Patent classifications
C08K2201/014
SILICONE GEL COMPOSITION AND SILICONE GEL SHEET
A silicone gel composition of the present invention contains the following components; A 100 parts by mass of an organopolysiloxane that is curable by an addition reaction; B. 0.01 to 10 parts by mass of an unsaturated hydrocarbon compound having one alkenyl group per molecule; and C. an addition reaction curing catalyst in a catalytic amount. The unsaturated hydrocarbon compound is at least one selected from the group consisting of an a-olefin that is liquid at room temperature (25° C.) and does not volatilize or decompose at 100° C. and α-methylstyrene. A silicone gel sheet of the present invention is obtained by molding the silicone gel composition into a sheet, and curing the sheet.
MUD MATERIAL
Disclosed herein is a mud material comprising a refractory raw material, an organic binder, and a curing agent, wherein part or all of the organic binder is a novolac-type phenol resin, part or all of the curing agent is a methylene donor, and wherein the methylene donor is at least one selected from the group consisting of hexa(methoxymethyl)melamine and hexamethoxymethylolmelamine.
Elastomer composition comprising a filler at least partially covered by silica
A rubber composition based on at least one diene elastomer, a reinforcing filler predominantly comprising a filler covered at least partially by silica and a crosslinking system. The dispersion of the filler in the elastomeric matrix has a Z score greater than or equal to 70, and the composition is devoid of agent for coupling the filler with the elastomer.
Thermally conductive composition, thermally conductive sheet, and method for producing thermally conductive sheet
A method for producing a thermally conductive sheet S includes a step of obtaining a thermally conductive composition by mixing a reactive liquid resin, which forms a rubbery or gelatinous matrix when crosslinked, a volatile liquid having a boiling point 10° C. or more higher than a curing temperature of the reactive liquid resin, and a thermally conductive filler; a step of forming a molded body by crosslinking and curing the reactive liquid resin at a temperature 10° C. or more lower than the boiling point of the volatile liquid; and a step of evaporating the volatile liquid by heating the molded body, in which these steps are performed sequentially.
Stabilising Composition
The invention concerns a stabilising composition, comprising: at least one antioxidant comprising one or more of: a phenolic antioxidant, a phosphite antioxidant, a sulphur-containing antioxidant, and an aminic antioxidant; and at least one buffering agent, wherein the buffering agent has the capacity to buffer in aqueous solution at a pH range from 4 to 8.
COMPOSITE RESIN MOLDED ARTICLE
A composite resin molded article includes: a base resin; and fillers dispersed in the base resin, wherein the fillers include fibrous fillers and particulate fillers having aspect ratios lower than aspect ratios of the fibrous fillers.
Electromagnetic-wave-absorbing particle for GHz band and electromagnetic-wave-absorbing material including the same
Electromagnetic-wave-absorbing particles for a GHz band are represented by the following [Empirical Formula 1] and include M-type hexaferrite as a major phase:
Sr.sub.1-xR.sub.xFe.sub.y-2zM.sub.2zO.sub.a, [Empirical Formula 1] where R is one or more selected from Ba, Ca, and La, M is one or more selected from Zn, Ti, and Zr, 0<x≤0.8, 8≤y≤14, 0<z≤1.5, and a is 19.
THERMALLY CONDUCTIVE SILICONE POTTING COMPOSITION AND CURED PRODUCT THEREOF
A thermally conductive silicone potting composition that comprises, each in a preset amount, (A) an organopolysiloxane having at least two alkenyl groups per molecule and having a viscosity of 0.01-100 Pa.Math.s at 25° C., (B) an organopolysiloxane one end of which is blocked with an alkoxysilyl group, etc., (C) a crystalline silica having an average particle size of 0.1 μm or more and less than 5 μm, (D) a crystalline silica having an average particle size of 5 μm or more and less than 100 μm, (E) an organohydrogen siloxane having at least two SiH groups per molecule, and (F) a hydrosilylation reaction catalyst, wherein the mass ratio of (C)/(D) is from 3/1 to 1/10.
RESIN SHEET AND MANUFACTURING METHOD THEREOF
A method of producing a resin sheet, including: mixing blocky boron nitride particles A, blocky boron nitride particles B, and a resin composition, and molding the resin composition to a sheet form and pressurizing the sheet form resin composition, the boron nitride primary particles a having a length in a shorter direction of 0.7 μm or less, the boron nitride primary particles b having a length in a shorter direction of 1 μm or more, the blocky boron nitride particles A having an average particle diameter of 30 μm or more, the blocky boron nitride particles B having an average particle diameter that is smaller than the average particle diameter of the blocky boron nitride particles A, the compressive strengths ratio of the blocky boron nitride particles A to the blocky boron nitride particles B being 1.2 or more. Thus, the thermal conductivity of a resin sheet can be enhanced.
POLYAMIDE COMPOSITIONS HAVING A HIGH MODULUS AND A LOW DIELECTRIC CONSTANT AND USE THEREOF
A mixture of solid and hollow glass reinforcers with an alloy of at least one polyamide and of at least one polyolefin, the mixture of solid and hollow glass reinforcers including from 5% to 60% by weight of hollow glass beads relative to the sum of the solid and hollow glass reinforcers, the alloy-mixture proportions being from more than 50% to 75% of said mixture of solid and hollow glass reinforcers, to prepare a composition having a modulus, when dry at 20° C., of from 5 GPa to less than 8 GPa as measured according to ASTM D-2520-13, at a frequency of at least 1 GHz, at 23° C., under 50% RH.