A thermoplastic resin composition according to the present invention comprises: a rubber-modified aromatic vinyl-based copolymer resin; an aliphatic polyamide resin; a poly(ether ester amide) block copolymer; a modified polyolefin resin; and a heat resistant vinyl-based copolymer resin. The thermoplastic resin composition exhibits excellent anti-static properties, heat resistance and mechanical properties.

A thermoplastic resin composition according to the present invention comprises: a rubber-modified aromatic vinyl-based copolymer resin; an aliphatic polyamide resin; a poly(ether ester amide) block copolymer; a modified polyolefin resin; and a heat resistant vinyl-based copolymer resin. The thermoplastic resin composition exhibits excellent anti-static properties, heat resistance and mechanical properties.

An adhesive composition is described comprising unpolymerized cyclic olefin, a ring opening metathesis polymerization (ROMP) catalyst or precatalyst thereof, and one or more adhesion promoter polymers. In one embodiment, the adhesion promoter is a polyolefin comprising maleic anhydride or silicon-containing moieties. In one embodiment, a combination of at least one polymeric polyisocyanate and at least one polyolefin comprising maleic anhydride or silicon-containing moieties provides a synergistic improvement. In another embodiment, a polymeric polyisocyanate adhesion promoter comprising oxygen atoms in the backbone has been found useful for bonding substrates such as polyamide, polyether ether ketone, or polyether imide. Also described are methods of bonding a substrate and articles, such as an electric battery cold plate assembly.

An adhesive composition is described comprising unpolymerized cyclic olefin, a ring opening metathesis polymerization (ROMP) catalyst or precatalyst thereof, and one or more adhesion promoter polymers. In one embodiment, the adhesion promoter is a polyolefin comprising maleic anhydride or silicon-containing moieties. In one embodiment, a combination of at least one polymeric polyisocyanate and at least one polyolefin comprising maleic anhydride or silicon-containing moieties provides a synergistic improvement. In another embodiment, a polymeric polyisocyanate adhesion promoter comprising oxygen atoms in the backbone has been found useful for bonding substrates such as polyamide, polyether ether ketone, or polyether imide. Also described are methods of bonding a substrate and articles, such as an electric battery cold plate assembly.

Disclosed are a resin composition comprising 20 to 50 mass % of a polyphenylene ether-based resin (a), 0.1 to 9 mass % of a polyphenylene ether-based resin modified with an unsaturated carboxylic acid or acid anhydride thereof (b), 15 to 50 mass % of a homopolystyrene (c), 1 to 25 mass % of one or more selected from the group consisting of a hydrogenated block copolymer (d-1) and a rubber-modified polystyrene (d-2), and 5 to 35 mass % of glass fibers (e) which are surface-treated, a resin composition comprising 20 to 50 mass % of a polyphenylene ether-based resin (a), 15 to 50 mass % of a homopolystyrene (c), 5 to 35 mass % of glass fibers (e), and 0.01 to 1 mass % of compounds (f), a method of producing the same, a molded article, and a mechanical component and housing.

Disclosed are a resin composition comprising 20 to 50 mass % of a polyphenylene ether-based resin (a), 0.1 to 9 mass % of a polyphenylene ether-based resin modified with an unsaturated carboxylic acid or acid anhydride thereof (b), 15 to 50 mass % of a homopolystyrene (c), 1 to 25 mass % of one or more selected from the group consisting of a hydrogenated block copolymer (d-1) and a rubber-modified polystyrene (d-2), and 5 to 35 mass % of glass fibers (e) which are surface-treated, a resin composition comprising 20 to 50 mass % of a polyphenylene ether-based resin (a), 15 to 50 mass % of a homopolystyrene (c), 5 to 35 mass % of glass fibers (e), and 0.01 to 1 mass % of compounds (f), a method of producing the same, a molded article, and a mechanical component and housing.

Disclosed is a thermoplastic resin composition, a method of preparing the same, and a molded article manufactured using the same, including a thermoplastic resin composition including 100 parts by weight of a base resin including a vinyl cyanide compound-conjugated diene compound-aromatic vinyl compound graft copolymer (A); a vinyl cyanide compound-conjugated diene compound-aromatic vinyl compound copolymer (B); an acrylate-aromatic vinyl compound-vinyl cyanide compound graft copolymer (C); a vinyl cyanide compound-aromatic vinyl compound copolymer (D); and a branched vinyl cyanide compound-aromatic vinyl compound copolymer (E) and a high-density polyethylene resin (F), a method of preparing the thermoplastic resin composition, and a molded article manufactured using the thermoplastic resin composition.

Disclosed is a thermoplastic resin composition, a method of preparing the same, and a molded article manufactured using the same, including a thermoplastic resin composition including 100 parts by weight of a base resin including a vinyl cyanide compound-conjugated diene compound-aromatic vinyl compound graft copolymer (A); a vinyl cyanide compound-conjugated diene compound-aromatic vinyl compound copolymer (B); an acrylate-aromatic vinyl compound-vinyl cyanide compound graft copolymer (C); a vinyl cyanide compound-aromatic vinyl compound copolymer (D); and a branched vinyl cyanide compound-aromatic vinyl compound copolymer (E) and a high-density polyethylene resin (F), a method of preparing the thermoplastic resin composition, and a molded article manufactured using the thermoplastic resin composition.

Disclosed is a thermoplastic resin composition having excellent compatibility between a base resin and additives that may prevent aggregation of a metal pigment, and a molded article including the same. Also disclosed is a molded article manufactured using the thermoplastic resin composition, which may reduce flow marks on a metallic surface, and thus appearance and gloss may be excellent, injection quality and antistatic properties may be excellent, and the molded article may be widely used in various fields such as electronics.

Disclosed is a thermoplastic resin composition having excellent compatibility between a base resin and additives that may prevent aggregation of a metal pigment, and a molded article including the same. Also disclosed is a molded article manufactured using the thermoplastic resin composition, which may reduce flow marks on a metallic surface, and thus appearance and gloss may be excellent, injection quality and antistatic properties may be excellent, and the molded article may be widely used in various fields such as electronics.