A material for audio equipment housing containing a polylactic acid resin composition containing a polylactic acid resin, a plasticizer, an organic crystal nucleating agent, and an inorganic material, wherein the content of the plasticizer is from 1 to 50 parts by mass based on 100 parts by mass of the polylactic acid resin; and a vibration-damping material containing a polylactic acid resin composition containing a polylactic acid resin, a plasticizer, an organic crystal nucleating agent, and an inorganic material, wherein the content of the plasticizer is from 1 to 50 parts by mass based on 100 parts by mass of the polylactic acid resin. The material of the present invention can be suitably used as materials for audio equipment of, for example, speakers, television, radio cassette players, headphones, audio components, or microphones, and manufactured articles, such as electric appliances, transportation vehicles, construction buildings, and industrial equipment, or parts or housing thereof.

A material for audio equipment housing containing a polylactic acid resin composition containing a polylactic acid resin, a plasticizer, an organic crystal nucleating agent, and an inorganic material, wherein the content of the plasticizer is from 1 to 50 parts by mass based on 100 parts by mass of the polylactic acid resin; and a vibration-damping material containing a polylactic acid resin composition containing a polylactic acid resin, a plasticizer, an organic crystal nucleating agent, and an inorganic material, wherein the content of the plasticizer is from 1 to 50 parts by mass based on 100 parts by mass of the polylactic acid resin. The material of the present invention can be suitably used as materials for audio equipment of, for example, speakers, television, radio cassette players, headphones, audio components, or microphones, and manufactured articles, such as electric appliances, transportation vehicles, construction buildings, and industrial equipment, or parts or housing thereof.

Thermoplastic, flame-retarded plastic molding compounds with improved mechanical properties, in particular for LDS applications, are described. The thermoplastic molding compound consists of: (A) 21-81.9 wt. % thermoplastic material, consisting of (A1) 55-100 wt. % polyamide, containing at least 50 wt. % partly aromatic, partly crystalline polyamide; (A2) 0-45 wt. % non-polyamide based thermoplastic material, wherein (A1) and (A2) add up to 100 wt. % component (A); (B) 10-70 wt. % glass fibers; (C) 0.1-10 wt. % LDS additive or a mixture of LDS additives; (D) 8-18 wt. % halogen-free flame retardant; (E) 0-40 wt. % particulate filler, different from (C); (F) 0-2 wt. % other further additives;
wherein the sum of (A)-(F) makes up 100 wt. %.

Thermoplastic, flame-retarded plastic molding compounds with improved mechanical properties, in particular for LDS applications, are described. The thermoplastic molding compound consists of: (A) 21-81.9 wt. % thermoplastic material, consisting of (A1) 55-100 wt. % polyamide, containing at least 50 wt. % partly aromatic, partly crystalline polyamide; (A2) 0-45 wt. % non-polyamide based thermoplastic material, wherein (A1) and (A2) add up to 100 wt. % component (A); (B) 10-70 wt. % glass fibers; (C) 0.1-10 wt. % LDS additive or a mixture of LDS additives; (D) 8-18 wt. % halogen-free flame retardant; (E) 0-40 wt. % particulate filler, different from (C); (F) 0-2 wt. % other further additives;
wherein the sum of (A)-(F) makes up 100 wt. %.

A thermoconductive silicone composition which has (A) an organopolysiloxane as a base polymer and includes (B) a thermoconductive filler, wherein the thermoconductive filler is 60-85 vol % of the thermoconductive silicone composition, and 40-60 vol % of the thermoconductive filler is aluminum nitride having an average particle diameter of at least 50 μm.

A thermoconductive silicone composition which has (A) an organopolysiloxane as a base polymer and includes (B) a thermoconductive filler, wherein the thermoconductive filler is 60-85 vol % of the thermoconductive silicone composition, and 40-60 vol % of the thermoconductive filler is aluminum nitride having an average particle diameter of at least 50 μm.

The object is to provide a polyamide resin composition having superior productivity and mechanical strength. A polyamide resin composition includes: (A) Polyamide 66; (B) glass fibers; and (C) a copper compound and a halide. The percentage of a component of the (A) Polyamide 66 having a molecular weight of 30,000 or less as obtained by Gel Permeation Chromatography (GPC) is within a range from 30% by mass to 37% by mass of the total amount of the (A) Polyamide 66, and the percentage of the (A) Polyamide 66 having a molecular weight of 100,000 or greater is within a range from 8% by mass to 15% by mass of the total amount of the (A) Polyamide 66.

A nonlinear resistive coating material 20 in an embodiment includes: a matrix resin 22 made of an epoxy resin which is cured by adding a curing agent thereto; ZnO-containing particles 21 dispersedly contained in the matrix resin 22 and made of a sintered compact containing ZnO as a main component; and semiconductive surface-treated whiskers 10 dispersedly contained in the matrix resin 22 and made of ZnO subjected to titanate coupling surface modification treatment.

A thermal conductive sheet includes a cured product of a resin composition containing carbon fiber, an inorganic filler other than carbon fiber, and binder resin. The tack force of the sheet surface is 100 gf or greater, determined when the sheet between release films is subjected to press processing at 0.5 MPa for 30 sec, and after the films are peeled off, is indented by 50 μm at 2 mm/second with a probe 5.1 mm in diameter and the probe is pulled away at 10 mm/sec. Additionally, (B/A)×100≥80% is true, where A denotes the tack force of the sheet surface after the films are peeled off subsequent to press processing; and B denotes the tack force of the sheet surface when the sheet is indented by 50 μm at 2 mm/second with a probe 5.1 mm in diameter and the probe is pulled away at 10 mm/second after exposure to atmosphere for 1 hour subsequent to press processing.

A thermal conductive sheet includes a cured product of a resin composition containing carbon fiber, an inorganic filler other than carbon fiber, and binder resin. The tack force of the sheet surface is 100 gf or greater, determined when the sheet between release films is subjected to press processing at 0.5 MPa for 30 sec, and after the films are peeled off, is indented by 50 μm at 2 mm/second with a probe 5.1 mm in diameter and the probe is pulled away at 10 mm/sec. Additionally, (B/A)×100≥80% is true, where A denotes the tack force of the sheet surface after the films are peeled off subsequent to press processing; and B denotes the tack force of the sheet surface when the sheet is indented by 50 μm at 2 mm/second with a probe 5.1 mm in diameter and the probe is pulled away at 10 mm/second after exposure to atmosphere for 1 hour subsequent to press processing.