Patent classifications
C08L51/06
Thermoplastic resin composition and molded article manufactured therefrom
A thermoplastic resin composition of the present invention comprises: a polycarbonate resin; a rubber-modified vinyl-based graft copolymer; a large particle size rubbery polymer having an average particle size of about 400 to about 1,500 nm; an aromatic vinyl-based copolymer resin; a phosphorus-based flame retardant; talc; wollastonite; a maleic anhydride grafted rubbery polymer; and a black pigment. The thermoplastic resin composition is superior in terms of adhesion to metal, strength, flame retardancy, fluidity, and appearance.
Thermoplastic resin composition and molded article manufactured therefrom
A thermoplastic resin composition of the present invention comprises: a polycarbonate resin; a rubber-modified vinyl-based graft copolymer; a large particle size rubbery polymer having an average particle size of about 400 to about 1,500 nm; an aromatic vinyl-based copolymer resin; a phosphorus-based flame retardant; talc; wollastonite; a maleic anhydride grafted rubbery polymer; and a black pigment. The thermoplastic resin composition is superior in terms of adhesion to metal, strength, flame retardancy, fluidity, and appearance.
POLYPROPYLENE COMPOSITION, PREPARATION METHOD AND USE THEREOF
A polypropylene composition comprising the following components in parts by weight: 40-99 parts of a polypropylene resin; 15-30 parts of an ethylene-α olefin copolymer; 0.2-1 part of an antimicrobial agent; and 1-3 parts of a polypropylene grafted polydimethylsiloxane is provided. By controlling a melt index of an elastomer, distribution of the modified polydimethylsiloxane and antimicrobial agent can be improved, thus improving antimicrobial and stain-resistant effects of the polypropylene composition.
POLYPROPYLENE COMPOSITION, PREPARATION METHOD AND USE THEREOF
A polypropylene composition comprising the following components in parts by weight: 40-99 parts of a polypropylene resin; 15-30 parts of an ethylene-α olefin copolymer; 0.2-1 part of an antimicrobial agent; and 1-3 parts of a polypropylene grafted polydimethylsiloxane is provided. By controlling a melt index of an elastomer, distribution of the modified polydimethylsiloxane and antimicrobial agent can be improved, thus improving antimicrobial and stain-resistant effects of the polypropylene composition.
RESIN COMPOSITION, METHOD FOR MANUFACTURING RESIN COMPOSITION, MOLDED OBJECT, MULTILAYER STRUCTURE, AND PACKAGING BODY
A resin composition containing: a thermoplastic resin (A) that does not contain a polar group; a thermoplastic resin (B) that contains a polar group; an ethylene-vinyl alcohol copolymer (C) having an ethylene content of 20 to 60 mol %; acetic acid and/or a salt thereof (D); an aliphatic carboxylic acid (E) having 3 or more carbon atoms; and an aliphatic carboxylic acid metal salt (F) that is a metal salt of the aliphatic carboxylic acid (E), wherein the content of (A) is 66 to 99 wt. % with respect to the total sum of contents of the resin composition and the content of (C) is 0.1 to 25 wt. % with respect to the total sum of the contents of the resin composition.
RESIN COMPOSITION, METHOD FOR MANUFACTURING RESIN COMPOSITION, MOLDED OBJECT, MULTILAYER STRUCTURE, AND PACKAGING BODY
A resin composition containing: a thermoplastic resin (A) that does not contain a polar group; a thermoplastic resin (B) that contains a polar group; an ethylene-vinyl alcohol copolymer (C) having an ethylene content of 20 to 60 mol %; acetic acid and/or a salt thereof (D); an aliphatic carboxylic acid (E) having 3 or more carbon atoms; and an aliphatic carboxylic acid metal salt (F) that is a metal salt of the aliphatic carboxylic acid (E), wherein the content of (A) is 66 to 99 wt. % with respect to the total sum of contents of the resin composition and the content of (C) is 0.1 to 25 wt. % with respect to the total sum of the contents of the resin composition.
POLYAMIDE COMPOSITIONS HAVING A HIGH MODULUS AND A LOW DIELECTRIC CONSTANT AND USE THEREOF
A mixture of solid and hollow glass reinforcers with an alloy of at least one polyamide and of at least one polyolefin, the mixture of solid and hollow glass reinforcers including from 5% to 60% by weight of hollow glass beads relative to the sum of the solid and hollow glass reinforcers, the alloy-mixture proportions being from more than 50% to 75% of said mixture of solid and hollow glass reinforcers, to prepare a composition having a modulus, when dry at 20° C., of from 5 GPa to less than 8 GPa as measured according to ASTM D-2520-13, at a frequency of at least 1 GHz, at 23° C., under 50% RH.
POLYAMIDE COMPOSITIONS HAVING A HIGH MODULUS AND A LOW DIELECTRIC CONSTANT AND USE THEREOF
A mixture of solid and hollow glass reinforcers with an alloy of at least one polyamide and of at least one polyolefin, the mixture of solid and hollow glass reinforcers including from 5% to 60% by weight of hollow glass beads relative to the sum of the solid and hollow glass reinforcers, the alloy-mixture proportions being from more than 50% to 75% of said mixture of solid and hollow glass reinforcers, to prepare a composition having a modulus, when dry at 20° C., of from 5 GPa to less than 8 GPa as measured according to ASTM D-2520-13, at a frequency of at least 1 GHz, at 23° C., under 50% RH.
POLYAMIDE COMPOSITIONS HAVING A HIGH MODULUS AND A LOW DIELECTRIC CONSTANT AND USE THEREOF
A mixture of solid and hollow glass reinforcers with an alloy of at least one polyamide and of at least one polyolefin, the mixture of solid and hollow glass reinforcers including from 5% to 60% by weight of hollow glass beads relative to the sum of the solid and hollow glass reinforcers, the alloy-mixture proportions being from more than 50% to 75% of said mixture of solid and hollow glass reinforcers, to prepare a composition having a modulus, when dry at 20° C., of from 5 GPa to less than 8 GPa as measured according to ASTM D-2520-13, at a frequency of at least 1 GHz, at 23° C., under 50% RH.
MOLDING COMPOSITIONS BASED ON POLYAMIDE, ON CARBON FIBERS AND ON HOLLOW GLASS BEADS AND USE THEREOF
Molding composition, including by weight: (A) from 38 to 79.5% of at least one semi-crystalline aliphatic polyamide with the exclusion of PA6 and PA66, (B) from 10 to 20% of carbon fibres, (C) from 10 to 20% of hollow glass beads, (D) from 5.5 to 10% of at least one impact modifier having a flexural modulus of less than 200 MPa, in particular less than 100 MPa, as measured according to standard ISO 178: 2010, at 23° C., and (E) from 0.1 to 1% by weight of at least one additive, the sum of the proportions of each constituent (A)+(B)+(C)+(D)+(E) of the composition being equal to 100%.