Disclosed is an eco-friendly adhesive coating agent composition having high adhesion properties and fast-curing properties by using a thiol-modified epoxy intermediate. The composition includes: a main material including 25 to 40 parts by weight of polyoxypropyleneamine, 20 to 30 parts by weight of a cross-linking agent, 10 to 30 parts by weight of the thiol-modified epoxy intermediate, 10 to 20 parts by weight of an inorganic filler, 5 to 10 parts by weight of a pigment, and 2 to 5 parts by weight of an additive; and a curing agent including 60 to 80 parts by weight of a rubber-modified epoxy resin, 20 to 40 parts by weight of a polyol, 10 to 30 parts by weight of the thiol-modified epoxy intermediate, and 4 to 10 parts by weight of an additive, with respect to 100 parts by weight of an isocyanate mixture.

Disclosed is an eco-friendly adhesive coating agent composition having high adhesion properties and fast-curing properties by using a thiol-modified epoxy intermediate. The composition includes: a main material including 25 to 40 parts by weight of polyoxypropyleneamine, 20 to 30 parts by weight of a cross-linking agent, 10 to 30 parts by weight of the thiol-modified epoxy intermediate, 10 to 20 parts by weight of an inorganic filler, 5 to 10 parts by weight of a pigment, and 2 to 5 parts by weight of an additive; and a curing agent including 60 to 80 parts by weight of a rubber-modified epoxy resin, 20 to 40 parts by weight of a polyol, 10 to 30 parts by weight of the thiol-modified epoxy intermediate, and 4 to 10 parts by weight of an additive, with respect to 100 parts by weight of an isocyanate mixture.

A one-component thermosetting epoxy resin composition includes at least one epoxy resin A having on average more than one epoxide group per molecule, at least one latent hardener B for epoxy resins, at least one impact modifier D, at least one physical or chemical blowing agent E and fibrous anhydrous magnesium oxysulfate MOS. Thermally expandable epoxy resin compositions have improved adhesion, especially on metal substrates.

A one-component thermosetting epoxy resin composition includes at least one epoxy resin A having on average more than one epoxide group per molecule, at least one latent hardener B for epoxy resins, at least one impact modifier D, at least one physical or chemical blowing agent E and fibrous anhydrous magnesium oxysulfate MOS. Thermally expandable epoxy resin compositions have improved adhesion, especially on metal substrates.

A non-linear surfactant, and particularly a non-linear surfactant comprising bi-functionalized molecules or particles having both hydrophobic and hydrophilic groups. The non-linear surfactant includes a nanoparticle template of a rigid molecular structure, wherein the nanoparticle comprises a molecule or a particle that is bi-functionalized with both hydrophilic and hydrophobic groups to obtain an amphiphilic nanoparticle. The template nanoparticle can be used as a surfactant, wetting agent, emulsifier, detergent or other surface active agents or for the preparation of nanoemulsions or dispersions. The non-linear surfactant can provide smaller particle sizes for emulsion suspensions and foams.

A non-linear surfactant, and particularly a non-linear surfactant comprising bi-functionalized molecules or particles having both hydrophobic and hydrophilic groups. The non-linear surfactant includes a nanoparticle template of a rigid molecular structure, wherein the nanoparticle comprises a molecule or a particle that is bi-functionalized with both hydrophilic and hydrophobic groups to obtain an amphiphilic nanoparticle. The template nanoparticle can be used as a surfactant, wetting agent, emulsifier, detergent or other surface active agents or for the preparation of nanoemulsions or dispersions. The non-linear surfactant can provide smaller particle sizes for emulsion suspensions and foams.

Provided is a thermally conductive liquid composition containing a matrix resin (A) and thermally conductive inorganic particles (B). The matrix resin (A) accounts for 2 mass % or more and 8 mass % or less and the thermally conductive inorganic particles (B) account for 92 mass % or more and 98 mass % or less relative to 100 mass % of the thermally conductive liquid composition. The thermally conductive inorganic particles (B) include thermally conductive inorganic particles (B1) of 100 μm or more and 500 μm or less and thermally conductive inorganic particles (B2) of 0.01 μm or more and less than 100 μm. In the volume-based cumulative distribution curve, the thermally conductive inorganic particles (B1) account for 25 vol % or more and 50 vol % or less and the thermally conductive inorganic particles (B2) account for 50 vol % or more and 75 vol % or less relative to 100 vol % of the thermally conductive inorganic particles (B). Thus, the thermally conductive liquid composition has improved fluidity and is smoothly extruded from a discharge orifice of a small diameter while having high thermal conductivity.

Provided is a thermally conductive liquid composition containing a matrix resin (A) and thermally conductive inorganic particles (B). The matrix resin (A) accounts for 2 mass % or more and 8 mass % or less and the thermally conductive inorganic particles (B) account for 92 mass % or more and 98 mass % or less relative to 100 mass % of the thermally conductive liquid composition. The thermally conductive inorganic particles (B) include thermally conductive inorganic particles (B1) of 100 μm or more and 500 μm or less and thermally conductive inorganic particles (B2) of 0.01 μm or more and less than 100 μm. In the volume-based cumulative distribution curve, the thermally conductive inorganic particles (B1) account for 25 vol % or more and 50 vol % or less and the thermally conductive inorganic particles (B2) account for 50 vol % or more and 75 vol % or less relative to 100 vol % of the thermally conductive inorganic particles (B). Thus, the thermally conductive liquid composition has improved fluidity and is smoothly extruded from a discharge orifice of a small diameter while having high thermal conductivity.

Disclosed herein is a thermoplastic molding composition, including: a) 30 to 99.85 wt % of at least one thermoplastic polyamide as component A; b) 0.1 to 10 wt % of at least one polyhydric alcohol having more than 6 hydroxyl groups, and having a number average molecular weight M.sub.n of more than 2000 g/mol as component B; c) 0.05 to 3 wt % of at least one sterically hindered phenol antioxidant as component C; d) 0 to 3 wt % of at least one polycarboxylic compound having more than 3 carboxylic acid groups and/or carboxylate groups, and having a number average molecular weight M.sub.n of more than 300 g/mol as component D; e) 0 to 50 wt % of at least one fibrous and/or particulate filler as component E; and f) 0 to 25 wt % of further additives as component F; where the total of wt % of components A to F is 100 wt %.

Disclosed herein is a thermoplastic molding composition, including: a) 30 to 99.85 wt % of at least one thermoplastic polyamide as component A; b) 0.1 to 10 wt % of at least one polyhydric alcohol having more than 6 hydroxyl groups, and having a number average molecular weight M.sub.n of more than 2000 g/mol as component B; c) 0.05 to 3 wt % of at least one sterically hindered phenol antioxidant as component C; d) 0 to 3 wt % of at least one polycarboxylic compound having more than 3 carboxylic acid groups and/or carboxylate groups, and having a number average molecular weight M.sub.n of more than 300 g/mol as component D; e) 0 to 50 wt % of at least one fibrous and/or particulate filler as component E; and f) 0 to 25 wt % of further additives as component F; where the total of wt % of components A to F is 100 wt %.