A composition for extrusion and deposition by a three-dimensional (3D) printer is provided. The composition comprises a thermoplastic elastomer (TPE), particulate matter having particles in the range of about 5 nm to about 10 μm in diameter, and a solvent. Uses of the composition for 3D printing microstructures, including multiwall plate devices, are also provided.

A polymer gel may comprise a polymer gel base material and superparamagnetic nanoparticles. At least 25 wt. % of the superparamagnetic nanoparticles may have diameters in a first size range between a first diameter and a second diameter. At least 25 wt. % of the superparamagnetic nanoparticles may have diameters in a second size range between a third diameter and a fourth diameter. The Brownian relaxation time of the portion of the superparamagnetic nanoparticles in the first size range may be at least 5 times the Neel relaxation time of the portion of the superparamagnetic nanoparticles in the first size range. The Neel relaxation time of the portion of the superparamagnetic nanoparticles in the second size range may be at least 5 times the Brownian relaxation time of the portion of the superparamagnetic nanoparticles in the second size range. Methods for monitoring gel integrity in a wellbore are further included.

Polytetrafluoroethylene filled with FeCo microparticles provides an ultralow wear, magnetic, multifunctional tribological material. For example, PTFE filled with an 5 wt. % of equiatomic, prealloyed FeCo powder resulted in steady state wear rates of 2.7×10.sup.−7 mm.sup.3/Nm, approaching that of PTFE-filled alumina. Comparable wear rates were not recovered for PTFE filled with just iron or cobalt microparticles.

A compound for bonded magnet that increases the mechanical strength (for example, crushing strength) of a bonded magnet is provided. The compound for bonded magnet includes a magnetic powder, an epoxy resin, a curing agent, a coupling agent, and a metal salt, and the metal salt is represented by R.sub.2M, in which R represents a saturated fatty acid group having 6 or more and 10 or less carbon atoms, while M represents at least one metal element between Ca and Ba.

Adhesive damping systems are described. A damping system for reducing the effects on a substrate caused by a disruption in the substrate environment includes an adhesive having a plurality of three-dimensional particles dispersed therein. The particles are configured to provide a controlled response to an applied force field. The system further includes a sensor which measures an amplitude and frequency spectrum of the disruption. In a use configuration, the sensor determines the amplitude and frequency spectrum of the disruption received by the substrate; and the applied force field is dependent on the amplitude and frequency spectrum of the disruption.

A rare earth-iron-nitrogen-based magnetic powder according to this invention contains, as main constituent components, a rare-earth element (R), iron (Fe), and nitrogen (N). Moreover, this magnetic powder has an average particle size of 1.0-10.0 μm, and contains 22.0-30.0 mass % of a rare-earth element (R) and 2.5-4.0 mass % of nitrogen (N). Further, this magnetic powder includes: a core part having any one crystal structure among a Th.sub.2Zn.sub.17 type, a Th.sub.2Ni.sub.17 type, and a TbCu.sub.7 type; and a shell layer provided on the surface of the core part and having a thickness of 1-30 nm. The shell layer contains a rare-earth element (R) and iron (Fe) so that the R/Fe atomic ratio is 0.3-5.0, and further contains 0-10 at % (exclusive of 0) of nitrogen (N). Furthermore, this magnetic powder contains compound particles composed of a rare-earth element (R) and phosphorus (P).

The present disclosure relates to an adhesive film for a semiconductor and a dicing die-bonding film the same, and particularly, to an adhesive film for a semiconductor, which may reduce electromagnetic interference generated in a semiconductor package by including a polymer matrix in which a magnetic filler including a core and a coating layer formed on the surface of the core is dispersed, and a dicing die-bonding film including the same.

The present disclosure relates to a latently reactive conductive polyurethane-based adhesive film.

According to examples, an article may include a base layer that extends along a first dimension and a second dimension, in which the second dimension is orthogonal to the first dimension. The article may also include reflective ribbons provided on an upper surface of the base layer, in which the reflective ribbons positioned along a common plane extending in the second dimension have dihedral angles that change as a function of distance across the common plane.

A method, system and paint for suppressing emission of high frequency electromagnetic radiation from an electronic system, the electronic system including at least one power supply unit, at least one printed circuit board (PCB) and at least one integrated circuit are provided. The method includes providing an electrically conductive housing configured to accommodate and encase the electronic system, the housing having an inner conductive surface, and applying a layer of an electromagnetic absorbing paint to the inner conductive surface of the housing to substantially cover the inner surface by the layer, the electromagnetic absorbing paint comprises a liquid matrix and an electromagnetic absorbing material.