Patent classifications
C08L51/08
PHOTOPOLYMER COMPOSITION FOR HOLOGRAM FORMATION, HOLOGRAM RECORDING MEDIUM AND OPTICAL ELEMENTS
The present invention relates to a photopolymer composition for hologram formation, comprising: a polymer matrix comprising a siloxane-based polymer and a (meth)acrylate polymer containing one or more reactive functional groups in the side chains, a holographic recording method, and an optical element.
RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN
A resist composition containing a resin component having a structural unit represented by general formula (a0-1), and a compound represented by general formula (b1). In general formula (a0-1), R is a hydrogen atom, an alkyl group, or a halogenated alkyl group, Va.sup.1 is a divalent hydrocarbon group, n.sub.a1 represents an integer of 0 to 2, Ya.sup.0 is a carbon atom, Xa.sup.0 is a group forming a monocyclic aliphatic hydrocarbon group together with Ya.sup.0, and Ra.sup.00 is an aromatic hydrocarbon group or a specific unsaturated hydrocarbon group. In general formula (b1), R.sup.b1 represents a cyclic hydrocarbon group, Y.sup.b1 represents a divalent linking group containing an ester bond, V.sup.b1 represents an alkylene group, a fluorinated alkylene group, or a single bond, and M.sup.m+ is an m-valent organic cation.
##STR00001##
RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN
A resist composition containing a resin component having a structural unit represented by general formula (a0-1), and a compound represented by general formula (b1). In general formula (a0-1), R is a hydrogen atom, an alkyl group, or a halogenated alkyl group, Va.sup.1 is a divalent hydrocarbon group, n.sub.a1 represents an integer of 0 to 2, Ya.sup.0 is a carbon atom, Xa.sup.0 is a group forming a monocyclic aliphatic hydrocarbon group together with Ya.sup.0, and Ra.sup.00 is an aromatic hydrocarbon group or a specific unsaturated hydrocarbon group. In general formula (b1), R.sup.b1 represents a cyclic hydrocarbon group, Y.sup.b1 represents a divalent linking group containing an ester bond, V.sup.b1 represents an alkylene group, a fluorinated alkylene group, or a single bond, and M.sup.m+ is an m-valent organic cation.
##STR00001##
RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN, COMPOUND, AND ACID GENERATOR
A resist composition which generates an acid upon exposure and changes a solubility in a developing solution under an action of the acid, the resist composition containing a base material component whose solubility in the developing solution changes under the action of an acid and an acid generator represented by general formula (b1). In general formula (b-1), R.sup.b1 represents an aromatic hydrocarbon group having at least one alkyl group having 3 or more carbon atoms as a substituent, Y.sup.b1 represents a divalent linking group containing an ester bond (—C(═O)—O— or —O—C(═O)—), V.sup.b1 represents an alkylene group, a fluorinated alkylene group, or a single bond, m is an integer of 1 or more, and M.sup.m+ represents an m-valent organic cation.
R.sup.b1—Y.sup.b1—V.sup.b1—CF.sub.2—SO.sub.3.sup.−(M.sup.m+).sub.1/m (b1)
RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN, COMPOUND, AND ACID GENERATOR
A resist composition which generates an acid upon exposure and changes a solubility in a developing solution under an action of the acid, the resist composition containing a base material component whose solubility in the developing solution changes under the action of an acid and an acid generator represented by general formula (b1). In general formula (b-1), R.sup.b1 represents an aromatic hydrocarbon group having at least one alkyl group having 3 or more carbon atoms as a substituent, Y.sup.b1 represents a divalent linking group containing an ester bond (—C(═O)—O— or —O—C(═O)—), V.sup.b1 represents an alkylene group, a fluorinated alkylene group, or a single bond, m is an integer of 1 or more, and M.sup.m+ represents an m-valent organic cation.
R.sup.b1—Y.sup.b1—V.sup.b1—CF.sub.2—SO.sub.3.sup.−(M.sup.m+).sub.1/m (b1)
Curable composition for dental retraction
The invention relates to a curable composition for dental retraction comprising a resin matrix comprising at least one polyorganosiloxane with at least two olefinically unsaturated groups as component A1, at least one organohydrogenpolysiloxane as component A2, optionally at least one vinyl functional QM silicone component as component A3, at least one alkylsiloxane having at least one carbinol, silanol, or alkoxy moiety as component B, optionally surfactant(s) as component E, optionally additive(s) as component F, a filler system comprising filler(s) as component D, a catalyst system comprising addition cure catalyst component C-A suitable to cure components A1 and A2, condensation cure catalyst component C-B suitable to cure component B, the curable composition being provided as a kit of part comprising a Catalyst Part I and a Base Part II the Catalyst Part I comprising components C-A, C-B, A1, the Base Part II comprising components A2, A1, B, wherein each of components D, E and F and A3, if present, can be present either in the Catalyst Part I or the Base Part II or the Catalyst Part I and the Base Part II, and wherein component B is present in an amount of 6 wt. % or more with respect to the whole composition.
Branched peg molecules and related compositions and methods
Disclosed are branched PEG molecules, including branched PEG-lipids and branched-PEG proteins, as well as related compositions and methods for making branched PEG molecules. Also disclosed are related compositions, systems, and methods for in vivo delivery of therapeutic and diagnostic agents.
COMPOSTABLE OXYGEN BARRIER COMPRISING A BIODEGRADABLE POLYMER MATRIX AND BIOCARBON
A biodegradable composite comprising a polymeric matrix including but not limited to poly lactide (PLA), poly (butylene succinate) 20 (PBS), poly(butylene succinate adipate) (PBSA), including bio-based PBSA (BioPBSA), poly(butylene adipate-co-terephthalate) (PBAT), polycaprolactone (PCL), polyhydroxyalkanoate (PHA(s)), poly(3-hydroxy)butyrate (PHB), poly(3-hydroxy-butyrate-hydroxyvalerate) (PHBV), copolyester of the monomers 1.4-butanediol, adipic acid and terephthalic acid (Ecoflex™) and polypropylene carbonate (PPC), and biocarbon, a.k.a. biochar or pyrolyzed biomass as a sustainable filler. The biodegradable composite achieves high oxygen barrier with balanced water barrier. Also, a method of manufacturing the biodegradable composite and articles of manufacturing comprising the biodegradable composite. The articles of manufacturing have application in limiting gas permeation into a package and extending shelf life of a material.
COMPOSTABLE OXYGEN BARRIER COMPRISING A BIODEGRADABLE POLYMER MATRIX AND BIOCARBON
A biodegradable composite comprising a polymeric matrix including but not limited to poly lactide (PLA), poly (butylene succinate) 20 (PBS), poly(butylene succinate adipate) (PBSA), including bio-based PBSA (BioPBSA), poly(butylene adipate-co-terephthalate) (PBAT), polycaprolactone (PCL), polyhydroxyalkanoate (PHA(s)), poly(3-hydroxy)butyrate (PHB), poly(3-hydroxy-butyrate-hydroxyvalerate) (PHBV), copolyester of the monomers 1.4-butanediol, adipic acid and terephthalic acid (Ecoflex™) and polypropylene carbonate (PPC), and biocarbon, a.k.a. biochar or pyrolyzed biomass as a sustainable filler. The biodegradable composite achieves high oxygen barrier with balanced water barrier. Also, a method of manufacturing the biodegradable composite and articles of manufacturing comprising the biodegradable composite. The articles of manufacturing have application in limiting gas permeation into a package and extending shelf life of a material.
SILICONE-MODIFIED POLYIMIDE RESIN COMPOSITION OF SOLVENT FREE TYPE
Disclosed herein is a silicone-modified polyimide resin composition of solvent free type. The composition is suitable for use as an adhesive and a coating material which are capable of hardening upon irradiation with ultraviolet rays and/or visible rays. Also, it is saved from drooling even in the case of light filling with an inorganic compound and it is saved from bubble entrapment and nonuniformity at the time of application with heavy filling. It further exhibits good moldability due to its thixotropic properties. Moreover, it exhibits improved adhesion to polyolefin resins without impairing the past properties. Finally, it gives rise to a cured product which is not excessively hard, with a low elastic modulus, despite filling with an inorganic compound. The composition of the present invention includes components (A) to (B) listed below and is characterized by being fluid at 25° C. and free of solvent: (A) silicone-modified polyimide resin; (B) polymerizable compound; (C) polymerization initiator, (D) hydrophobic fumed silica; and (E) adhesion auxiliary agent.