The invention provides a processing aid enabling short-time disappearance of melt fracture occurred in extrusion-molding a melt-fabricable resin at a high shear rate, a great reduction in extrusion pressure, and production of molded articles with good appearance. The processing aid contains a polymer containing a fluorine-containing elastomeric polymer segment and a fluorine-containing non-elastomeric polymer segment.

The present invention relates to a breathable film comprising at least one thermoplastic polymer and a surface-treated filler material product comprising a treatment layer comprising at least one mono-substituted succinic anhydride and/or at least one mono-substituted succinic acid and/or salty reaction product(s) thereof, a process for producing the same, and the use thereof. Furthermore, the present invention is directed to the use of a surface-treated filler material product comprising a treatment layer comprising at least one mono-substituted succinic anhydride and/or at least one mono-substituted succinic acid and/or salty reaction product(s) thereof in breathable films.

The present invention relates to a breathable film comprising at least one thermoplastic polymer and a surface-treated filler material product comprising a treatment layer comprising at least one mono-substituted succinic anhydride and/or at least one mono-substituted succinic acid and/or salty reaction product(s) thereof, a process for producing the same, and the use thereof. Furthermore, the present invention is directed to the use of a surface-treated filler material product comprising a treatment layer comprising at least one mono-substituted succinic anhydride and/or at least one mono-substituted succinic acid and/or salty reaction product(s) thereof in breathable films.

The object of the present invention is to provide a moisture-curable hot melt adhesive having high initial adhesive strength, long open time, excellent coating property and reduced stringing property. The present invention relates to a moisture-curable hot melt adhesive comprising (A) a urethane prepolymer having a terminal isocyanate group, (B) a metallocene-based polyolefin having a viscosity of 10,000 mPa.Math.s or less at a temperature of 170° C. and (C) a polyester-polyether copolymer.

The object of the present invention is to provide a moisture-curable hot melt adhesive having high initial adhesive strength, long open time, excellent coating property and reduced stringing property. The present invention relates to a moisture-curable hot melt adhesive comprising (A) a urethane prepolymer having a terminal isocyanate group, (B) a metallocene-based polyolefin having a viscosity of 10,000 mPa.Math.s or less at a temperature of 170° C. and (C) a polyester-polyether copolymer.

The object of the present invention is to provide a moisture-curable hot melt adhesive having high initial adhesive strength, long open time, excellent coating property and reduced stringing property. The present invention relates to a moisture-curable hot melt adhesive comprising (A) a urethane prepolymer having a terminal isocyanate group, (B) a metallocene-based polyolefin having a viscosity of 10,000 mPa.Math.s or less at a temperature of 170° C. and (C) a polyester-polyether copolymer.

The present invention relates to a polyethylene resin suitable for preparing moulded articles, such as caps and closures. The invention provides in particular a polyethylene resin comprising at least two polyethylene fractions A and B, wherein said polyethylene resin has a melt index (MI2), of at least 3.0 g/10 min to at most 5.5 g/10 min as measured according to ISO 1133, condition D, at 190° C. and under a load of 2.16 kg, and a density of at least 0.955 g/cm.sup.3 to at most 0.965 g/cm.sup.3 as measured according to ISO 1183 at 23° C., and a molecular weight distribution M.sub.w/M.sub.n which is at most 7.0, as determined by gel permeation chromatography, with M.sub.w being the weight-average molecular weight and M.sub.n being the number-average molecular weight; and wherein said polyethylene fraction A has a high load melt index (HLMI), as measured according to ISO 1133:1997 condition G at 190° C. and under a load of 21.6 kg, of at least 10.5 and a melt index (MI2) of at least 0.5 g/10 min to at most 1.5 g/10 min as measured according to ISO 1133, condition D, at 190° C. and under a load of 2.16 kg. The invention further relates to a process for preparing said polyethylene resin, to a cap or closure comprising said polyethylene, and to a process for producing such a cap or closure.

An injection molded article containing a resin composition containing a polyamide compound (A) and a resin (B), wherein the polyamide compound (A) contains from 25 to 50% by mol of a diamine unit, which contains a particular diamine unit, in an amount of 50% by mol or more; from 25 to 50% by mol of a dicarboxylic acid unit, which contains a particular dicarboxylic acid unit, in an amount of 50% by mol or more; and from 0.1 to 50% by mol of a particular constitutional unit.

An injection molded article containing a resin composition containing a polyamide compound (A) and a resin (B), wherein the polyamide compound (A) contains from 25 to 50% by mol of a diamine unit, which contains a particular diamine unit, in an amount of 50% by mol or more; from 25 to 50% by mol of a dicarboxylic acid unit, which contains a particular dicarboxylic acid unit, in an amount of 50% by mol or more; and from 0.1 to 50% by mol of a particular constitutional unit.

An injection molded article containing a resin composition containing a polyamide compound (A) and a resin (B), wherein the polyamide compound (A) contains from 25 to 50% by mol of a diamine unit, which contains a particular diamine unit, in an amount of 50% by mol or more; from 25 to 50% by mol of a dicarboxylic acid unit, which contains a particular dicarboxylic acid unit, in an amount of 50% by mol or more; and from 0.1 to 50% by mol of a particular constitutional unit.