A resin composition includes 100 parts by weight of a vinyl-containing polyphenylene ether resin and 45 parts by weight to 75 parts by weight of an inorganic filler combination, wherein the inorganic filler combination at least includes chemically synthesized silica and silicon nitride, and a weight ratio of the chemically synthesized silica and the silicon nitride is between 1:2 and 5:2. The resin composition or an article made therefrom may achieve improvement in at least one of the following properties: dielectric constant, dissipation factor, peel strength, soldering resistance, T300 thermal resistance, laminate appearance, sedimentation property, water absorption rate, and ratio of thermal expansion.

A resin composition includes: a polyphenylene ether compound; a curing agent reactable with the polyphenylene ether compound; and an inorganic filler including a boron nitride filler, wherein a particle size distribution of the inorganic filler, which is measured by a laser diffraction-based particle size distribution measuring method, has at least two peaks in a particle diameter range of 0.8 to 30.0 μm, the peaks including at least one peak in a particle diameter range of 0.8 to 5.0 μm and at least one peak in a particle diameter range of 5.0 to 30.0 μm.

A tackifier composition comprising at least one thermoplastic hydrocarbon resin and an antioxidant composition is provided; wherein a portion of the volatile organic compounds in the thermoplastic hydrocarbon resin has been removed; wherein the antioxidant composition comprises at least one primary antioxidant and at least one secondary antioxidant; and wherein the levels of individual volatile organic compound monitored in the tackifier composition are less than about 0.5 ppm as measured by GC/MS headspace analysis. Processes for producing the tackifier composition are also provided as well as adhesives comprising the tackifier compositions.

A novel vinyl chloride resin composition having exceptional transparency is provided. This resin composition comprises 3-15 parts by mass of a rubbery impact-absorbing material (B) for which the glass transition point in differential scanning calorimetry does not exceed 0° C., and 0.1-10 parts by mass of a lubricant (C) that satisfies (i)-(iv) below, the content amounts above being indicated relative to 100 parts by mass of a vinyl chloride resin (A) having a chlorine content of 55-75 mass %. (i) The melt viscosity at 200° C. is 5-5,000 mPa.Math.s (ii) The softening point is in the range of 60−180° C. (iii) The glass transition point (Tg) as measured in DSC is in the range of 0−100° C. (iv) A structural unit derived from at least one species selected from the group consisting of styrene, α-methylstyrene, indene, vinyl toluene, and isopropenyl toluene is contained in the molecule in an amount of 50-100 mass %

A novel vinyl chloride resin composition having exceptional transparency is provided. This resin composition comprises 3-15 parts by mass of a rubbery impact-absorbing material (B) for which the glass transition point in differential scanning calorimetry does not exceed 0° C., and 0.1-10 parts by mass of a lubricant (C) that satisfies (i)-(iv) below, the content amounts above being indicated relative to 100 parts by mass of a vinyl chloride resin (A) having a chlorine content of 55-75 mass %. (i) The melt viscosity at 200° C. is 5-5,000 mPa.Math.s (ii) The softening point is in the range of 60−180° C. (iii) The glass transition point (Tg) as measured in DSC is in the range of 0−100° C. (iv) A structural unit derived from at least one species selected from the group consisting of styrene, α-methylstyrene, indene, vinyl toluene, and isopropenyl toluene is contained in the molecule in an amount of 50-100 mass %

The present disclosure pertains to the technical field of resin composite materials and more particularly relates to resin compositions and articles made therefrom, including a resin film, a prepreg, a laminate or a printed circuit board, wherein the resin composition comprises a phosphorus-containing flame retardant of Formula (I) and a prepolymerized resin prepared at least from a divinylbenzene compound, an allyl resin and an acrylate resin. The resin compositions may be further used to make a resin film, a prepreg, a laminate or a printed circuit board, which has the properties of absence of branch-like pattern on laminate surface, high glass transition temperature, low ratio of thermal expansion, and high copper foil peeling strength.

The present disclosure pertains to the technical field of resin composite materials and more particularly relates to resin compositions and articles made therefrom, including a resin film, a prepreg, a laminate or a printed circuit board, wherein the resin composition comprises a phosphorus-containing flame retardant of Formula (I) and a prepolymerized resin prepared at least from a divinylbenzene compound, an allyl resin and an acrylate resin. The resin compositions may be further used to make a resin film, a prepreg, a laminate or a printed circuit board, which has the properties of absence of branch-like pattern on laminate surface, high glass transition temperature, low ratio of thermal expansion, and high copper foil peeling strength.

A photovoltaic device includes a photoactive material comprising a perovskite material and an interfacial layer comprising a cross-linked polymer that comprises a fullerene or fullerene derivative, a cross-linking agent, and one or more polymers selected from the group consisting of polystyrene, [6,6]-phenyl-C61-butyric acid methyl ester, poly(4-vinylphenol), [6,6]-phenyl-C61-butyric acid, and any combination thereof.

A photovoltaic device includes a photoactive material comprising a perovskite material and an interfacial layer comprising a cross-linked polymer that comprises a fullerene or fullerene derivative, a cross-linking agent, and one or more polymers selected from the group consisting of polystyrene, [6,6]-phenyl-C61-butyric acid methyl ester, poly(4-vinylphenol), [6,6]-phenyl-C61-butyric acid, and any combination thereof.

A cationic curable composition that generates a silanol group by light irradiation and is cured by heat, the cationic curable composition including: a cationic curable component; porous particles holding an aluminum chelate; and a photodegradable silicon compound that generates a silanol group by photodegradation.