A resin composition suitable for an optical compensation film, an optical compensation film using the same, which is excellent in the retardation characteristics and wavelength dispersion characteristics, and a production method of an optical compensation film. A resin composition containing, as resin components, from 30 to 99 wt % of a cellulose-based resin represented by the following formula (1) and from 1 to 70 wt % of a cinnamic acid ester copolymer:

##STR00001## where each of R.sub.1, R.sub.2 and R.sub.3 independently represents hydrogen or a substituent having a carbon number of 1 to 12.

It is intended to provide a polyphenylene ether resin composition that has favorable fluidity in molding while ensuring sufficiently high heat resistance and/or favorable mechanical properties. The present invention provides a polyphenylene ether resin composition comprising: 50% by mass or more and 99% by mass or less of a polyphenylene ether resin (A) having a reduced viscosity of 0.33 dl/g or more and 0.46 dl/g or less measured in an amount of 0.5 g/dl at 30° C. using a chloroform solvent; 0% by mass or more and 49% by mass or less of a polystyrene resin (B); and 1% by mass or more and 15% by mass or less of a styrene-acrylonitrile resin (C) having an acrylonitrile content of 16% by mass or more and 45% by mass or less.

It is intended to provide a polyphenylene ether resin composition that has favorable fluidity in molding while ensuring sufficiently high heat resistance and/or favorable mechanical properties. The present invention provides a polyphenylene ether resin composition comprising: 50% by mass or more and 99% by mass or less of a polyphenylene ether resin (A) having a reduced viscosity of 0.33 dl/g or more and 0.46 dl/g or less measured in an amount of 0.5 g/dl at 30° C. using a chloroform solvent; 0% by mass or more and 49% by mass or less of a polystyrene resin (B); and 1% by mass or more and 15% by mass or less of a styrene-acrylonitrile resin (C) having an acrylonitrile content of 16% by mass or more and 45% by mass or less.

The present invention relates to a process for the production of thermoplastic molding compositions, in particular styrene copolymer compositions, to a process for production of these, and also to use thereof. The thermoplastic molding compositions produced by a process of the invention offer improved temperature-resistance and mechanical properties, which have better flow properties than known molding compositions.

The present invention relates to a process for the production of thermoplastic molding compositions, in particular styrene copolymer compositions, to a process for production of these, and also to use thereof. The thermoplastic molding compositions produced by a process of the invention offer improved temperature-resistance and mechanical properties, which have better flow properties than known molding compositions.

The present invention relates to a process for the production of thermoplastic molding compositions, in particular styrene copolymer compositions, to a process for production of these, and also to use thereof. The thermoplastic molding compositions produced by a process of the invention offer improved temperature-resistance and mechanical properties, which have better flow properties than known molding compositions.

The present invention relates to a polarizing plate including a polarizer; and a protective layer formed on at least one surface of the polarizer, in which the protective layer is a cured product of a radical curable composition having a hydroxy value of 500 mg.Math.KOH/g or more, and an image display device including the same.

The present invention relates to a polarizing plate including a polarizer; and a protective layer formed on at least one surface of the polarizer, in which the protective layer is a cured product of a radical curable composition having a hydroxy value of 500 mg.Math.KOH/g or more, and an image display device including the same.

A thermosetting resin composition and a prepreg and a laminated board prepared therefrom. The thermosetting resin composition contains the following components in parts by weight: 50-150 parts of a cyanate; 30-100 parts of an epoxy resin; 5-70 parts of styrene-maleic anhydride; 20-100 parts of a polyphenyl ether; 30-100 parts of a halogen-free flame retardant; 0.05-5 parts of a curing accelerator; and 50-200 parts of a filler. The prepreg and laminated board prepared from the thermosetting resin composition have comprehensive performances such as a low dielectric constant, a low dielectric loss, an excellent flame retardance, heat resistance and moisture resistance, etc., and are suitable for use in a halogen-free high-frequency multilayer circuit board.

A thermosetting resin composition and a prepreg and a laminated board prepared therefrom. The thermosetting resin composition contains the following components in parts by weight: 50-150 parts of a cyanate; 30-100 parts of an epoxy resin; 5-70 parts of styrene-maleic anhydride; 20-100 parts of a polyphenyl ether; 30-100 parts of a halogen-free flame retardant; 0.05-5 parts of a curing accelerator; and 50-200 parts of a filler. The prepreg and laminated board prepared from the thermosetting resin composition have comprehensive performances such as a low dielectric constant, a low dielectric loss, an excellent flame retardance, heat resistance and moisture resistance, etc., and are suitable for use in a halogen-free high-frequency multilayer circuit board.