Provided is an optical article having a substrate, a primer layer generated by curing a polymerizable composition for forming the primer layer, and a photochromic layer containing a photochromic compound in this order, in which the polymerizable composition for forming the primer layer contains a component A: a polyisocyanate, a component B: a hydroxy group-containing polymerizable compound, and a component C: a polymerizable compound having a viscosity of 100 cP or less and being selected from the group consisting of (meth)acrylates and vinyl ethers.

The invention relates to a method of manufacturing an electronic device comprising the steps of: preparing a substrate comprising an electrically conductive layer; applying a conductive paste on the electrically conductive layer, wherein the conductive paste comprises 100 parts by weight of a metal powder, 5 to 20 parts by weight of a solvent and 0.01 to 5 parts by weight of a dispersant and wherein the dispersant is selected from the group consisting of allyl ether copolymer, polyhydroxy fatty acid and a mixture thereof; mounting an electrical component on the applied conductive paste; and heating the conductive paste to bond the electrically conductive layer and the electrical component.

The invention relates to a method of manufacturing an electronic device comprising the steps of: preparing a substrate comprising an electrically conductive layer; applying a conductive paste on the electrically conductive layer, wherein the conductive paste comprises 100 parts by weight of a metal powder, 5 to 20 parts by weight of a solvent and 0.01 to 5 parts by weight of a dispersant and wherein the dispersant is selected from the group consisting of allyl ether copolymer, polyhydroxy fatty acid and a mixture thereof; mounting an electrical component on the applied conductive paste; and heating the conductive paste to bond the electrically conductive layer and the electrical component.

There is provided a method for the production of a packaging material comprising a substrate and a gas barrier layer based on polyvinyl alcohol (PVOH), said method comprising the steps of—applying a coating composition of said PVOH dissolved in a first solvent onto said substrate to form a coating—subjecting the coating to a first drying step to form a dried PVOH-based coating on said substrate, contacting the dried PVOH-based coating with a crosslinking solution comprising a crosslinking agent in a second solvent, to effect crosslinking of the PVOH-based coating, and—subsequent to the contact with the crosslinking solution, subjecting the PVOH-based coating to a second drying step, forming the PVOH-based barrier layer on said substrate, with the proviso that if the crosslinking solution comprises PVOH, the amount of PVOH added by the crosslinking solution is less than 20% (by weight), such as less than 10% (by weight), of the amount of PVOH added by the coating composition.

There is provided a method for the production of a packaging material comprising a substrate and a gas barrier layer based on polyvinyl alcohol (PVOH), said method comprising the steps of—applying a coating composition of said PVOH dissolved in a first solvent onto said substrate to form a coating—subjecting the coating to a first drying step to form a dried PVOH-based coating on said substrate, contacting the dried PVOH-based coating with a crosslinking solution comprising a crosslinking agent in a second solvent, to effect crosslinking of the PVOH-based coating, and—subsequent to the contact with the crosslinking solution, subjecting the PVOH-based coating to a second drying step, forming the PVOH-based barrier layer on said substrate, with the proviso that if the crosslinking solution comprises PVOH, the amount of PVOH added by the crosslinking solution is less than 20% (by weight), such as less than 10% (by weight), of the amount of PVOH added by the coating composition.

Provided is a resin composition comprising a polymaleimide compound (A) represented by the following general formula (1), a modified polyphenylene ether (B) having a terminal modified with a substituent containing a carbon-carbon unsaturated double bond, and a filler (C):

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wherein a plurality of R each independently represent a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a phenyl group; and n is an average value and represents 1<n5.

Provided is a resin composition comprising a polymaleimide compound (A) represented by the following general formula (1), a modified polyphenylene ether (B) having a terminal modified with a substituent containing a carbon-carbon unsaturated double bond, and a filler (C):

##STR00001##

wherein a plurality of R each independently represent a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a phenyl group; and n is an average value and represents 1<n5.

A heat curable resin composition which allows voids to be removed by heating and vacuum operation after reflow soldering, and a circuit board with an electronic component mounted thereon are provided. The heat curable resin composition of the present embodiment includes a liquid epoxy resin, a hemiacetal ester derived from monocarboxylic acid and polyvinyl ether, a curing agent, and a filler.

A heat curable resin composition which allows voids to be removed by heating and vacuum operation after reflow soldering, and a circuit board with an electronic component mounted thereon are provided. The heat curable resin composition of the present embodiment includes a liquid epoxy resin, a hemiacetal ester derived from monocarboxylic acid and polyvinyl ether, a curing agent, and a filler.

A heat curable resin composition which allows voids to be removed by heating and vacuum operation after reflow soldering, and a circuit board with an electronic component mounted thereon are provided. The heat curable resin composition of the present embodiment includes a liquid epoxy resin, a hemiacetal ester derived from monocarboxylic acid and polyvinyl ether, a curing agent, and a filler.