Provided is an aqueous coating composition capable of forming a coating film having superior metallic coating film appearance and coating film properties and reducing the amount of an organic solvent to be used. Also provided is a method for forming a metallic coating film using such an aqueous coating composition. Provided is an aqueous coating composition comprising a coating film-forming resin, a curing agent, a scaly pigment, an inorganic viscosity agent, a hydrophobic associative viscosity agent, and a dispersant, wherein the composition contains the inorganic viscosity agent in an amount of 1 to 7 parts by mass based on 100 parts by mass of the total resin solid content of the coating film-forming resin and the curing agent, and the composition contains the hydrophobic associative viscosity agent in an amount of 1 to 15 parts by mass based on 100 parts by mass of the total resin solid content of the coating film-forming resin and the curing agent.

The present disclosure relates to a film usable for roll-to-roll processing of flexible electronic devices, the film comprising a composite material comprising a polymer and hexagonal boron nitride particles, wherein the hexagonal boron nitride particles comprise platelet-shaped hexagonal boron nitride particles. The present disclosure further relates to a process for producing said film, and to the use of said film.

Provided is an insulating sheet capable of effectively enhancing thermal conduction and adhesiveness and effectively suppressing variation in the adhesiveness. The insulating sheet according to the present invention contains a thermosetting component and boron nitride, the insulating sheet has a first surface on one side in a thickness direction and a second surface on the other side in the thickness direction, and a first average aspect ratio of the boron nitride in a region having a thickness of 10% of a thickness of the sheet, from the first surface toward the second surface is smaller than a second average aspect ratio of the boron nitride in a region having a thickness of 90% of a thickness of the sheet, from the second surface toward the first surface.

Provided is an insulating sheet capable of effectively enhancing thermal conduction and adhesiveness and effectively suppressing generation of voids. The insulating sheet according to the present invention contains a thermosetting component and boron nitride, the insulating sheet has a first surface on one side in a thickness direction and a second surface on the other side in the thickness direction, and a first average major diameter of the boron nitride in a region having a thickness of 10% of a thickness of the sheet, from the first surface toward the second surface is smaller than a second average major diameter of the boron nitride in a region having a thickness of 90% of a thickness of the sheet, from the second surface toward the first surface.

The present invention relates to an electromagnetic millimetre wave absorber material, preferably having a volume resistivity of more than 1 Ω cm, containing solid particles having an aspect ratio (length:diameter) of at least 5 of a first electrically conductive material, particles having an aspect ratio (length:diameter) of less than 5 of a second electrically conductive material and an electrically non-conductive polymer, wherein the absorber material is capable of absorbing electromagnetic waves in a frequency region of 60 GHz or more. The invention also relates to its use and method for absorbing as well as a sensor apparatus comprising said absorber material.

A thermal conductive silicone composition contains, in specific amounts, each of (A) an organopolysiloxane containing two or more alkenyl groups bonded to a silicon atom in one molecule, (B) an organohydrogenpolysiloxane containing two or more hydrogen atoms bonded to a silicon atom in one molecule, (C) a catalyst for hydrosilylation reaction, (D) a silver powder with a tapped density of 3.0 g/cm.sup.3 or higher, a specific surface area of 2.0 m.sup.2/g or less, and an aspect ratio of 1 to 30, and (E) a natural graphite powder or a synthetic graphite powder with an average particle size of 3 μm to 50 μm. This provides: a thermal conductive silicone composition that gives a cured material having a favorable heat-dissipating property; a semiconductor device using the cured material of the composition; and a method for manufacturing the same.

A resin composition has excellent thermal conductivity. The thermally conductive resin composition includes: a resin; a first thermally conductive filler having an aspect ratio of 10 or more and a long diameter of less than 30 μm; and a second thermally conductive filler having an aspect ratio of 2 or less.

Described herein are polymeric composites that can include a kaolin filler dispersed within a thermoplastic polymer matrix. The kaolin filler can exhibit an aspect ratio of from 20 to 50, as measured by laser scattering, a mean particle size of from 0.75 microns to 2 microns e.s.d., as measured by Sedigraph, or a combination thereof. In some embodiments, the kaolin filler exhibits a ratio of aspect ratio to mean particle size ranges from 4 to 5, as measured by laser scattering. In some embodiments, less than 30% by weight of the kaolin filler exhibits a particle size of less than 0.5 microns e.s.d., as measured by Sedigraph. The composites can exhibit improved mechanical properties such as flexural strength, tensile strength, and heat deflection temperature. The composites can be used to form articles, for example, by thermoforming.

Lubricity of a lip seal material using hydrogenated nitrile rubber is improved. A rubber-like elastic lip seal which is fixed to a housing and slides with a shaft that rotates relatively with the housing, wherein the lip seal includes a rubber-like elastic body containing hydrogenated nitrile rubber, EPDM or fluoro rubber, a reinforcing filler material, and a non-reinforcing filler material having an aspect ratio in a range of 1 or more and 30 or less, and the lip seal contains 1 part by weight or more and 150 parts by weight or less of the reinforcing filler material and 5 parts by weight or more and 90 parts by weight or less the non-reinforcing filler material per 100 parts by weight of the rubber-like elastic body.

The present invention relates to sheet silicate lamellae of a 2:1 sheet silicate with a high aspect ratio, to a method for producing these sheet silicate lamellae and to an aqueous dispersion which comprises the sheet silicate lamellae. The present invention further relates to the use of the sheet silicate lamellae of the invention for producing a composite material, and also to a corresponding composite material comprising or obtainable using the sheet silicate lamellae, more particularly for use as a diffusion barrier or as a flame retardant.