, a thermally conductive filler, an alkoxysilane compound, and a carbodiimide compound in which a subcomponent is in an inactive state with respect to an alkoxysilane compound, and contains 55 to 85% by volume of the thermally conductive filler. A thermally conductive resin composition contains an addition reaction type silicone resin, an alkoxysilane compound, a thermally conductive filler, and a carbodiimide compound in which a subcomponent is in an inactive state with respect to the alkoxysilane compound, and exhibits thermal conductivity of 5 W/m*K or more after curing.