Patent classifications
C08L35/06
THERMOPLASTIC RESIN COMPOSITION FOR HIGH-BRIGHTNESS UNPAINTED METALLIC MATERIAL AND A MOLDED ARTICLE INCLUDING THE SAME
Disclosed are a thermoplastic resin composition for a high-brightness unpainted metallic material that has an excellent impact strength, chemical resistance, and heat resistance and exhibits an excellent metallic texture, and a molded article including the same.
The thermoplastic resin composition suitably includes a polycarbonate resin; a first copolymer; a polyester resin; a copolymer having a core-shell structure and having, as a core, one or more rubber polymers selected from the group consisting of a diene-based rubber polymer, an acrylic rubber polymer, and a silicone-based rubber polymer; a heat resistant component including one or more selected from the group consisting of N-phenyl maleimide, a vinyl aromatic compound, and maleic anhydride; and metal particles.
THERMOPLASTIC RESIN COMPOSITION FOR HIGH-BRIGHTNESS UNPAINTED METALLIC MATERIAL AND A MOLDED ARTICLE INCLUDING THE SAME
Disclosed are a thermoplastic resin composition for a high-brightness unpainted metallic material that has an excellent impact strength, chemical resistance, and heat resistance and exhibits an excellent metallic texture, and a molded article including the same.
The thermoplastic resin composition suitably includes a polycarbonate resin; a first copolymer; a polyester resin; a copolymer having a core-shell structure and having, as a core, one or more rubber polymers selected from the group consisting of a diene-based rubber polymer, an acrylic rubber polymer, and a silicone-based rubber polymer; a heat resistant component including one or more selected from the group consisting of N-phenyl maleimide, a vinyl aromatic compound, and maleic anhydride; and metal particles.
MULTI-LAYER ABSORBENT PRODUCT AND PROCESS FOR PREPARING ABSORBENT LAYER
A multi-layer absorbent product is provided that includes a first layer that is either liquid permeable or liquid impermeable and a layer of a treated nonwoven, woven or knitted textile material or a treated textured plastic yarn. The layer of textured plastic yarn or of nonwoven, woven or knitted textile material has uniformly spaced deposits of a natural polymer crosslinked to a synthetic polymer in the absence of non-polymeric crosslinking agent, where each of the deposits is a continuous polymer network that covers the textile or plastic underneath the deposit and interpenetrates the network of textile fibers or of plastic pores acting as a scaffold to interconnect the polymer network with the fiber network or with the network of plastic pore walls. A process for preparing the layer of textile material or of textured plastic yarn with uniformly spaced deposits is also provided.
MULTI-LAYER ABSORBENT PRODUCT AND PROCESS FOR PREPARING ABSORBENT LAYER
A multi-layer absorbent product is provided that includes a first layer that is either liquid permeable or liquid impermeable and a layer of a treated nonwoven, woven or knitted textile material or a treated textured plastic yarn. The layer of textured plastic yarn or of nonwoven, woven or knitted textile material has uniformly spaced deposits of a natural polymer crosslinked to a synthetic polymer in the absence of non-polymeric crosslinking agent, where each of the deposits is a continuous polymer network that covers the textile or plastic underneath the deposit and interpenetrates the network of textile fibers or of plastic pores acting as a scaffold to interconnect the polymer network with the fiber network or with the network of plastic pore walls. A process for preparing the layer of textile material or of textured plastic yarn with uniformly spaced deposits is also provided.
SMA Resin Formulation
Resin compositions including at least two different inert fillers that are useful for preparing prepregs and laminates that are used in manufacturing printed circuit boards.
SMA Resin Formulation
Resin compositions including at least two different inert fillers that are useful for preparing prepregs and laminates that are used in manufacturing printed circuit boards.
SMA Resin Formulation
Resin compositions including at least two different inert fillers that are useful for preparing prepregs and laminates that are used in manufacturing printed circuit boards.
Thermoplastic Resin Composition and Molded Product Manufactured Therefrom
The present invention relates to a thermoplastic resin composition and a molded product produced therefrom, the thermoplastic resin composition including, based on 100 parts by weight of a base resin including (A1) 20 to 40 wt % of a butadiene-based rubber-modified aromatic vinyl-vinyl cyanide graft copolymer, (A2) 30 to 75 wt % of an aromatic vinyl-vinyl cyanide copolymer, and (B) 5 to 40 wt % of a polyamide resin, (C) 1 to 15 parts by weight of a polyether ester amide block copolymer, and (D) 0.5 to 10 parts by weight of an N-substituted maleimide-aromatic vinyl-maleic anhydride copolymer.
Thermoplastic Resin Composition and Molded Product Manufactured Therefrom
The present invention relates to a thermoplastic resin composition and a molded product produced therefrom, the thermoplastic resin composition including, based on 100 parts by weight of a base resin including (A1) 20 to 40 wt % of a butadiene-based rubber-modified aromatic vinyl-vinyl cyanide graft copolymer, (A2) 30 to 75 wt % of an aromatic vinyl-vinyl cyanide copolymer, and (B) 5 to 40 wt % of a polyamide resin, (C) 1 to 15 parts by weight of a polyether ester amide block copolymer, and (D) 0.5 to 10 parts by weight of an N-substituted maleimide-aromatic vinyl-maleic anhydride copolymer.
Use of polar additives for enhancing blowing agent solubility in polystyrene
Foamable polystyrene compositions with enhanced blowing agent solubility and methods of making such polystyrene compositions by incorporating a polar additive in styrenic polymer or copolymers.